Provided is a plating apparatus for plating a substrate by using a substrate holder including an elastic projection that seals a to-be-plated surface of the substrate, the plating apparatus comprising a measurement device configured to measure a deformed state of the elastic projection by measuring at least either one of a compression amount of the elastic projection and load applied to the elastic projection at a time when the substrate physically contacts the elastic projection of the substrate holder; and a controlling device configured to make a judgment on the basis of the measured deformed state as to whether sealing by the elastic projection is normal.

Provided is a plating apparatus for plating a substrate by using a substrate holder including an elastic projection that seals a to-be-plated surface of the substrate, the plating apparatus comprising a measurement device configured to measure a deformed state of the elastic projection by measuring at least either one of a compression amount of the elastic projection and load applied to the elastic projection at a time when the substrate physically contacts the elastic projection of the substrate holder; and a controlling device configured to make a judgment on the basis of the measured deformed state as to whether sealing by the elastic projection is normal.

This electrolytic solution contains magnesium chloride, lithium chloride, and an aprotic solvent. In the electrolytic solution, the concentration at which the total of magnesium chloride and lithium chloride are dissolved with respect to 1 mol of an aprotic solvent is 0.09 mol or more. In addition, in the electrolytic solution, the concentration at which magnesium chloride is dissolved with respect to 1 mol of the aprotic solvent is 0.045 mol or more.

This electrolytic solution contains magnesium chloride, lithium chloride, and an aprotic solvent. In the electrolytic solution, the concentration at which the total of magnesium chloride and lithium chloride are dissolved with respect to 1 mol of an aprotic solvent is 0.09 mol or more. In addition, in the electrolytic solution, the concentration at which magnesium chloride is dissolved with respect to 1 mol of the aprotic solvent is 0.045 mol or more.

Provided is a surface-treated steel sheet with a compound layer containing F and composed essentially or Zr at least on one surface thereof, wherein the Zr amount is 80 to 350 mg/m.sup.2 and the F amount is 0.5 to 10 mg/m.sup.2 within the layer, and an organic resin coated metal container manufactured using the surface-treated steel sheet. The surface-treated steel sheet of the present invention is manufactured through forming a layer having the Zr amount of 80 to 350 mg/m.sup.2 at least on one surface of a steel sheet by cathode electrolytic treatment in an aqueous solution containing a Zr ion and F ion, and subsequently adjusting the surface to control the F amount to 0.5 to 10 mg/m.sup.2 by one or more treatments selected from immersion and spraying with an ion-containing aqueous solution and cathode electrolytic treatment in the ion-containing aqueous solution.

Provided is a surface-treated steel sheet with a compound layer containing F and composed essentially or Zr at least on one surface thereof, wherein the Zr amount is 80 to 350 mg/m.sup.2 and the F amount is 0.5 to 10 mg/m.sup.2 within the layer, and an organic resin coated metal container manufactured using the surface-treated steel sheet. The surface-treated steel sheet of the present invention is manufactured through forming a layer having the Zr amount of 80 to 350 mg/m.sup.2 at least on one surface of a steel sheet by cathode electrolytic treatment in an aqueous solution containing a Zr ion and F ion, and subsequently adjusting the surface to control the F amount to 0.5 to 10 mg/m.sup.2 by one or more treatments selected from immersion and spraying with an ion-containing aqueous solution and cathode electrolytic treatment in the ion-containing aqueous solution.

Described herein are electrochemical-additive manufacturing methods and systems using such methods. A method comprises depositing a material onto a deposition electrode by flowing a current between that deposition electrode and each of multiple individually-addressable electrodes, forming an electrode array. These currents are independently controlled based on a target map and using deposition control circuits, each coupled to one individually-addressable electrode. The target map is generated by a system controller based on various characteristics of the system (e.g., the performance of each deposition control circuit and/or individually-addressable electrode, electrolyte composition) and the desired characteristics of the deposited material (e.g., deposition location, uniformity, morphology). Furthermore, when the deposition electrode and the electrode array move relative to each other, the system controller dynamically updates the target map based on their relative positions. This movement can provide a fresh electrolyte between the electrodes and enable deposition at new locations.

A system for controlling the operation of apparatus for electroplating semiconductor substrates includes operating in a high mode of operation in which an off-the-shelf power supply provides current or voltage that is directly used to produce the channel control signal and in a low mode of operation in which the off-the-shelf power supply biases a circuit that provides a current or voltage to produce the channel control signal.

A system for controlling the operation of apparatus for electroplating semiconductor substrates includes operating in a high mode of operation in which an off-the-shelf power supply provides current or voltage that is directly used to produce the channel control signal and in a low mode of operation in which the off-the-shelf power supply biases a circuit that provides a current or voltage to produce the channel control signal.

There is provided a plating apparatus capable of suitably measuring a micro-throwing power. A first plating apparatus (1A) includes: a first anode (12A) disposed in a first plating bathtub (11A); an insulating substrate (4) having a hole (5) and disposed in the first plating bathtub (11A); a pair of first cathodes (13AX, 13AY), each cathode being provided in the insulating substrate (4) at a bottom portion of the hole (5) and at a surface on an opening side of the hole (5); a first plating power source (14A) configured to supply an electric current between the first anode (12) and the pair of first cathodes (13AX, 13AY); and a first electric current measuring circuit (22A) configured to measure respective values of electric currents flowing through the pair of first cathodes (13AX, 13AY).