Provided is a technique for appropriately handling a substrate holder depending on a use state of the substrate holder. The substrate holder for holding a substrate that is a plating target in a plating apparatus is suggested. The substrate holder includes an RFID tag, and the RFID tag includes a storage region in which a use attribute is stored, the use attribute including an attribute indicating a state of being used for plating processing.

Methods and apparatus for detecting the presence or absence of unwanted metal deposits on a substrate holder of an electroplating apparatus are described herein. In various embodiments, a plating sensor is used to detect unwanted metal deposits. The plating sensor may be mounted relatively far away from the area that it measures (e.g., the sensor target area). For instance, the plating sensor may be on one side of the electroplating apparatus (in some cases mounted on a drip shield), and the sensor target area may be on the opposite side of the electroplating apparatus. In this way, the plating sensor can measure across the electroplating apparatus. This placement provides a relatively deep depth of focus for the plating sensor, and provides some physical separation between the plating sensor and the electroplating chemistry. Both of these factors lead to more reliable detection results.

Methods and apparatus for detecting the presence or absence of unwanted metal deposits on a substrate holder of an electroplating apparatus are described herein. In various embodiments, a plating sensor is used to detect unwanted metal deposits. The plating sensor may be mounted relatively far away from the area that it measures (e.g., the sensor target area). For instance, the plating sensor may be on one side of the electroplating apparatus (in some cases mounted on a drip shield), and the sensor target area may be on the opposite side of the electroplating apparatus. In this way, the plating sensor can measure across the electroplating apparatus. This placement provides a relatively deep depth of focus for the plating sensor, and provides some physical separation between the plating sensor and the electroplating chemistry. Both of these factors lead to more reliable detection results.

An electroplating anode assembly includes primarily a bracket on which plural anode elements are disposed, with which anode element controlling the on or off of the circuit, respectively. The electroplating anode assembly enables a variety of distribution of the electric lines of force to be formed in an electroplating bath through energizing one or any number of anode elements. In particular, when the shape of the product to be electroplated or the configuration that the product is suspended and disposed is changed, the corresponding distribution of the electric lines of force can be formed only through a simple way of switching an electric current supplying loop, so as to secure the quality of electroplating of the product using a more aggressive and reliable means.

An electroplating system includes an electroplating bath in which a cathode end and at least an anode end are configured. The anode end is provided with plural anode elements which are insulative from one another, as well as plural conductive elements which are connected electrically with each anode element, respectively. The electroplating system enables a variety of distribution of the electric lines of force to be formed in the electroplating bath through energizing one or any number of anode elements. In particular, good benefits can be achieved by a more aggressive and reliable means, without a need for changing the original anode end equipment.

An electroplating system includes an electroplating bath in which a cathode end and at least an anode end are configured. The anode end is provided with plural anode elements which are insulative from one another, as well as plural conductive elements which are connected electrically with each anode element, respectively. The electroplating system enables a variety of distribution of the electric lines of force to be formed in the electroplating bath through energizing one or any number of anode elements. In particular, good benefits can be achieved by a more aggressive and reliable means, without a need for changing the original anode end equipment.

The presently claimed invention provides an electrochemical analytical apparatus for electrochemical bath analysis. The apparatus comprise a static electrode and a rotatable unit. As steady liquid flow can be generated on the electrolytic surface of the static electrode by the rotatable unit through rotation, the static disk electrode does not involve any movement during the bath analysis such that the design of the electrical contact in the electrode can be substantially simplified.

The presently claimed invention provides an electrochemical analytical apparatus for electrochemical bath analysis. The apparatus comprise a static electrode and a rotatable unit. As steady liquid flow can be generated on the electrolytic surface of the static electrode by the rotatable unit through rotation, the static disk electrode does not involve any movement during the bath analysis such that the design of the electrical contact in the electrode can be substantially simplified.

A sample collection device includes two substrates and a spacer. The two substrates are disposed oppositely. Each substrate has a first surface, a second surface opposing to the first surface, a first recess and at least one second recess. The two substrates are arranged with the first surfaces facing each other, and the first and second recesses are respectively located on each first surface. The first recesses of the substrates jointly form a first channel, and the second recesses of the substrates jointly form a second channel connected to the outside of the sample collection device. The first channel and the second channel are interconnected. The spacer is disposed between the two first surfaces for bonding and fixing the two substrates. A sample containing space is formed between the two substrates and the spacer. The sample containing space includes the first chancel and the second channel. In addition, a manufacturing method of the sample collection device is also provided.

A substrate entire region treatment process of discharging a processing fluid of a temperature different from a surface temperature of a substrate 3 from a first nozzle 24 toward the substrate is performed while moving the first nozzle toward an outer side from an entire region treatment start position P2 located at a central portion to an entire region treatment end position P5 located at a peripheral portion. Then, after moving the first nozzle toward an inner side to a peripheral region treatment start position P6 located at an outer position than the entire region treatment start position P2, a substrate peripheral region treatment process of discharging the processing fluid from the first nozzle toward the substrate is performed while moving the first nozzle toward the outer side from the peripheral region treatment start position P6 to a peripheral region treatment stop position P7 located at a peripheral portion.