A forming device and a preparation method of a graphite crucible are provided. The forming device includes: a support frame, including a base; a male die, disposed on the support frame and far away from the base and movable reciprocally in a vertical direction relative to the support frame; a crucible mouth pressing member, disposed on the support frame, correspondingly disposed on a side of the male die close to the base, movable reciprocally in the vertical direction relative to the support frame, and defining an opening part allowing the male die to pass therethrough; and a female die, disposed on the base and corresponding to the male die, and configured to accommodate crucible paste. The male die, the crucible mouth pressing member and the female die are configured to cooperatively form the crucible paste into the graphite crucible.

A forming device and a preparation method of a graphite crucible are provided. The forming device includes: a support frame, including a base; a male die, disposed on the support frame and far away from the base and movable reciprocally in a vertical direction relative to the support frame; a crucible mouth pressing member, disposed on the support frame, correspondingly disposed on a side of the male die close to the base, movable reciprocally in the vertical direction relative to the support frame, and defining an opening part allowing the male die to pass therethrough; and a female die, disposed on the base and corresponding to the male die, and configured to accommodate crucible paste. The male die, the crucible mouth pressing member and the female die are configured to cooperatively form the crucible paste into the graphite crucible.

It is proposed a method to enable manufacturing of a steel sheet having a beautiful coated layer, when applying hot-dip galvanizing to a steel sheet containing oxidizable elements. The method comprises: an electroplating step of, in a gap between a steel sheet and an electrode plate, forming Fe-based plating on the surface of the steel sheet through electroplating, by supplying an Fe-based plating solution; an annealing step of subjecting the steel sheet to heat treatment; and a hot dip coating step of applying hot-dip galvanizing to the steel sheet, and, in the electroplating step, a plating solution discharge rate, which is the ratio of the flow rate of the plating solution flowing out to the back side that is not facing the steel sheet of the electrode plate, to the flow rate of the plating solution supplied to the steel sheet, is less than 50%.

It is proposed a method to enable manufacturing of a steel sheet having a beautiful coated layer, when applying hot-dip galvanizing to a steel sheet containing oxidizable elements. The method comprises: an electroplating step of, in a gap between a steel sheet and an electrode plate, forming Fe-based plating on the surface of the steel sheet through electroplating, by supplying an Fe-based plating solution; an annealing step of subjecting the steel sheet to heat treatment; and a hot dip coating step of applying hot-dip galvanizing to the steel sheet, and, in the electroplating step, a plating solution discharge rate, which is the ratio of the flow rate of the plating solution flowing out to the back side that is not facing the steel sheet of the electrode plate, to the flow rate of the plating solution supplied to the steel sheet, is less than 50%.

The steel sheet for plating according to an aspect of the present invention has a GDS profile of an Mn element and a GDS profile of an Si element, which are observed from the surface to the depth, sequentially including a maximum point and a minimum point, wherein a difference of converted concentration of Mn is 10% or more, and a difference of converted concentration of Si is 10% or more.

The steel sheet for plating according to an aspect of the present invention has a GDS profile of an Mn element and a GDS profile of an Si element, which are observed from the surface to the depth, sequentially including a maximum point and a minimum point, wherein a difference of converted concentration of Mn is 10% or more, and a difference of converted concentration of Si is 10% or more.

The disclosure provides a copper foil for printed circuit boards and a manufacturing method thereof. The manufacturing method includes performing a multi-stage electroplating process to sequentially form a metal release layer, a burnt copper layer, and a copper sulfate layer. The multi-stage electroplating process includes a metal release layer electroplating process, a copper pyrophosphate electroplating process, and a copper sulfate electroplating process.

The disclosure provides a copper foil for printed circuit boards and a manufacturing method thereof. The manufacturing method includes performing a multi-stage electroplating process to sequentially form a metal release layer, a burnt copper layer, and a copper sulfate layer. The multi-stage electroplating process includes a metal release layer electroplating process, a copper pyrophosphate electroplating process, and a copper sulfate electroplating process.

A heat exchanger including a shell, and a gyroid structure comprising a first plurality of holes forming a first fluid path and a second plurality of holes forming a second fluid path, where the first fluid path and the second fluid path are mutually sealed off, where the first plurality of holes is configured to pass a coolant through the first fluid path of the heat exchanger, and where the second plurality of holes is configured to pass a plating chemistry fluid through the second fluid path of the heat exchanger. Further, a method of exchanging heat in the electroplating apparatus including passing the coolant through the first plurality of holes of the first fluid path from the coolant inlet to the coolant outlet and passing the plating chemistry fluid through the second plurality of holes of the second fluid path from the plating inlet to the plating outlet.

A heat exchanger including a shell, and a gyroid structure comprising a first plurality of holes forming a first fluid path and a second plurality of holes forming a second fluid path, where the first fluid path and the second fluid path are mutually sealed off, where the first plurality of holes is configured to pass a coolant through the first fluid path of the heat exchanger, and where the second plurality of holes is configured to pass a plating chemistry fluid through the second fluid path of the heat exchanger. Further, a method of exchanging heat in the electroplating apparatus including passing the coolant through the first plurality of holes of the first fluid path from the coolant inlet to the coolant outlet and passing the plating chemistry fluid through the second plurality of holes of the second fluid path from the plating inlet to the plating outlet.