C25F3/16

Dental and medical instruments comprising titanium

Endodontic instruments for use in performing root canal therapy on a tooth are disclosed. In one form, the instruments include an elongate shank having a cutting edge extending from a distal end of the shank along an axial length of the shank. The shank comprises a titanium alloy, and the shank is prepared by heat-treating the shank at a temperature above 25° C. in an atmosphere consisting essentially of a gas unreactive with the shank. In another form, the endodontic instruments have an elongate shank having a cutting edge extending from a distal end of the shank along an axial length of the shank. The shank consists essentially of a titanium alloy selected from alpha-titanium alloys, beta-titanium alloys, and alpha-beta-titanium alloys. The instruments solve the problems encountered when cleaning and enlarging a curved root canal.

Dental and medical instruments comprising titanium

Endodontic instruments for use in performing root canal therapy on a tooth are disclosed. In one form, the instruments include an elongate shank having a cutting edge extending from a distal end of the shank along an axial length of the shank. The shank comprises a titanium alloy, and the shank is prepared by heat-treating the shank at a temperature above 25° C. in an atmosphere consisting essentially of a gas unreactive with the shank. In another form, the endodontic instruments have an elongate shank having a cutting edge extending from a distal end of the shank along an axial length of the shank. The shank consists essentially of a titanium alloy selected from alpha-titanium alloys, beta-titanium alloys, and alpha-beta-titanium alloys. The instruments solve the problems encountered when cleaning and enlarging a curved root canal.

DEVICE FOR BURNISHING AND SMOOTHING METAL PARTS

The invention relates to a device for burnishing and smoothing metal parts, particularly suitable for use in mechanical-galvanic processes, comprising a main body (3) having a securing disc (6) to which guides (7) are radially coupled and the body of which includes at least three mobile drive systems (5) which are actuated by electromechanical means and move in a synchronised concentric manner, approaching and moving away from the central point and acting on a rotating structure (41) from equidistant angles, said structure being centrally located and coupled in a detachable head (4) that is coupled centrally relative to, and above, a cylindrical tank (2). The drivers (5), provided with brushes (51), move from an open position in which they remain separate from one another and at a distance from the centre, into a closed position in which they are joined to one another in the centre of the tank (2), coming into contact with the structure (41) containing the parts to be treated. The structure (41), coupled to a casing (8), consists of a vertical rod provided with securing means (42) for the parts to be treated.

DEVICE FOR BURNISHING AND SMOOTHING METAL PARTS

The invention relates to a device for burnishing and smoothing metal parts, particularly suitable for use in mechanical-galvanic processes, comprising a main body (3) having a securing disc (6) to which guides (7) are radially coupled and the body of which includes at least three mobile drive systems (5) which are actuated by electromechanical means and move in a synchronised concentric manner, approaching and moving away from the central point and acting on a rotating structure (41) from equidistant angles, said structure being centrally located and coupled in a detachable head (4) that is coupled centrally relative to, and above, a cylindrical tank (2). The drivers (5), provided with brushes (51), move from an open position in which they remain separate from one another and at a distance from the centre, into a closed position in which they are joined to one another in the centre of the tank (2), coming into contact with the structure (41) containing the parts to be treated. The structure (41), coupled to a casing (8), consists of a vertical rod provided with securing means (42) for the parts to be treated.

System and method for electropolishing or electroplating conveyor belts

An electropolishing or electroplating system and method for metal conveyor belts is described. In some embodiments, the system has a metal conveyor belt held in constant tension; a tank for holding an electrolytic fluid, the tank having an interior space suitable to contain the fluid, a metal plate and the metal conveyor belt; and an electrical current supply. In an electropolishing application, the current passes from the metal conveyor belt, through the fluid and into the metal plate. In an electroplating application, the current passes from the metal plate, through the fluid and into the metal conveyor belt.

System and method for electropolishing or electroplating conveyor belts

An electropolishing or electroplating system and method for metal conveyor belts is described. In some embodiments, the system has a metal conveyor belt held in constant tension; a tank for holding an electrolytic fluid, the tank having an interior space suitable to contain the fluid, a metal plate and the metal conveyor belt; and an electrical current supply. In an electropolishing application, the current passes from the metal conveyor belt, through the fluid and into the metal plate. In an electroplating application, the current passes from the metal plate, through the fluid and into the metal conveyor belt.

Electroplating methods for semiconductor substrates
09758893 · 2017-09-12 · ·

A non-uniform initial metal film is non-uniformly deplated to provide a more uniform metal film on a substrate. Electrochemical deplating may be performed by placing the substrate in a deplating bath formulated specifically for deplating, rather than for plating. The deplating bath may have a throwing power of 0.3 or less; or a bath conductivity of 1 mS/cm to 250 mS/cm. Reverse electrical current conducted through the deplating bath non-uniformly. electro-etches or deplates the metal film.

Electroplating methods for semiconductor substrates
09758893 · 2017-09-12 · ·

A non-uniform initial metal film is non-uniformly deplated to provide a more uniform metal film on a substrate. Electrochemical deplating may be performed by placing the substrate in a deplating bath formulated specifically for deplating, rather than for plating. The deplating bath may have a throwing power of 0.3 or less; or a bath conductivity of 1 mS/cm to 250 mS/cm. Reverse electrical current conducted through the deplating bath non-uniformly. electro-etches or deplates the metal film.

Blood pump housing component
11364373 · 2022-06-21 · ·

Blood pump assemblies and methods of manufacturing and operating blood pump assemblies are provided. The blood pump assembly includes a pump and an impeller blade rotatably coupled to the pump. The blood pump assembly also includes a pump housing component sized for passage through a body lumen and coupled to the pump. The pump housing component includes a peripheral wall extending about a rotation axis of the impeller blade. The peripheral wall includes an inner peripheral wall surface and an outer peripheral wall surface. The peripheral wall also includes one or more blood exhaust apertures. Each blood exhaust aperture in the one or more blood exhaust apertures is defined by an inner aperture edge and an outer aperture edge. Each inner aperture edge is chamfered between the inner peripheral wall surface and the outer peripheral wall surface.

Blood pump housing component
11364373 · 2022-06-21 · ·

Blood pump assemblies and methods of manufacturing and operating blood pump assemblies are provided. The blood pump assembly includes a pump and an impeller blade rotatably coupled to the pump. The blood pump assembly also includes a pump housing component sized for passage through a body lumen and coupled to the pump. The pump housing component includes a peripheral wall extending about a rotation axis of the impeller blade. The peripheral wall includes an inner peripheral wall surface and an outer peripheral wall surface. The peripheral wall also includes one or more blood exhaust apertures. Each blood exhaust aperture in the one or more blood exhaust apertures is defined by an inner aperture edge and an outer aperture edge. Each inner aperture edge is chamfered between the inner peripheral wall surface and the outer peripheral wall surface.