Patent classifications
C25D21/02
METAL SURFACE MODIFICATION APPARATUS
A metal surface modification apparatus, includes: a particle and solution mixing and circulating system used for providing nanoparticle solution for a workpiece; a rotating platform used for fixing the workpiece and driving the workpiece to rotate; an electrophoresis system used for depositing particles in the nanoparticle solution in the particle and solution mixing and circulating system to a surface of the workpiece according to an electrophoretic effect; and a temperature control apparatus used for changing a surface temperature of the workpiece. The metal surface modification apparatus provided in the present disclosure may perform hydrophilic and hydrophobic modification treatment on a metal surface by combining one or more different processes.
METAL SURFACE MODIFICATION APPARATUS
A metal surface modification apparatus, includes: a particle and solution mixing and circulating system used for providing nanoparticle solution for a workpiece; a rotating platform used for fixing the workpiece and driving the workpiece to rotate; an electrophoresis system used for depositing particles in the nanoparticle solution in the particle and solution mixing and circulating system to a surface of the workpiece according to an electrophoretic effect; and a temperature control apparatus used for changing a surface temperature of the workpiece. The metal surface modification apparatus provided in the present disclosure may perform hydrophilic and hydrophobic modification treatment on a metal surface by combining one or more different processes.
Method of Forming Corrosion Resistant Coating and Related Apparatus
A method of forming a corrosion-resistant ceramic coating on a metallic substrate, the method comprising providing a passivation layer on a surface of the metallic substrate by electrochemical passivation of the metallic substrate under a first electrical current and using a first electrically conducting solution; and providing the corrosion-resistant ceramic coating on an outermost surface of the metallic substrate, the outermost surface in use adapted to be exposed to a corrosive environment, by plasma electrolytic oxidation of the metallic substrate with the passivation layer, in a second electrically conducting solution and under a second electrical current having a discharge voltage. The first and the second electrically conducting solutions comprise a tetrafluoroborate compound.
Method of Forming Corrosion Resistant Coating and Related Apparatus
A method of forming a corrosion-resistant ceramic coating on a metallic substrate, the method comprising providing a passivation layer on a surface of the metallic substrate by electrochemical passivation of the metallic substrate under a first electrical current and using a first electrically conducting solution; and providing the corrosion-resistant ceramic coating on an outermost surface of the metallic substrate, the outermost surface in use adapted to be exposed to a corrosive environment, by plasma electrolytic oxidation of the metallic substrate with the passivation layer, in a second electrically conducting solution and under a second electrical current having a discharge voltage. The first and the second electrically conducting solutions comprise a tetrafluoroborate compound.
MANUFACTURING METHOD OF ULTRA-LARGE COPPER GRAINS WITHOUT HEAT TREATMENT
A film of single crystal copper is manufactured by means of electrodeposition without heat treatment. The grains of the single crystal copper have an average size of at least 10 m. The electrolytic solution used in the method contains chloride ions, a wetting agent, sulfuric acid, CuSO.sub.4.5H.sub.2O and alkanesulfonate sulfide. The ultra-large copper grains of the present invention contain very few impurities and thus possess low resistance, high conductivity, shining appearance and anti-fingerprint property.
SUBSTRATE HOLDER RECEPTION APPARATUS
This invention concerns a substrate holder reception apparatus (1) for clamping a substrate holder (11) in a substrate holder clamping direction (SHCD) in a predetermined position of the substrate holder (11) and releasing the substrate holder (11), comprising at least one substrate holder connection device (21) for mechanical aligning and electrically contacting of the substrate holder (11), wherein the substrate holder connection device (21) comprises a separate substrate holder alignment device (211) for aligning the substrate holder (11) with the substrate holder connection device (21) in an alignment direction, and a separate substrate holder contact device (212) for electrically contacting the substrate holder (11). Further, the invention concerns an electrochemical treatment apparatus (5) comprising the substrate holder reception apparatus (1).
SUBSTRATE HOLDER RECEPTION APPARATUS
This invention concerns a substrate holder reception apparatus (1) for clamping a substrate holder (11) in a substrate holder clamping direction (SHCD) in a predetermined position of the substrate holder (11) and releasing the substrate holder (11), comprising at least one substrate holder connection device (21) for mechanical aligning and electrically contacting of the substrate holder (11), wherein the substrate holder connection device (21) comprises a separate substrate holder alignment device (211) for aligning the substrate holder (11) with the substrate holder connection device (21) in an alignment direction, and a separate substrate holder contact device (212) for electrically contacting the substrate holder (11). Further, the invention concerns an electrochemical treatment apparatus (5) comprising the substrate holder reception apparatus (1).
METHOD AND DEVICE FOR THE GALVANIC APPLICATION OF A SURFACE COATING
A method for galvanic application of a surface coating, in particular a chromium coating, to a body, for example a machine component. Before the galvanic application of the surface coating, a layer of a compound that can be oxidized by an electrolyte solution that is used, preferably a polyhydroxy compound with a viscosity of at least 1000 mPas at 25 C., is applied to the body. A method for galvanic application of a surface coating, in particular a chromium coating, to a body, for example a machine component, wherein the surface coating is carried out in a closed reactor in an at least two-stage, preferably three-stage process, is also disclosed. An electrolyte solution contained in the reactor at a temperature T1 for carrying out a subsequent process stage is substituted by an electrolyte solution at a temperature T2T1. A device for carrying out this method is also disclosed.
METHOD AND DEVICE FOR THE GALVANIC APPLICATION OF A SURFACE COATING
A method for galvanic application of a surface coating, in particular a chromium coating, to a body, for example a machine component. Before the galvanic application of the surface coating, a layer of a compound that can be oxidized by an electrolyte solution that is used, preferably a polyhydroxy compound with a viscosity of at least 1000 mPas at 25 C., is applied to the body. A method for galvanic application of a surface coating, in particular a chromium coating, to a body, for example a machine component, wherein the surface coating is carried out in a closed reactor in an at least two-stage, preferably three-stage process, is also disclosed. An electrolyte solution contained in the reactor at a temperature T1 for carrying out a subsequent process stage is substituted by an electrolyte solution at a temperature T2T1. A device for carrying out this method is also disclosed.
Zirconium coating of a substrate
This invention provides an electrolyte salt for use in an electrodeposition process for depositing Zirconium metal on a thin foil substrate. The prior art electrochemical process causes a reaction between a uranium substrate and ZrF.sub.4 species in the electrolyte that causes the formation of UF.sub.x at the substrate surface that prevents the formation of a dense uniform zirconium coating. This problem is solved by using an electrolyte salt in an electrodeposition process consisting of lithium fluoride (LiF) in a concentration ranging between about 11.5 molar percent and about 61 molar percent and one or more salts selected from the group consisting of sodium fluoride (NaF), potassium fluoride (KF), cesium fluoride (CsF), or cesium chloride (CsCL). Zirconium is added to the electrolyte salt through an addition of zirconium fluoride (ZrF.sub.4) in the range of about 1 to about 5 mass percent (w/w %). The Zr coating is of at least 98% pure Zr with a density of at least 98%.