A plating apparatus and an operation method thereof are provided. The plating apparatus includes: a tank body including at least one side wall, the at least one side wall being provided with an opening extending from the inside to the outside of the tank body, and the tank body being configured to accommodate a plating solution; and a fixing device configured to fix the substrate at the opening of the side wall. The operation method of the plating apparatus includes: placing the substrate on an outer side of the side wall and at the position of the opening, and operating the fixing device to fix the substrate; and performing plating treatment on the substrate.

A plating apparatus and an operation method thereof are provided. The plating apparatus includes: a tank body including at least one side wall, the at least one side wall being provided with an opening extending from the inside to the outside of the tank body, and the tank body being configured to accommodate a plating solution; and a fixing device configured to fix the substrate at the opening of the side wall. The operation method of the plating apparatus includes: placing the substrate on an outer side of the side wall and at the position of the opening, and operating the fixing device to fix the substrate; and performing plating treatment on the substrate.

A device for measuring electrical properties of electrical contacts within an electroplating apparatus has a disc-shaped structure like that of a wafer. Multiple conductive pads are formed to collectively circumscribe an outer periphery of the disc-shaped structure. Adjacently positioned ones of the conductive pads are electrically isolated from each other. The device includes a current source that supplies electric current at a first terminal and sinks electric current at a second terminal. The device includes measurement circuitry, having first and second input terminals, that determines a value of an electrical parameter based on signals present at the first and second input terminals. The device includes switching circuitry for connecting selected ones of the conductive pads to the first and second terminals of the current source and to the first and second input terminals of the measurement circuitry at a given time. The device also includes an onboard power supply.

A metal workpiece, such as a wheel, and a method of providing an enhanced corrosion resistant surface coating on an exposed surface of a metal or alloy substrate (such as magnesium). A corrosion resistance basecoat is formed, including generating an oxide layer, and applying a first primer coating onto at least a portion of the oxide layer. The method may further include identifying highest corrosion prone areas on the substrate and designing a support rack that avoids contact with these corrosion prone areas. The method also includes forming a topcoat over at least a portion of the basecoat, by applying a second primer coating onto at least a portion of the first primer coating and depositing a sputtered metallic film onto the second primer coating using a physical vapor deposition technique. A clear coat layer may be applied over the metallic film.

A metal workpiece, such as a wheel, and a method of providing an enhanced corrosion resistant surface coating on an exposed surface of a metal or alloy substrate (such as magnesium). A corrosion resistance basecoat is formed, including generating an oxide layer, and applying a first primer coating onto at least a portion of the oxide layer. The method may further include identifying highest corrosion prone areas on the substrate and designing a support rack that avoids contact with these corrosion prone areas. The method also includes forming a topcoat over at least a portion of the basecoat, by applying a second primer coating onto at least a portion of the first primer coating and depositing a sputtered metallic film onto the second primer coating using a physical vapor deposition technique. A clear coat layer may be applied over the metallic film.

In a film forming method, in a state where a metal solution is sealed in a first accommodation chamber of a housing with a solid electrolyte membrane and a fluid is sealed in a second accommodation chamber of a placing table with a thin film, a substrate is placed on the placing table and the placing table and the housing are moved relative to each other to cause the substrate to be interposed between the solid electrolyte membrane and the thin film, the solid electrolyte membrane and the thin film are pressed against the substrate interposed therebetween to cause the solid electrolyte membrane and the thin film to conform to a surface and a rear surface of the substrate, thereby forming a metal film.

An etcher comprises a bath, a plurality of blades, and a tunnel. The bath includes a first electrode at a first end and a second electrode at a second end. The plurality of blades is configured to fit in the bath. At least one blade of the plurality of blades holds a wafer. At least one tunnel is configured to fit between adjacent blades of the plurality of blades in the bath.

An etcher comprises a bath, a plurality of blades, and a tunnel. The bath includes a first electrode at a first end and a second electrode at a second end. The plurality of blades is configured to fit in the bath. At least one blade of the plurality of blades holds a wafer. At least one tunnel is configured to fit between adjacent blades of the plurality of blades in the bath.

Provided is a technique for appropriately handling a substrate holder depending on a use state of the substrate holder. The substrate holder for holding a substrate that is a plating target in a plating apparatus is suggested. The substrate holder includes an RFID tag, and the RFID tag includes a storage region in which a use attribute is stored, the use attribute including an attribute indicating a state of being used for plating processing.

Provided is a technique for appropriately handling a substrate holder depending on a use state of the substrate holder. The substrate holder for holding a substrate that is a plating target in a plating apparatus is suggested. The substrate holder includes an RFID tag, and the RFID tag includes a storage region in which a use attribute is stored, the use attribute including an attribute indicating a state of being used for plating processing.