An apparatus and a method for the metallization of an object including placing the object in an electrolyte, placing an anode in contact with the electrolyte, placing a metallization contact of a cathode in contact with the object, applying an electrical tension between the anode and the cathode, wherein the metallization contact is displaced in relation to the object during the metallization of the object to achieve a complete and continuous metallization of the object's surface.

A method for removing ferric ions contained in a sulfate-based iron electroplating solution comprises a step of regeneration for reduction of the ferric ions by circulating a ferric ion-containing sulfate-based iron electroplating solution in a solution bath containing ferrous metal charged therein, wherein the ferrous metal is charged in an amount that satisfies the following formula (1): S?0.01 I.sub.conv/C.sub.max (1). In formula (1), S indicates a total surface (m.sup.2) of ferrous metal, C.sub.max indicates a maximum permissible ion concentration level (g/L) of the ferric ions in the solution, and I.sub.conv indicates, as represented by the following formula (2), converted current (A) obtained by dividing the sum of current (I) applied to an electroplated cell during the plating time (t.sub.p, sec) by the regeneration time (t.sub.r, sec) for reduction of the ferric ions in an electrolyte.

[00001]$I_{\mathrm{conv}}=\frac{?{\mathrm{Idt}}_p}{?{\mathrm{dt}}_r}$

A method for removing ferric ions contained in a sulfate-based iron electroplating solution comprises a step of regeneration for reduction of the ferric ions by circulating a ferric ion-containing sulfate-based iron electroplating solution in a solution bath containing ferrous metal charged therein, wherein the ferrous metal is charged in an amount that satisfies the following formula (1): S?0.01 I.sub.conv/C.sub.max (1). In formula (1), S indicates a total surface (m.sup.2) of ferrous metal, C.sub.max indicates a maximum permissible ion concentration level (g/L) of the ferric ions in the solution, and I.sub.conv indicates, as represented by the following formula (2), converted current (A) obtained by dividing the sum of current (I) applied to an electroplated cell during the plating time (t.sub.p, sec) by the regeneration time (t.sub.r, sec) for reduction of the ferric ions in an electrolyte.

[00001]$I_{\mathrm{conv}}=\frac{?{\mathrm{Idt}}_p}{?{\mathrm{dt}}_r}$

A plating apparatus includes a processing bath configured to store a processing liquid therein, a transporter configured to immerse a substrate holder, holding a substrate, in the processing liquid, raise the substrate holder out of the processing bath, and transport the substrate holder in a horizontal direction, and a gas flow generator configured to generate a clean gas flow forward of the substrate with respect to a direction in which the substrate holder is transported. The transporter moves the gas flow generator together with the substrate holder in the horizontal direction while transporting the substrate holder in the horizontal direction.

A plating apparatus includes a processing bath configured to store a processing liquid therein, a transporter configured to immerse a substrate holder, holding a substrate, in the processing liquid, raise the substrate holder out of the processing bath, and transport the substrate holder in a horizontal direction, and a gas flow generator configured to generate a clean gas flow forward of the substrate with respect to a direction in which the substrate holder is transported. The transporter moves the gas flow generator together with the substrate holder in the horizontal direction while transporting the substrate holder in the horizontal direction.

In one example, an electroplating system comprising a bath reservoir having a first inlet for feeding fresh electrolyte solution into the bath reservoir and a first outlet for bleeding used electrolyte solution out of the bath reservoir, a second inlet for receiving recycled electrolyte solution into the bath reservoir, and a second outlet for discharge0 of electrolyte solution from the bath reservoir. A plating cell is providing for electroplating an object, the plating cell has an inlet in direct or indirect fluid communication with the bath reservoir, and an outlet for discharge of electrolyte solution from the plating cell. An extraction column extracts by-products generated by the plating cell and has an inlet in direct or indirect fluid communication with the outlet of the plating cell, and an outlet for discharge of electrolyte solution from the extraction column. A first particle filter is disposed in a fluid pathway between the second outlet of the bath reservoir and the inlet of the plating cell, and a second particle filter is disposed in a fluid pathway between the outlet of the extraction column and the second inlet of the bath reservoir.

In one example, an electroplating system comprising a bath reservoir having a first inlet for feeding fresh electrolyte solution into the bath reservoir and a first outlet for bleeding used electrolyte solution out of the bath reservoir, a second inlet for receiving recycled electrolyte solution into the bath reservoir, and a second outlet for discharge0 of electrolyte solution from the bath reservoir. A plating cell is providing for electroplating an object, the plating cell has an inlet in direct or indirect fluid communication with the bath reservoir, and an outlet for discharge of electrolyte solution from the plating cell. An extraction column extracts by-products generated by the plating cell and has an inlet in direct or indirect fluid communication with the outlet of the plating cell, and an outlet for discharge of electrolyte solution from the extraction column. A first particle filter is disposed in a fluid pathway between the second outlet of the bath reservoir and the inlet of the plating cell, and a second particle filter is disposed in a fluid pathway between the outlet of the extraction column and the second inlet of the bath reservoir.

A device for performing anodizing treatment on a part, the device including a treatment chamber including a part for anodizing together with a counter-electrode situated facing the part to be treated, the part to be treated constituting a first wall of the treatment chamber; a generator, a first terminal of the generator being electrically connected to the part to be treated and a second terminal of the generator being electrically connected to the counter-electrode; and a system for storing and circulating an electrolyte, the system including a storage vessel, different from the treatment chamber, for containing the electrolyte; and a circuit for circulating the electrolyte in order to enable the electrolyte to flow between the storage vessel and the treatment chamber.

A device for performing anodizing treatment on a part, the device including a treatment chamber including a part for anodizing together with a counter-electrode situated facing the part to be treated, the part to be treated constituting a first wall of the treatment chamber; a generator, a first terminal of the generator being electrically connected to the part to be treated and a second terminal of the generator being electrically connected to the counter-electrode; and a system for storing and circulating an electrolyte, the system including a storage vessel, different from the treatment chamber, for containing the electrolyte; and a circuit for circulating the electrolyte in order to enable the electrolyte to flow between the storage vessel and the treatment chamber.

A plating apparatus includes a processing bath configured to store a processing liquid therein, a transporter configured to immerse a substrate holder, holding a substrate, in the processing liquid, raise the substrate holder out of the processing bath, and transport the substrate holder in a horizontal direction, and a gas flow generator configured to generate a clean gas flow forward of the substrate with respect to a direction in which the substrate holder is transported. The transporter moves the gas flow generator together with the substrate holder in the horizontal direction while transporting the substrate holder in the horizontal direction.