Durable seamless replication tools are disclosed for replication of seamless relief patterns in desired media, for example in optical recording or data storage media. Methods of making such durable replication tools are disclosed, including preparing a recording substrate on the inner surface of a support cylinder, recording and developing a relief pattern in the substrate, creating a durable negative relief replica of the pattern, extracting the resulting durable tool sleeve from a processing cell, and mounting the tool sleeve on a mounting fixture. Apparatus are disclosed for fabricating such seamless replication tools, including systems for recording a desired relief pattern on a photosensitive layer on an inner surface of a support cylinder. Also disclosed are electrodeposition cells for forming a durable tool sleeve having a desired relief pattern. The replication tool relief features may have critical dimensions down to the micron and nanometer regime.

The present embodiment relates to an internal combustion engine having an anodic oxide coating formed on at least a portion of an aluminum-based wall surface facing a combustion chamber. The anodic oxide coating has a plurality of nanopores extending substantially in the thickness direction of the anodic oxide coating, a first micropore extending from the surface toward the inside of the anodic oxide coating, and a second micropore present in the inside of the anodic oxide coating; the surface opening diameter of the nanopores is 0 nm or larger and smaller than 30 nm; the inside diameter of the nanopores is larger than the surface opening diameter; the film thickness of the anodic oxide coating is 15 m or larger and 130 m or smaller; and the porosity of the anodic oxide coating is 23% or more.

An electrolytic plating composition for superfilling submicron features in a semiconductor integrated circuit device and a method of using the same. The composition comprises (a) a source of copper ions to electrolytically deposit copper onto the substrate and into the electrical interconnect features, and (b) a suppressor comprising at least three amine sites, said polyether comprising a block copolymer substituent comprising propylene oxide (PO) repeat units and ethylene oxide (EO) repeat units, wherein the number average molecular weight of the suppressor compound is between about 1,000 and about 20,000.

This disclosure includes coatings for increasing the physical and/or chemical properties of articles, for example, tubular metal articles such as those found in the oil and gas industry, as well as processes for making such coatings and articles comprising such coatings.

This disclosure includes coatings for increasing the physical and/or chemical properties of articles, for example, tubular metal articles such as those found in the oil and gas industry, as well as processes for making such coatings and articles comprising such coatings.

The present invention is directed toward a method for stabilizing the electrolytic deposition of platinum from an electrolytic bath. In particular, the present invention relates to a corresponding method in which the platinum electrolytic bath has platinum in the form of a sulfamate complex.

The present invention is directed toward a method for stabilizing the electrolytic deposition of platinum from an electrolytic bath. In particular, the present invention relates to a corresponding method in which the platinum electrolytic bath has platinum in the form of a sulfamate complex.

Disclosed are electrolytic copper foils, characterized in that: an electrodeposited surface of the electrolytic copper foil has an average surface roughness (S.sub.z) of 3.50 m or less; the electrolytic copper foil has a twin grain boundary ratio of 35% or less, or a total grain boundary density of 3.50 m.sup.1 or more after heat treatment at 200 C. for 2 hours; the electrolytic copper foil is manufactured by electrodepositing in an electrolytic solution; and the electrolytic solution comprises 0.01 ppm to 25.0 ppm of chloride ion and 0.01 ppm to 75.0 ppm of an additive. Also disclosed are methods of manufacturing the electrolytic copper foils, and articles made therefrom. The articles include negative electrode current collectors of lithium-ion batteries or electrical double-layer capacitors, resin coated coppers, copper clad laminates, flexible copper clad laminates, various types of printed circuit boards, and the like.

The present disclosure relates to an anodizing apparatus that may include: a body; a jig tray disposed inside the body and having a plurality of coupling holes formed to pass therethrough in an upward and downward direction thereof; a plurality of jigs detachably coupled correspondingly to the plurality of coupling holes of the jig tray to fix a plurality of objects to be anodized thereto at a time; and an anodizing unit adapted to perform an anodizing process for the plurality of objects to be anodized and having a plurality of accommodation parts for storing electrolytes therein.

The present disclosure relates to an anodizing apparatus that may include: a body; a jig tray disposed inside the body and having a plurality of coupling holes formed to pass therethrough in an upward and downward direction thereof; a plurality of jigs detachably coupled correspondingly to the plurality of coupling holes of the jig tray to fix a plurality of objects to be anodized thereto at a time; and an anodizing unit adapted to perform an anodizing process for the plurality of objects to be anodized and having a plurality of accommodation parts for storing electrolytes therein.