An anodic-oxidation equipment for forming a porous layer on a substrate to be treated, including: an electrolytic bath filled with an electrolytic solution; an anode and a cathode disposed in the electrolytic solution; and a power supply for applying current between the anode and the cathode in the electrolytic solution, wherein the anode is the substrate to be treated, and the cathode is a silicon substrate having a surface on which a nitride film is formed. This provides a cathode material in anodic-oxidation for forming porous silicon by an electrochemical reaction in an HF solution, the cathode material having a resistance to electrochemical reaction in an HF solution and no metallic contamination, etc., and furthermore, being less expensive than a conventional cathode material. Furthermore, high-quality porous silicon is provided at a lower cost than has been conventional.

The technology described herein sets forth methods of making low stress or stress free coatings and articles using electrodeposition without the use of stress reducing agents in the deposition process. The articles and coatings can be layered or nanolayered wherein in the microstructure/nanostructure and composition of individual layers can be independently modulated.

The technology described herein sets forth methods of making low stress or stress free coatings and articles using electrodeposition without the use of stress reducing agents in the deposition process. The articles and coatings can be layered or nanolayered wherein in the microstructure/nanostructure and composition of individual layers can be independently modulated.

The slow speed of conventional selective electroplating and L-PED (and further requirement of a series of masks in the case of selective electroplating) necessary to generate a metallic three-dimensional object makes conventional selective electroplating and L-PED not viable for mass manufacturing metallic three-dimensional objects. The presently disclosed technology generally utilizes electroplating and L-PED technologies with a screen electroplating process. The screen electroplating process disclosed herein is capable of achieving a faster throughput and a lower workpiece temperature than traditional 3D printing processes can provide, particularly traditional metal 3D printing processes. As a result, the presently disclosed screen electroplating process is able to achieve much faster results in printing a complex three-dimensional metallic structure using electroplating.

The slow speed of conventional selective electroplating and L-PED (and further requirement of a series of masks in the case of selective electroplating) necessary to generate a metallic three-dimensional object makes conventional selective electroplating and L-PED not viable for mass manufacturing metallic three-dimensional objects. The presently disclosed technology generally utilizes electroplating and L-PED technologies with a screen electroplating process. The screen electroplating process disclosed herein is capable of achieving a faster throughput and a lower workpiece temperature than traditional 3D printing processes can provide, particularly traditional metal 3D printing processes. As a result, the presently disclosed screen electroplating process is able to achieve much faster results in printing a complex three-dimensional metallic structure using electroplating.

There are provided a composite plated product, which has little uneven appearance and good wear resistance, and a method for producing the same without the need of any cyanide-containing silver-plating solutions and any silver-plating solutions containing silver nitrate as a silver salt. A sulfonic-acid-containing silver-plating solution, to which a carbon particle dispersing solution (preferably containing a silicate) is added, is used for electroplating a base material (preferably made of copper or a copper alloy) to form a composite plating film of a composite material, which contains the carbon particles in a silver layer, on the base material to produce a composite plated product.

Localized electrochemical deposition (LECD) is provided. The aim of LECD is to create a patterned electrodeposited metal layer on a cathode without the use of pre-deposition patterning steps. In embodiments described herein, an LECD device includes a cathode (a material to be plated) placed sufficiently close to a formation anode in a metal electrolyte chemical bath. The LECD device is then activated electrically in solution. An electric field created by the formation anode determines the locations of metal deposition, providing a localized deposition without need for photolithography or other masking of the material to be plated.

An electrochemical deposition system—for the electrochemical deposition of a metal-based material (e.g., aluminum or an aluminum alloy)—comprises an electrolyte solution, at least one working electrode, and at least one counter electrode. The electrolyte solution comprises at least one imidazolium-based tetrahalo-metallate compound (e.g., alkyl methylimidazolium tetrachloroaluminate(s)) and at least one metal-containing compound (e.g., AlCl.sub.3, AlBr.sub.3) of a metal of the metal-based material to be electrodeposited on the at least one working electrode. The working electrode is configured to be exposed to the electrolyte solution. The at least one counter electrode is in contact with the electrolyte solution. In some embodiments, the system is configured for additive manufacturing of the metal-based material being electrochemically deposited. Related methods are also disclosed.

An electrochemical deposition system—for the electrochemical deposition of a metal-based material (e.g., aluminum or an aluminum alloy)—comprises an electrolyte solution, at least one working electrode, and at least one counter electrode. The electrolyte solution comprises at least one imidazolium-based tetrahalo-metallate compound (e.g., alkyl methylimidazolium tetrachloroaluminate(s)) and at least one metal-containing compound (e.g., AlCl.sub.3, AlBr.sub.3) of a metal of the metal-based material to be electrodeposited on the at least one working electrode. The working electrode is configured to be exposed to the electrolyte solution. The at least one counter electrode is in contact with the electrolyte solution. In some embodiments, the system is configured for additive manufacturing of the metal-based material being electrochemically deposited. Related methods are also disclosed.

The present invention relates to an electrolyte and to a method for the electrolytic deposition of silver coatings and silver alloy coatings. The electrolyte according to the invention is cyanide-free, storage-stable and ensures the deposition of high-gloss, brilliant and white silver and silver alloy layers for technical and decorative applications.