Methods, systems, and apparatus for plating a metal onto a work piece with a plating solution having a low oxygen concentration are described. In one aspect, a method includes reducing an oxygen concentration of a plating solution. The plating solution includes about 100 parts per million or less of an accelerator. After reducing the oxygen concentration of the plating solution, a wafer substrate is contacted with the plating solution in a plating cell. The oxygen concentration of the plating solution in the plating cell is about 1 part per million or less. A metal is electroplated with the plating solution onto the wafer substrate in the plating cell. After electroplating the metal onto the wafer substrate, an oxidizing strength of the plating solution is increased.

Methods, systems, and apparatus for plating a metal onto a work piece with a plating solution having a low oxygen concentration are described. In one aspect, a method includes reducing an oxygen concentration of a plating solution. The plating solution includes about 100 parts per million or less of an accelerator. After reducing the oxygen concentration of the plating solution, a wafer substrate is contacted with the plating solution in a plating cell. The oxygen concentration of the plating solution in the plating cell is about 1 part per million or less. A metal is electroplated with the plating solution onto the wafer substrate in the plating cell. After electroplating the metal onto the wafer substrate, an oxidizing strength of the plating solution is increased.

A charge transfer mechanism is used to locally deposit or remove material for a small structure. A local electrochemical cell is created without having to immerse the entire work piece in a bath. The charge transfer mechanism can be used together with a charged particle beam or laser system to modify small structures, such as integrated circuits or micro-electromechanical system. The charge transfer process can be performed in air or, in some embodiments, in a vacuum chamber.

A charge transfer mechanism is used to locally deposit or remove material for a small structure. A local electrochemical cell is created without having to immerse the entire work piece in a bath. The charge transfer mechanism can be used together with a charged particle beam or laser system to modify small structures, such as integrated circuits or micro-electromechanical system. The charge transfer process can be performed in air or, in some embodiments, in a vacuum chamber.

A method for galvanic application of a surface coating, in particular a chromium coating, to a body, for example a machine component. Before the galvanic application of the surface coating, a layer of a compound that can be oxidized by an electrolyte solution that is used, preferably a polyhydroxy compound with a viscosity of at least 1000 mPas at 25° C., is applied to the body. A method for galvanic application of a surface coating, in particular a chromium coating, to a body, for example a machine component, wherein the surface coating is carried out in a closed reactor in an at least two-stage, preferably three-stage process, is also disclosed. An electrolyte solution contained in the reactor at a temperature T1 for carrying out a subsequent process stage is substituted by an electrolyte solution at a temperature T2≠T1. A device for carrying out this method is also disclosed.

A method for galvanic application of a surface coating, in particular a chromium coating, to a body, for example a machine component. Before the galvanic application of the surface coating, a layer of a compound that can be oxidized by an electrolyte solution that is used, preferably a polyhydroxy compound with a viscosity of at least 1000 mPas at 25° C., is applied to the body. A method for galvanic application of a surface coating, in particular a chromium coating, to a body, for example a machine component, wherein the surface coating is carried out in a closed reactor in an at least two-stage, preferably three-stage process, is also disclosed. An electrolyte solution contained in the reactor at a temperature T1 for carrying out a subsequent process stage is substituted by an electrolyte solution at a temperature T2≠T1. A device for carrying out this method is also disclosed.

A plating apparatus includes a workpiece holder, a plating bath, and a clamp ring. The plating bath is underneath the workpiece holder. The clamp ring is connected to the workpiece holder. The clamp ring includes channels communicating an inner surface of the clamp ring and an outer surface of the clamp ring.

A plating apparatus includes a workpiece holder, a plating bath, and a clamp ring. The plating bath is underneath the workpiece holder. The clamp ring is connected to the workpiece holder. The clamp ring includes channels communicating an inner surface of the clamp ring and an outer surface of the clamp ring.

Provided is a substrate plating apparatus capable of simultaneously circulating and stirring a plating solution and removing air bubbles. The plating apparatus includes a hybrid paddle disposed in front of a substrate in a plating bath to stir the plating solution. Here, the hybrid paddle includes a spray assembly for spraying the plating solution toward the substrate and a suction assembly for suctioning air bubbles formed on the substrate during plating, and the spray assembly and the suction assembly are coupled into one body and perform a reciprocating movement along a surface of the substrate to stir the plating solution.

A method of electroplating a target electrode comprises establishing a first electric current through an electrolytic solution, comprising a quantity of an electrically charged material, an initial electrode, and a transitional electrode, so that a quantity of the electrically charged material is converted to a quantity of an electrically neutral material, which is electroplated, as a deposit, onto the transitional electrode; and establishing a second electric current through the electrolytic solution, the transitional electrode, and the target electrode so that a quantity of the electrically neutral material from the deposit is converted to a quantity of the electrically charged material, which is dissolved into the electrolytic solution, and a quantity of the electrically charged material in the electrolytic solution is converted to a quantity of the electrically neutral material, which is electroplated onto the surface of the target electrode.