Examples of a susceptor for supporting a substrate includes a base metal formed of aluminum or a material containing aluminum, an anodized layer covering a surface of the base metal and having cracks therein, and a CF coating of polymer provided in the cracks such that the exposure of the base metal is avoided.

Examples of a susceptor for supporting a substrate includes a base metal formed of aluminum or a material containing aluminum, an anodized layer covering a surface of the base metal and having cracks therein, and a CF coating of polymer provided in the cracks such that the exposure of the base metal is avoided.

The present invention is provided with a base electrode layer forming step of forming a base electrode layer by applying and sintering a conductive paste on an end surface of the thermistor element, an oxide layer forming step of forming an oxide layer on a surface of the base electrode layer, a cover electrode layer forming step of forming a cover electrode layer by applying and sintering a conductive paste on a surface of the oxide layer, and a conduction heat treatment step of performing a heat treatment such that the base electrode layer and the cover electrode layer are electrically conductive, in which the electrode portion having the base electrode layer and the cover electrode layer is formed and a plating step of forming a metal plating layer on a surface of the cover electrode layer is provided after the conduction heat treatment step.

A plating apparatus includes a plating tank and a plating unit. The plating unit includes a partition wall allowing the plating solution to pass through but not allowing the plating object to pass through, and defines inside thereof a plating object passage through which the plating object passes, an injector which injects the plating solution upward, a mixing portion in which the plating solution and the plating object are mixed, an anode outside the plating object passage, a cathode inside the plating object passage with a hollow region through which a fluid mixture of the plating solution and the plating object passes upward, a first shielding wall which guides the fluid mixture downward, and a second shielding wall outside the first shielding wall. A lower end of the first shielding wall is lower than an upper end of the second shielding wall.

A plating apparatus includes a plating tank and a plating unit. The plating unit includes a partition wall allowing the plating solution to pass through but not allowing the plating object to pass through, and defines inside thereof a plating object passage through which the plating object passes, an injector which injects the plating solution upward, a mixing portion in which the plating solution and the plating object are mixed, an anode outside the plating object passage, a cathode inside the plating object passage with a hollow region through which a fluid mixture of the plating solution and the plating object passes upward, a first shielding wall which guides the fluid mixture downward, and a second shielding wall outside the first shielding wall. A lower end of the first shielding wall is lower than an upper end of the second shielding wall.

An electroplated article includes a base member that includes one or more base member-metallic elements; and an electroplated layer that is formed directly on the base member. The electroplated layer includes at least a first electroplated layer-metallic element and a second electroplated layer-metallic element that is different from the first electroplated layer-metallic element. The second electroplated layer-metallic element is a metallic element that is identical to at least one of the one or more base member-metallic elements. A ratio of the second electroplated layer-metallic element in the electroplated layer is continuously decreased as being away from the base member in the thickness direction of the electroplated layer. Alloy grains including at least the first and second electroplated layer-metallic elements are distributed in the electroplated layer such that a clear interface is not formed between the base member and the electroplated layer.

An electroplated article includes a base member that includes one or more base member-metallic elements; and an electroplated layer that is formed directly on the base member. The electroplated layer includes at least a first electroplated layer-metallic element and a second electroplated layer-metallic element that is different from the first electroplated layer-metallic element. The second electroplated layer-metallic element is a metallic element that is identical to at least one of the one or more base member-metallic elements. A ratio of the second electroplated layer-metallic element in the electroplated layer is continuously decreased as being away from the base member in the thickness direction of the electroplated layer. Alloy grains including at least the first and second electroplated layer-metallic elements are distributed in the electroplated layer such that a clear interface is not formed between the base member and the electroplated layer.

Examples of a susceptor for supporting a substrate includes a base metal formed of aluminum or a material containing aluminum, an anodized layer covering a surface of the base metal and having cracks therein, and a CF coating of polymer provided in the cracks such that the exposure of the base metal is avoided.

Examples of a susceptor for supporting a substrate includes a base metal formed of aluminum or a material containing aluminum, an anodized layer covering a surface of the base metal and having cracks therein, and a CF coating of polymer provided in the cracks such that the exposure of the base metal is avoided.

A plating apparatus includes a plating tank and a plating unit. The plating unit includes a partition wall allowing the plating solution to pass through but not allowing the plating object to pass through, and defines inside thereof a plating object passage through which the plating object passes, an injector which injects the plating solution upward, a mixing portion in which the plating solution and the plating object are mixed, an anode outside the plating object passage, a cathode inside the plating object passage with a hollow region through which a fluid mixture of the plating solution and the plating object passes upward, a first shielding wall which guides the fluid mixture downward, and a second shielding wall outside the first shielding wall. A lower end of the first shielding wall is lower than an upper end of the second shielding wall.