A system is configured for machining a workpiece (100), the workpiece includes an interior surface (110) that defines an internal passage (112). The system includes an electrode (116) located within the internal passage and electrically isolated from the workpiece, an electrolyte supply, a power supply, and a remover. The electrolyte supply is configured for circulating an electrolyte in a gap between the electrode and the workpiece. The power supply is configured for applying a voltage between the electrode and the workpiece to facilitate smoothing the interior surface. The remover is configured for completely removing the electrode from within the internal passage after smoothing the interior surface.

A method for surface treatment of a metal substrate, suitable for use as electrode support in electrochemical processes by: (a) immersion of the metal substrate and of at least one counter electrode in an electrolyte selected from hydrochloric acid, nitric acid, boric acid or sulfuric acid at a weight concentration of between 10-40%; (b) application of an anodic current density to the metal substrate of between 0.1 and 30 A/dm.sup.2 for a time of between 0.5 and 120 minutes. An electrode for gas evolution in electrochemical processes obtained from a correspondingly treated substrate.

A processing device based on electrochemistry includes a platform, a power supply and at least one modeling mechanism which is arranged under the platform and movable with respect to the platform. The modeling mechanism includes a photoelectric wheel, a light source and a container in which an ionic liquid is stored. The photoelectric wheel is rotatable and partially immersed in the ionic liquid. The photoelectric wheel includes a transparent conductive layer and a photoconductive layer bound together from inside to outside. The transparent conductive layer is electrically connected to an electrode of the power supply, and the platform is electrically connected to the other electrode of the power supply. The light source is arranged inside the photoelectric wheel and emits a light beam to pass through the transparent conductive layer towards the platform to selectively irradiate the photoconductive layer.

Efficient electrochemical reactions can be achieved using a two-electrode system embedded within a silicone hydrogel by using a one-step linear sweep-hold method. A voltage value is initially set to be a voltage that corresponds to a peak current (Vp). An amperometric process is performed at the voltage value. During the amperometric process, the voltage value is corrected as a current shifts.

Efficient electrochemical reactions can be achieved using a two-electrode system embedded within a silicone hydrogel by using a one-step linear sweep-hold method. A voltage value is initially set to be a voltage that corresponds to a peak current (Vp). An amperometric process is performed at the voltage value. During the amperometric process, the voltage value is corrected as a current shifts.

A method to treat the copper surface to manufacture the metallic assembly with the polymer and copper to have excellent bonding strength is disclosed. The present method is for treating the surface of copper for the bonded coupling of the mixture of polymer and copper by providing a method to treat the surface of copper, with (a) an etching step with electric etching of the surface of copper, (b) the first anodizing stage to anodize the surface of copper, and (c) the second anodizing stage to anodize the above is firstly anodized, after an ultrasonic treatment of the secondly anodized copper, the copper is oxidized again.

A method to treat the copper surface to manufacture the metallic assembly with the polymer and copper to have excellent bonding strength is disclosed. The present method is for treating the surface of copper for the bonded coupling of the mixture of polymer and copper by providing a method to treat the surface of copper, with (a) an etching step with electric etching of the surface of copper, (b) the first anodizing stage to anodize the surface of copper, and (c) the second anodizing stage to anodize the above is firstly anodized, after an ultrasonic treatment of the secondly anodized copper, the copper is oxidized again.

Systems and methods for electroless plating a first metal onto a second metal in a molten salt bath including: a bath vessel holding a dry salt mixture including a dry salt medium and a dry salt medium of the first metal, and without the reductant therein, the dry salt mixture configured to be heated to form a molten salt bath; and the second metal is configured to be disposed in the molten salt bath and receive a pure coating of the first metal thereon by electroless plating in the molten salt bath, wherein the second metal is more electronegative than the first metal.

A capacitor has an anode with one or more active layers that each includes fused particles positioned on a current collector. The current collector includes tunnels that extend from a first face of the current collector to a second face of the current collector.

A capacitor has an anode with one or more active layers that each includes fused particles positioned on a current collector. The current collector includes tunnels that extend from a first face of the current collector to a second face of the current collector.