Provided is a vaporizable source material container having excellent corrosion resistance. The vaporizable source material container for storing and vaporizing a metal halide for thin film deposition S includes: a container main body including a container wall; a lid body provided with a carrier gas inlet and a mixed gas outlet; fastening members for fixing the container main body with the lid body; and joint members, wherein the container wall of the container main body is fabricated of copper with 99 to 99.9999% purity, aluminum with 99 to 99.9999% purity, or titanium with 99 to 99.9999% purity, and the container main body, the lid body, the fastening members and the joint members are each treated by fluorocarbon polymer coating and/or by electrolytic polishing.

Provided is a solid vaporization/supply system of metal halide for thin film deposition that reduces particle contamination. The system includes a vaporizable source material container for storing and vaporizing a metal halide and buffer tank coupled with the vaporizable source material container. The vaporizable source material container includes a container main body with a container wall; a lid body; fastening members; and joint members, wherein the container wall is configured to have a double-wall structure composed of an inner wall member and outer wall member, which allows a carrier gas to be led into the container main body via its space. The container wall is fabricated of 99 to 99.9999% copper, 99 to 99.9996% aluminum, or 99 to 99.9996% titanium, and wherein the container main body, the lid body, the fastening members, and the joint members are treated by fluorocarbon polymer coating and/or by electrolytic polishing.

Methods for electropolishing and coating aluminum on a surface of an air and/or moisture sensitive substrate, including: in a vessel, submerging the substrate in a first molten salt bath and applying an anodizing current to the substrate at a first temperature to electropolish the surface of the substrate; wherein the first molten salt bath includes one of a first organic salt bath and first inorganic salt bath; wherein, when used, the first organic salt bath includes one of (a) aluminum halide and ionic liquid, (b) a combination of an aluminum halide and halogenatedmethylphenylsulfone (C.sub.6(H.sub.5−y,X.sub.y)SO.sub.2CX.sub.3, where y is a number from 0-5), (c) a combination of an aluminum halide, an ionic liquid, and halogenatedmethylphenylsulfone (C.sub.6(H.sub.5−y,X.sub.y)SO.sub.2CX.sub.3), and (d) AlF.sub.3-organofluoride-hydrofluoric acid adduct; wherein, when used, the first inorganic salt bath includes aluminum halide and alkali metal halide; and wherein the anodizing current is 10-30 mA/cm.sup.2.

Methods for electropolishing and coating aluminum on a surface of an air and/or moisture sensitive substrate, including: in a vessel, submerging the substrate in a first molten salt bath and applying an anodizing current to the substrate at a first temperature to electropolish the surface of the substrate; wherein the first molten salt bath includes one of a first organic salt bath and first inorganic salt bath; wherein, when used, the first organic salt bath includes one of (a) aluminum halide and ionic liquid, (b) a combination of an aluminum halide and halogenatedmethylphenylsulfone (C.sub.6(H.sub.5−y,X.sub.y)SO.sub.2CX.sub.3, where y is a number from 0-5), (c) a combination of an aluminum halide, an ionic liquid, and halogenatedmethylphenylsulfone (C.sub.6(H.sub.5−y,X.sub.y)SO.sub.2CX.sub.3), and (d) AlF.sub.3-organofluoride-hydrofluoric acid adduct; wherein, when used, the first inorganic salt bath includes aluminum halide and alkali metal halide; and wherein the anodizing current is 10-30 mA/cm.sup.2.

An electrolyte (EL) for the electrolytic polishing of a metallic substrate includes at least one fluoride compound (F) and/or one chloride compound (Cl), and at least one complexing agent (CA), wherein the electrolyte (EL) does not contain an acid compound that is not a complexing agent. Furthermore, a process for the electrolytic polishing of a metallic substrate wherein the electrolyte (EL) is applied is described.

An electrolyte (EL) for the electrolytic polishing of a metallic substrate includes at least one fluoride compound (F) and/or one chloride compound (Cl), and at least one complexing agent (CA), wherein the electrolyte (EL) does not contain an acid compound that is not a complexing agent. Furthermore, a process for the electrolytic polishing of a metallic substrate wherein the electrolyte (EL) is applied is described.

Systems and processes for treating surfaces of metal components are provided. The systems can include a container for containing a metal workpiece having a surface with a complex external geometry and for containing a solution that has electrolytes at a flow rate that varies according to a local shape of the surface to thereby treat the surface of the metal workpiece; optionally one or more electrodes for creating an electrical field; and optionally a temperature control device configured to provide a predetermined temperature or range of temperatures. The processes can include providing a metal workpiece having a surface with a complex external geometry; and contacting the workpiece in the presence of a predetermined electrical field at a predetermined temperature with a solution containing electrolytes at a flow rate that varies according to a local shape of the surface to thereby treat the surface of the metal workpiece.

Systems and processes for treating surfaces of metal components are provided. The systems can include a container for containing a metal workpiece having a surface with a complex external geometry and for containing a solution that has electrolytes at a flow rate that varies according to a local shape of the surface to thereby treat the surface of the metal workpiece; optionally one or more electrodes for creating an electrical field; and optionally a temperature control device configured to provide a predetermined temperature or range of temperatures. The processes can include providing a metal workpiece having a surface with a complex external geometry; and contacting the workpiece in the presence of a predetermined electrical field at a predetermined temperature with a solution containing electrolytes at a flow rate that varies according to a local shape of the surface to thereby treat the surface of the metal workpiece.

An apparatus and method for smoothing and polishing metals via ion transport by free solid bodies. The method includes connecting a part to be treated to a positive pole (anode) of a current generator and subjecting the part to friction with a set of particles comprising electrically conductive free solid bodies charged with negative electrical charge in a gaseous environment.

An apparatus and method for smoothing and polishing metals via ion transport by free solid bodies. The method includes connecting a part to be treated to a positive pole (anode) of a current generator and subjecting the part to friction with a set of particles comprising electrically conductive free solid bodies charged with negative electrical charge in a gaseous environment.