A film formation apparatus for forming a metal film includes an anode, a solid electrolyte membrane disposed between the anode and a substrate that serves as a cathode, a power supply device that applies a voltage between the anode and the cathode, a solution container that contains a solution between the anode and the solid electrolyte membrane, the solution containing metal ions, and a pressure device that pressurizes the solid electrolyte membrane to the cathode side with a fluid pressure of the solution. The film formation apparatus includes an auxiliary cathode disposed in a peripheral area of the film formation region when the surface of the substrate is viewed in plain view, the auxiliary cathode having an electric potential lower than an electric potential of the anode.

A film formation apparatus for forming a metal film includes an anode, a solid electrolyte membrane disposed between the anode and a substrate that serves as a cathode, a power supply device that applies a voltage between the anode and the cathode, a solution container that contains a solution between the anode and the solid electrolyte membrane, the solution containing metal ions, and a pressure device that pressurizes the solid electrolyte membrane to the cathode side with a fluid pressure of the solution. The film formation apparatus includes an auxiliary cathode disposed in a peripheral area of the film formation region when the surface of the substrate is viewed in plain view, the auxiliary cathode having an electric potential lower than an electric potential of the anode.

An exemplary system for controlling electrodeposition coating for electrochemically forming a coating film on a coating object in an electrodeposition tank storing electrodeposition solution includes, a positive electrode configured to apply a positive electrode voltage to a positive electrode disposed in the electrodeposition tank, a negative electrode configured to apply a negative electrode voltage to the coating object transferred by a hanger, and an electrodeposition controller configured to electrochemically deposit the coating film on an external surface and an internal surface of the coating object by applying the positive electrode voltage to the positive electrode and the negative electrode voltage to the negative electrode, where the electrodeposition controller may be configured to control voltage, current, and pulse in multi-stages over time from a dip-in time point to a draw-out time point of the coating object into and from the electrodeposition tank.

An exemplary system for controlling electrodeposition coating for electrochemically forming a coating film on a coating object in an electrodeposition tank storing electrodeposition solution includes, a positive electrode configured to apply a positive electrode voltage to a positive electrode disposed in the electrodeposition tank, a negative electrode configured to apply a negative electrode voltage to the coating object transferred by a hanger, and an electrodeposition controller configured to electrochemically deposit the coating film on an external surface and an internal surface of the coating object by applying the positive electrode voltage to the positive electrode and the negative electrode voltage to the negative electrode, where the electrodeposition controller may be configured to control voltage, current, and pulse in multi-stages over time from a dip-in time point to a draw-out time point of the coating object into and from the electrodeposition tank.

An electrode (10) is disclosed. The electrode (10) comprises an electrode substrate (20). A layer of TiO.sub.x (30, 40) with a total thickness in the range of between 40-200 μm is present on at least one surface of the electrode substrate (20) and a porosity of layer of TiO.sub.x (30, 40) is below 15%. An electro-catalytic layer (50) comprising oxides of ruthenium and cerium according comprising at least 50 molar % ruthenium oxides is present on layer of TiO.sub.x (30, 40) and wherein x is in the range 1-2 for the layer of TiO.sub.x. A process for the manufacture of the electrode (10) is disclosed as are uses thereof.

An electrode (10) is disclosed. The electrode (10) comprises an electrode substrate (20). A layer of TiO.sub.x (30, 40) with a total thickness in the range of between 40-200 μm is present on at least one surface of the electrode substrate (20) and a porosity of layer of TiO.sub.x (30, 40) is below 15%. An electro-catalytic layer (50) comprising oxides of ruthenium and cerium according comprising at least 50 molar % ruthenium oxides is present on layer of TiO.sub.x (30, 40) and wherein x is in the range 1-2 for the layer of TiO.sub.x. A process for the manufacture of the electrode (10) is disclosed as are uses thereof.

A method for electroplating a steel strip with a plating layer and an improvement thereof.

A method for electroplating a steel strip with a plating layer and an improvement thereof.

A plating apparatus including a thief electrode that can be suitably maintained is provided. The plating apparatus includes a substrate holder holding a substrate, a thief electrode supporter supporting a thief electrode to be disposed outside the substrate, a plating tank configured to immerse the substrate in a plating solution for applying an electroplating treatment, a thief electrode maintenance tank configured to perform maintenance of the thief electrode, and a transport module configured to transport the thief electrode supporter to the plating tank and the thief electrode maintenance tank.

A plating apparatus including a thief electrode that can be suitably maintained is provided. The plating apparatus includes a substrate holder holding a substrate, a thief electrode supporter supporting a thief electrode to be disposed outside the substrate, a plating tank configured to immerse the substrate in a plating solution for applying an electroplating treatment, a thief electrode maintenance tank configured to perform maintenance of the thief electrode, and a transport module configured to transport the thief electrode supporter to the plating tank and the thief electrode maintenance tank.