One object of the present disclosure is to flexibly and promptly save a processing solution in an apparatus for processing a substrate. An apparatus for processing a substrate is configured to change over a transfer time table between an ordinary mode that has a maximum throughput of the apparatus for processing the substrate and a processing solution saving mode that saves a processing solution in at least one of processing tanks. The apparatus for processing the substrate determines whether or not the apparatus for processing the substrate is in a slack period that has a small demand output by the apparatus for processing the substrate, based on a rate-controlling point that limits a processing speed of the entire apparatus for processing the substrate, and sets the transfer time table to the processing solution saving mode when it is determined that the apparatus for processing the substrate is in the slack period, while setting the transfer time table to the ordinary mode when it is determined that the apparatus for processing the substrate is not in the slack period.

A portable electroplating system with components integrated into a complete system, rather than separated and disjointed. A single electroplating system can be self-contained to include all necessary rectifiers, tanks, cleaning functionalities, and other helpful or necessary items. By using smaller components than conventional electroplating systems, the system can allow for more economical use of chemicals, solutions, and energy and can be utilized more efficiently towards a unique shape or size of object to be plated. The system can also include wheels to make the system portable. A rack management system can be employed to move objects from one location to another within the system.

A portable electroplating system with components integrated into a complete system, rather than separated and disjointed. A single electroplating system can be self-contained to include all necessary rectifiers, tanks, cleaning functionalities, and other helpful or necessary items. By using smaller components than conventional electroplating systems, the system can allow for more economical use of chemicals, solutions, and energy and can be utilized more efficiently towards a unique shape or size of object to be plated. The system can also include wheels to make the system portable. A rack management system can be employed to move objects from one location to another within the system.

Compositions suitable for use in an electrolytic cell for producing aluminum are provided. The compositions can contain a powder blend of boron oxide, a titanium dioxide, aluminum, and titanium diboride. The powder blend can be compacted into tiles and arranged as a cathode surface. The boron oxide and the titanium dioxide in the tiles can be made to react under low temperature molten aluminum to produce titanium diboride in situ. The reaction yields a dense dimensionally stable wettable cathode substrate that can reduce the power consumption in the aluminum electrowinning process.

An immersion-type surface treatment tank includes a treatment tank body including: a single tank internal space elongated in a plan view, and a nozzle that ejects an electrodeposition paint into the tank internal space. The treatment tank body includes: a first tank inner side surface extending along a longitudinal direction of the tank internal space; a second tank inner side surface facing the first tank inner side surface and extending along the longitudinal direction; and a rectifying plate that is formed halfway in the longitudinal direction and changes a flow direction of the electrodeposition paint such that the electrodeposition paint flowing horizontally along the first tank inner side surface is directed toward the second tank inner side surface. The rectifying plate changes the flow direction of the electrodeposition paint, thereby forming, in the tank internal space, at least two horizontal swirl flows adjacent to each other in the longitudinal direction.

Provided are an anode holder capable of reducing consumption of an additive in a plating apparatus, and a plating apparatus. An anode holder for holding an anode for use in a plating apparatus is provided, and the anode holder includes an inner space formed in the anode holder, to house the anode, a mask including a plurality of holes, and configured to cover a front surface of the inner space, and a diaphragm, at least part of the diaphragm being fixed to the mask in a region of the mask that covers the front surface of the inner space.

Provided are an anode holder capable of reducing consumption of an additive in a plating apparatus, and a plating apparatus. An anode holder for holding an anode for use in a plating apparatus is provided, and the anode holder includes an inner space formed in the anode holder, to house the anode, a mask including a plurality of holes, and configured to cover a front surface of the inner space, and a diaphragm, at least part of the diaphragm being fixed to the mask in a region of the mask that covers the front surface of the inner space.

The present invention provides a composite processing method and device for a texture on an inner surface of a bearing shell of a radial sliding bearing. A surface of a workpiece to be processed is processed by laser to obtain a micron-level texture, an obtained workpiece with the micron-level texture on a surface is placed on a compression device, and the workpiece with the micron-level texture on the surface is subjected to an electro-deposition reaction to obtain a workpiece with a nano-level texture on a surface. The processing device includes an inner spin-printing electrode electrochemical deposition system, a laser irradiation system and a motion control system. The inner spin-printing electrode electrochemical deposition system includes the inner spin-printing electrode, a direct current power supply, the bearing shell and a compression roller.

An improved apparatus for adding powder comprising at least a metal, such as copper, to a plating solution, and supplying the plating solution to a plating tank is disclosed. The apparatus includes a hopper having an inlet which is connectable to a powder conduit of a powder container holding the powder therein, a feeder which communicates with a bottom opening of the hopper, a motor coupled to the feeder, and a plating-solution tank coupled to an outlet of the feeder and configured to dissolve the powder in the plating solution.

An improved apparatus for adding powder comprising at least a metal, such as copper, to a plating solution, and supplying the plating solution to a plating tank is disclosed. The apparatus includes a hopper having an inlet which is connectable to a powder conduit of a powder container holding the powder therein, a feeder which communicates with a bottom opening of the hopper, a motor coupled to the feeder, and a plating-solution tank coupled to an outlet of the feeder and configured to dissolve the powder in the plating solution.