Electroplating systems may include an electroplating chamber. The systems may also include a replenish assembly fluidly coupled with the electroplating chamber. The replenish assembly may include a first compartment housing anode material. The first compartment may include a first compartment section in which the anode material is housed and a second compartment section separated from the first compartment section by a divider. The replenish assembly may include a second compartment fluidly coupled with the electroplating chamber and electrically coupled with the first compartment. The replenish assembly may also include a third compartment electrically coupled with the second compartment, the third compartment including an inert cathode.

Electroplating systems may include an electroplating chamber. The systems may also include a replenish assembly fluidly coupled with the electroplating chamber. The replenish assembly may include a first compartment housing anode material. The first compartment may include a first compartment section in which the anode material is housed and a second compartment section separated from the first compartment section by a divider. The replenish assembly may include a second compartment fluidly coupled with the electroplating chamber and electrically coupled with the first compartment. The replenish assembly may also include a third compartment electrically coupled with the second compartment, the third compartment including an inert cathode.

Provided is a semiconductor manufacturing apparatus, comprising: a first device; one or more sensors that detect physical quantities indicating a state of the first device; a first calculation circuit that calculates one or more feature quantities of the first device from the detected physical quantities; and a failure prediction circuit that monitors a temporal change in the one or more feature quantities calculated in the first calculation circuit, and stops receiving a new substrate when a duration for which a degree of deviation of the one or more feature quantities from those at a normal time is increasing exceeds a first time, and/or when a number of increases and decreases per unit time in the degree of deviation of the one or more feature quantities from those at the normal time exceeds a first number.

A method for the electrodeposition of a functional or decorative chromium layer onto a metallic substrate in an electrodeposition process from a halide-ion free and boric acid free aqueous electrolyte solution and to the coated product obtained thereby.

A method for the electrodeposition of a functional or decorative chromium layer onto a metallic substrate in an electrodeposition process from a halide-ion free and boric acid free aqueous electrolyte solution and to the coated product obtained thereby.

The present invention is related to a membrane anode system for electrolytic zinc-nickel alloy deposition, a method for electrolytic deposition of a zinc-nickel alloy layer on a substrate to be treated using a membrane anode system, and the use of a membrane anode system for acid or alkaline electrolytic deposition of a zinc-nickel alloy layer on a substrate to be treated by such a method.

The present invention is related to a membrane anode system for electrolytic zinc-nickel alloy deposition, a method for electrolytic deposition of a zinc-nickel alloy layer on a substrate to be treated using a membrane anode system, and the use of a membrane anode system for acid or alkaline electrolytic deposition of a zinc-nickel alloy layer on a substrate to be treated by such a method.

The invention provides a process for preparing an electrode, comprising: electrodeposition of metallic ruthenium/ruthenium oxide (Ru.sup.(0)/RuO.sub.2) coating onto a progressively etched nickel surface; and partial electrochemical oxidation of said metallic ruthenium to ruthenium oxide. The electrode produced and a pseudo-capacitor based on the electrode are also disclosed.

The present invention provides a pump device comprising a housing and a electrode device. The housing has an inlet and an outlet arranged at a side of the housing for allowing a first flow flowing into the housing. The electrode device is arranged in the housing, and comprises a rotating body having a fluid inlet, a plurality of first flow channels, at least one first electrode and at least one second electrode. The rotating body is driven to rotate thereby generating a negative pressure for drawing the first fluid into the plurality of first flow channels through the fluid inlet such that the first fluid is reacted with the first and second electrodes thereby generating micro bubbles and is exhausted from the plurality of first flow channels. The first flow having micro bubbles are exhausted from the housing through the outlet.

An electroplating method for enhancing the performance of rolled-up passive components comprises providing an array of rolled-up passive components on a substrate, where each rolled-up passive component comprises a multilayer strip in a rolled configuration including multiple turns spaced apart by gaps. The multilayer strip comprises a conductive pattern layer on a strain-relieved layer, and a core of each rolled-up passive component is defined by a first of the multiple turns. A layer comprising a functional material is electroplated onto the conductive pattern layer of each rolled-up passive component, thereby at least partly filling the gaps and/or the core with the functional material.