A method for removing rare earth impurities from a nickel-electroplating solution by keeping a nickel-electroplating solution containing rare earth impurities and having pH of 4.0-5.1 at 60° C. or higher for a certain period of time, and then removing precipitate generated by the heating from the nickel-electroplating solution by sedimentation and/or filtration.

A method for removing rare earth impurities from a nickel-electroplating solution by keeping a nickel-electroplating solution containing rare earth impurities and having pH of 4.0-5.1 at 60° C. or higher for a certain period of time, and then removing precipitate generated by the heating from the nickel-electroplating solution by sedimentation and/or filtration.

A method comprising incorporating indium into an entire Sn film for preventing the growth of whiskers from the Sn film, wherein the Sn film is applied to a metallic substrate.

A plating membrane includes a support structure extending radially outward from a nozzle that is to direct a flow of a plating solution toward a wafer. The plating membrane also includes a frame, supported by the support structure, having an inner wall that is angled outward from the nozzle. The outward angle of the inner wall relative to the nozzle directs a flow of plating solution from the nozzle in a manner that increases uniformity of the flow of the plating solution toward the wafer, reduces the amount of plating solution that is redirected inward toward the center of the plating membrane, reduces plating material voids in trenches of the wafer (e.g., high aspect ratio trenches), and/or the like.

The treatment system provides a feature that may reduce cost of the electrochemical plating process by reusing the virgin makeup solution in the spent electrochemical plating bath. The treatment system provides a rotating filter shaft which receives the spent electrochemical plating bath and captures the additives and by-products created by the additives during the electrochemical plating process. To capture the additives and the by-products, the rotating filter shaft includes one or more types of membranes. Materials such as semi-permeable membrane are used to capture the used additives and by-products in the spent electrochemical plating bath. The treatment system may be equipped with an electrochemical sensor to monitor a level of additives in the filtered electrochemical plating bath.

The treatment system provides a feature that may reduce cost of the electrochemical plating process by reusing the virgin makeup solution in the spent electrochemical plating bath. The treatment system provides a rotating filter shaft which receives the spent electrochemical plating bath and captures the additives and by-products created by the additives during the electrochemical plating process. To capture the additives and the by-products, the rotating filter shaft includes one or more types of membranes. Materials such as semi-permeable membrane are used to capture the used additives and by-products in the spent electrochemical plating bath. The treatment system may be equipped with an electrochemical sensor to monitor a level of additives in the filtered electrochemical plating bath.

In any overhead job, operators will feel more relaxed and safer. In any systems, the operators won't have to spend days for masking and sealing. Simple protection will be enough. With this unit operators can use toxic solutions like cadmium and silver without any health concern, because the anode returns the toxic vapors back to the chamber and filtered suction line in front of the exhaust valve will take the toxic vapor away. Pit filling anode save the workers time and effort drastically by filling the pits bottom up in one shot.

In any overhead job, operators will feel more relaxed and safer. In any systems, the operators won't have to spend days for masking and sealing. Simple protection will be enough. With this unit operators can use toxic solutions like cadmium and silver without any health concern, because the anode returns the toxic vapors back to the chamber and filtered suction line in front of the exhaust valve will take the toxic vapor away. Pit filling anode save the workers time and effort drastically by filling the pits bottom up in one shot.

Embodiments of the present application provide an electroplating method and an electroplating apparatus. The electroplating method includes: before putting wafers into an electroplating solution to undergo an electroplating process, adding particles into the electroplating solution, and applying ultrasonic waves to the electroplating solution, so as to remove bubbles in the electroplating solution by oscillation; removing the particles in the electroplating solution; and putting the wafers into the electroplating solution to undergo the electroplating process.

Embodiments of the present application provide an electroplating method and an electroplating apparatus. The electroplating method includes: before putting wafers into an electroplating solution to undergo an electroplating process, adding particles into the electroplating solution, and applying ultrasonic waves to the electroplating solution, so as to remove bubbles in the electroplating solution by oscillation; removing the particles in the electroplating solution; and putting the wafers into the electroplating solution to undergo the electroplating process.