Electroplating apparatus includes an electroplating tank that stores an electrolyte solution in which at least objects to be electroplated and magnetic media sink, and at least one magnetic rotator rotatably arranged under the electroplating tank so as to generate an alternating magnetic field. The magnetic rotator is arranged to section an internal space of the electroplating tank into a first space occupying a space above the magnetic rotator and a second space occupying a remaining space other than the first space. The magnetic rotator is arranged to be movable in a lateral direction intersecting a rotational axis of the magnetic rotator, allowing the objects to be shifted between a condition of being present in the electrolyte solution and in the first space and a condition of being present in the electrolyte solution and in the second space.

Electroplating apparatus includes an electroplating tank that stores an electrolyte solution in which at least objects to be electroplated and magnetic media sink, and at least one magnetic rotator rotatably arranged under the electroplating tank so as to generate an alternating magnetic field. The magnetic rotator is arranged to section an internal space of the electroplating tank into a first space occupying a space above the magnetic rotator and a second space occupying a remaining space other than the first space. The magnetic rotator is arranged to be movable in a lateral direction intersecting a rotational axis of the magnetic rotator, allowing the objects to be shifted between a condition of being present in the electrolyte solution and in the first space and a condition of being present in the electrolyte solution and in the second space.

A method of plating a metal layer on a work piece includes exposing a surface of the work piece to a plating solution, and supplying a first voltage at a negative end of a power supply source to an edge portion of the work piece. A second voltage is supplied to an inner portion of the work piece, wherein the inner portion is closer to a center of the work piece than the edge portion. A positive end of the power supply source is connected to a metal plate, wherein the metal plate and the work piece are spaced apart from each other by, and are in contact with, the plating solution.

A method of plating a metal layer on a work piece includes exposing a surface of the work piece to a plating solution, and supplying a first voltage at a negative end of a power supply source to an edge portion of the work piece. A second voltage is supplied to an inner portion of the work piece, wherein the inner portion is closer to a center of the work piece than the edge portion. A positive end of the power supply source is connected to a metal plate, wherein the metal plate and the work piece are spaced apart from each other by, and are in contact with, the plating solution.

Provided is a method for forming a metal film using a solid-state electrolyte membrane, and the method allows a metal film having a smooth surface to be formed and an additive to sufficiently serve its function. A method for forming a metal film includes the successive steps of (a) supplying a solution to a solution-housing space, the solution containing ions of the metal and an additive; (b) increasing a pressure of the solution in the solution-housing space in a state where the solution-housing space is uncommunicated with a solution tank and the substrate held by a holder is in contact with the solid-state electrolyte membrane; (c) decreasing the pressure of the solution in the solution-housing space; and (d) forming the film of the metal on the substrate by applying a voltage between an anode and the substrate while the solution is circulated between the solution-housing space and the solution tank.

Provided is a method for forming a metal film using a solid-state electrolyte membrane, and the method allows a metal film having a smooth surface to be formed and an additive to sufficiently serve its function. A method for forming a metal film includes the successive steps of (a) supplying a solution to a solution-housing space, the solution containing ions of the metal and an additive; (b) increasing a pressure of the solution in the solution-housing space in a state where the solution-housing space is uncommunicated with a solution tank and the substrate held by a holder is in contact with the solid-state electrolyte membrane; (c) decreasing the pressure of the solution in the solution-housing space; and (d) forming the film of the metal on the substrate by applying a voltage between an anode and the substrate while the solution is circulated between the solution-housing space and the solution tank.

Provided is an apparatus for electro-forming. The apparatus for electro-forming includes a plating bath which is a space where a substrate is plated and a clamp disposed within the plating bath and configured to grasp the substrate disposed in a horizontal direction. The apparatus for electro-forming further includes an assembly including an anode spaced above the substrate and connected to an external power supply and a plating solution supply unit spaced above the substrate and configured to supply a plating solution. The apparatus for electro-forming also includes a driving unit configured to reciprocate the assembly in a horizontal direction at a distance from the substrate. The assembly further includes an insulator between the anode and the plating solution supply unit.

Provided is a plating apparatus and a plating solution agitating method that can agitate a plating solution without using a paddle.

A plating apparatus 1000 includes a holder cover 50 disposed in a substrate holder 30 and configured to rotate with the substrate holder when the substrate holder rotates. The holder cover is configured to have a lower surface immersed in the plating solution with the lower surface positioned below a surface to be plated of a substrate. The lower surface of the holder cover is provided with at least one cover groove extending in a direction intersecting with a rotation direction of the holder cover.

Provided is a plating apparatus and a plating solution agitating method that can agitate a plating solution without using a paddle.

A plating apparatus 1000 includes a holder cover 50 disposed in a substrate holder 30 and configured to rotate with the substrate holder when the substrate holder rotates. The holder cover is configured to have a lower surface immersed in the plating solution with the lower surface positioned below a surface to be plated of a substrate. The lower surface of the holder cover is provided with at least one cover groove extending in a direction intersecting with a rotation direction of the holder cover.

Provided is a technique that allows ensuring a downsized plating apparatus.

A plating apparatus includes a discharge module 50. The discharge module includes a module main body 51 including a plurality of nozzles 52 configured to discharge a process liquid upward, and a moving mechanism 60 including a rotation shaft 61 disposed at a side of a plating tank and connected to the module main body. The moving mechanism 60 moves the module main body by rotation of the rotation shaft. The moving mechanism moves the module main body between the first position and the second position. The plurality of nozzles are arranged such that the process liquid discharged from the plurality of nozzles is brought in contact with a lower surface of a substrate from a center portion to an outer peripheral edge portion when the module main body moves to the second position. The module main body further includes a recovery member configured to recover the process liquid dropped after being discharged from the plurality of nozzles and brought in contact with the lower surface of the substrate.