A plating product fabrication method includes forming a first concentrate. The concentrate includes a Tin (Sn) species and a trace amount of Polonium (Po) species. The plating product fabrication method also includes creating a circuit between a filtering anode and a filtering cathode and reducing the Po species from the concentrate by plating Po upon the filtering cathode. In this manner, a purified Sn concentrate is formed. The purified Sn concentrate may be utilized to plate Sn upon a plating cathode. The purified Sn concentrate may be utilized to form purified Sn.

An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of SnAg alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.

A chemical bath system includes a reactor tank configured to store a chemical bath solution including at least one organic element, and an organics removing chamber assembly. The organics removing chamber assembly includes at least one sub-chamber that delivers the chemical bath solution from a high-pressure section of a bath circuit to a low-pressure section. The organics removing chamber assembly modifies an amount of the at least one organic element as the chemical bath solution flows therethrough. The chemical bath system further includes an analysis/dosing controller. The analysis/dosing controller outputs a control signal that controls the organics removing chamber assembly to modify the amount of the at least one organic element in the chemical bath solution based on a comparison between an actual amount of the at least one organic element in the chemical bath solution and a desired amount of the at least one organic element.

A semiconductor manufacturing apparatus including: a first device; one or more sensors; a first calculation circuit that calculates one or more feature quantities of the first device from the detected physical quantities; and a failure prediction circuit that compares the one or more feature quantities with a plurality of pieces of model data of a temporal change in one or more feature quantities until the first device fails, decides a piece of model data with the minimum difference from the calculated one or more feature quantities among the plurality of pieces of model data, calculates predicted failure time from a difference between a failure point in time and a point in time at which a difference from the calculated one or more feature quantities is the minimum in the piece of model data.

There is provided a method of supplying an indium ion to a plating solution for electrolytic plating using an insoluble anode. The method includes a step of preparing an acidic plating solution and a step of immersing indium metal in the plating solution and dissolving the indium metal in the plating solution without voltage application to the indium metal.

This application relates to a filtering mechanism and a device for producing a conductive material, where the filtering mechanism includes a filtering body, a cover, and a supporting member. The filtering body includes an accommodating cavity for accommodating an electroplating material and an opening provided on the filtering body; the cover is configured to cover the opening and connect to the filtering body to enclose the electroplating material in the filtering body; and the supporting member is provided on the cover to enhance connection strength between the cover and the filtering body.

This application relates to a filtering mechanism and a device for producing a conductive material, where the filtering mechanism includes a filtering body, a cover, and a supporting member. The filtering body includes an accommodating cavity for accommodating an electroplating material and an opening provided on the filtering body; the cover is configured to cover the opening and connect to the filtering body to enclose the electroplating material in the filtering body; and the supporting member is provided on the cover to enhance connection strength between the cover and the filtering body.

The treatment system provides a feature that may reduce cost of the electrochemical plating process by reusing the virgin makeup solution in the spent electrochemical plating bath. The treatment system provides a rotating filter shaft which receives the spent electrochemical plating bath and captures the additives and by-products created by the additives during the electrochemical plating process. To capture the additives and the by-products, the rotating filter shaft includes one or more types of membranes. Materials such as semi-permeable membrane are used to capture the used additives and by-products in the spent electrochemical plating bath. The treatment system may be equipped with an electrochemical sensor to monitor a level of additives in the filtered electrochemical plating bath.

The treatment system provides a feature that may reduce cost of the electrochemical plating process by reusing the virgin makeup solution in the spent electrochemical plating bath. The treatment system provides a rotating filter shaft which receives the spent electrochemical plating bath and captures the additives and by-products created by the additives during the electrochemical plating process. To capture the additives and the by-products, the rotating filter shaft includes one or more types of membranes. Materials such as semi-permeable membrane are used to capture the used additives and by-products in the spent electrochemical plating bath. The treatment system may be equipped with an electrochemical sensor to monitor a level of additives in the filtered electrochemical plating bath.

What is provided is stannous oxide having an ?-ray emission amount of 0.002 cph/cm.sup.2 or less after heating in an atmosphere at 100? C. for 6 hours. Tin containing lead as an impurity is dissolved in a sulfuric acid aqueous solution to prepare a tin sulfate aqueous solution, and lead sulfate is precipitated in the aqueous solution and removed. While stirring the tin sulfate aqueous solution from which lead sulfate has been removed, a lead nitrate aqueous solution containing lead having an ?-ray emission amount of 10 cph/cm.sup.2 or less is added to cause lead sulfate to be precipitated in the tin sulfate aqueous solution, and simultaneously the tin sulfate aqueous solution is circulated while removing the lead sulfate from the aqueous solution. A neutralizing agent is added to the tin sulfate aqueous solution to collect stannous oxide.