Method and apparatus are provided for electroplating a surface area of an internal wall defining a cooling cavity present in a gas turbine engine component.

Provided is a wetting method for substrate that allows reducing an amount of air bubbles attached to a surface to be plated with a simple structure.

The wetting method for substrate includes a holding step 102 of holding a back surface of a substrate with a back plate such that a surface to be plated of the substrate is opposed to a liquid surface of a plating solution housed in a plating tank, a supplying step 104 of supplying the plating solution to the plating tank such that the plating solution upwardly flows through a plurality of through-holes in a center part of an ionically resistive element arranged inside the plating tank to raise a center part of the liquid surface of the plating solution, a first lowering step 106 of lowering a supporting member for supporting an outer edge portion of the surface to be plated of the substrate held by the holding member toward the liquid surface of the plating solution, and a second lowering step 108 of lowering the holding member such that the substrate is sandwiched by the supporting member lowered in the first lowering step 106 and the holding member while the center part of the liquid surface of the plating solution is raised in the supplying step 104.

A plating apparatus and an operation method thereof are provided. The plating apparatus includes: a tank body including at least one side wall, the at least one side wall being provided with an opening extending from the inside to the outside of the tank body, and the tank body being configured to accommodate a plating solution; and a fixing device configured to fix the substrate at the opening of the side wall. The operation method of the plating apparatus includes: placing the substrate on an outer side of the side wall and at the position of the opening, and operating the fixing device to fix the substrate; and performing plating treatment on the substrate.

An electrolyte solution for chrome plating from trivalent chromium is prepared by dissolving in an aqueous medium a trivalent chromium salt (e.g., chromium (III) chloride or chromium (III) sulfate), dissolving an oxalate compound (e.g., sodium oxalate, potassium oxalate, or oxalic acid), dissolving a metal salt (e.g., aluminum sulfate or aluminum chloride), dissolving an alkali metal sulfate (e.g., sodium sulfate or potassium sulfate), and dissolving an alkali metal halide (e.g., sodium fluoride or potassium fluoride). A substrate is chrome plated from trivalent chromium using the electrolyte solution by passing a current between a cathode and an anode through the electrolyte solution to deposit chromium on the substrate.

In a plasma electrolytic oxidation apparatus and a method of plasma electrolytic oxidation using the plasma electrolytic oxidation apparatus, the plasma electrolytic oxidation apparatus includes a chamber and an electrode unit. The chamber is configured to receive an electrolyte. The electrode unit is configured to receive the electrolyte from the chamber and to treat an object with a plasma electrolytic oxidation treatment. The electrode unit includes an electrode, an enclosing part and a cover. The electrode is configured to receive a voltage from outside, and to form a receiving space in which the electrolyte is received between the electrode and the object. The enclosing part is configured to enclose a gap between the electrode and the object. The cover is configured to cover the electrode.

Ionic liquid bath plating methods for depositing aluminum-containing layers utilizing shaped consumable aluminum anodes are provided, as are turbomachine components having three dimensionally-tailored, aluminum-containing coatings produced from such aluminum-containing layers. In one embodiment, the ionic liquid bath plating method includes the step or process of obtaining a consumable aluminum anode including a workpiece-facing anode surface substantially conforming with the geometry of the non-planar workpiece surface. The workpiece-facing anode surface and the non-planar workpiece surface are positioned in an adjacent, non-contacting relationship, while the workpiece and the consumable aluminum anode are submerged in an ionic liquid aluminum plating bath. An electrical potential is then applied across the consumable aluminum anode and the workpiece to deposit an aluminum-containing layer onto the non-planar workpiece surface. In certain implementations, additional steps are then performed to convert or incorporate the aluminum-containing layer into a high temperature aluminum-containing coating, such as an aluminide coating.

Provided is a metal coating film formation device capable of forming a film using a simple device configuration and in a short time, and capable of performing the formation of a film of metal coating continuously for a long period. A film formation device 1A is provided with an anode 11, a solid electrolyte film 13 disposed between the anode 11 and the base material B, and a power supply unit 16 that applies a voltage between the anode 11 and the base material B. The anode 11 is a non-porous anode comprising the same metal as the metal of the metal coating. Between the anode 11 and the solid electrolyte film 13, a porous material 14 is disposed in contact with the anode 11 and the solid electrolyte film 13. The porous material 14 includes a plurality of pores providing communication between the anode 11 and the solid electrolyte film 13 and being supplied with a metal solution L.

Provided is a metal coating film formation device capable of forming a film using a simple device configuration and in a short time, and capable of performing the formation of a film of metal coating continuously for a long period. A film formation device 1A is provided with an anode 11, a solid electrolyte film 13 disposed between the anode 11 and the base material B, and a power supply unit 16 that applies a voltage between the anode 11 and the base material B. The anode 11 is a non-porous anode comprising the same metal as the metal of the metal coating. Between the anode 11 and the solid electrolyte film 13, a porous material 14 is disposed in contact with the anode 11 and the solid electrolyte film 13. The porous material 14 includes a plurality of pores providing communication between the anode 11 and the solid electrolyte film 13 and being supplied with a metal solution L.

An electroplating system includes an electroplating bath in which a cathode end and at least an anode end are configured. The anode end is provided with plural anode elements which are insulative from one another, as well as plural conductive elements which are connected electrically with each anode element, respectively. The electroplating system enables a variety of distribution of the electric lines of force to be formed in the electroplating bath through energizing one or any number of anode elements. In particular, good benefits can be achieved by a more aggressive and reliable means, without a need for changing the original anode end equipment.

An electroplating system includes an electroplating bath in which a cathode end and at least an anode end are configured. The anode end is provided with plural anode elements which are insulative from one another, as well as plural conductive elements which are connected electrically with each anode element, respectively. The electroplating system enables a variety of distribution of the electric lines of force to be formed in the electroplating bath through energizing one or any number of anode elements. In particular, good benefits can be achieved by a more aggressive and reliable means, without a need for changing the original anode end equipment.