The present invention concerns a method and device for oxidative erosion or for decontamination of a metallic surface, comprising a step consisting of intermittently polarizing the metallic surface to be eroded or decontaminated, placed in contact with a solution containing manganese VII, at a more anodic electric potential than the corrosion potential of said surface.

The present invention concerns a method and device for oxidative erosion or for decontamination of a metallic surface, comprising a step consisting of intermittently polarizing the metallic surface to be eroded or decontaminated, placed in contact with a solution containing manganese VII, at a more anodic electric potential than the corrosion potential of said surface.

The invention describes a device for electropolishing by means of a conductive surface (1) which contacts a metal part (2) to be polished, with a relative movement being caused between the conductive surface (1) and the metal part (2) to be polished, and wherein the part (2) is connected to the power source (3) and the conductive surface (1) is connected to an electrode (4). The invention also describes a method for electropolishing which comprises: a step of polishing, wherein a conductive surface (1) contacts a metal part (2) to be polished, with a relative movement being caused between both, and wherein the part (2) is connected to the power source (3) and the conductive surface (1) is connected to an electrode (4); and a step of regenerating the conductive surface (1), wherein the conductive surface (1) which has been in contact with the part in the step of polishing is regenerated or replaced.

The invention describes a device for electropolishing by means of a conductive surface (1) which contacts a metal part (2) to be polished, with a relative movement being caused between the conductive surface (1) and the metal part (2) to be polished, and wherein the part (2) is connected to the power source (3) and the conductive surface (1) is connected to an electrode (4). The invention also describes a method for electropolishing which comprises: a step of polishing, wherein a conductive surface (1) contacts a metal part (2) to be polished, with a relative movement being caused between both, and wherein the part (2) is connected to the power source (3) and the conductive surface (1) is connected to an electrode (4); and a step of regenerating the conductive surface (1), wherein the conductive surface (1) which has been in contact with the part in the step of polishing is regenerated or replaced.

This disclosure enables high-productivity fabrication of porous semiconductor layers (made of single layer or multi-layer porous semiconductors such as porous silicon, comprising single porosity or multi-porosity layers). Some applications include fabrication of MEMS separation and sacrificial layers for die detachment and MEMS device fabrication, membrane formation and shallow trench isolation (STI) porous silicon (using porous silicon formation with an optimal porosity and its subsequent oxidation). Further, this disclosure is applicable to the general fields of photovoltaics, MEMS, including sensors and actuators, stand-alone, or integrated with integrated semiconductor microelectronics, semiconductor microelectronics chips and optoelectronics.

A wing electrode is configured by disposing at least a wing in a circumferential direction at equal intervals, the wing having a specific width in an axial direction of the electrode shaft and a tip in a shape corresponding to an inner surface of the hollow tube. A housing tube is arranged concentrically to the electrode shaft and to house the wing electrode by winding the respective wings around the electrode shaft. A slit of the housing tube is arranged in the axial direction so as to correspond to each wing. A diameter adjustment unit is operable to expand and contract each wing in the radial direction by rotating the electrode shaft and the housing tube relatively after inserting each wing into the slit of the housing tube. As a matter of course, the electrolyte is filled in the hollow tube at any time before the electrolytic treatment.

A wing electrode is configured by disposing at least a wing in a circumferential direction at equal intervals, the wing having a specific width in an axial direction of the electrode shaft and a tip in a shape corresponding to an inner surface of the hollow tube. A housing tube is arranged concentrically to the electrode shaft and to house the wing electrode by winding the respective wings around the electrode shaft. A slit of the housing tube is arranged in the axial direction so as to correspond to each wing. A diameter adjustment unit is operable to expand and contract each wing in the radial direction by rotating the electrode shaft and the housing tube relatively after inserting each wing into the slit of the housing tube. As a matter of course, the electrolyte is filled in the hollow tube at any time before the electrolytic treatment.

Disclosed is a method and device for recycling an acidic etching waste solution through progressive electrolysis. The method includes: introducing at least one electrolytic cell A, where the electrolytic cell A is divided into an anode chamber and a cathode chamber; during an electrolysis operation, a cathode electrolyte of the electrolytic cell A includes the acidic etching waste solution; and introducing at least one electrolytic cell B, where the electrolytic cell B is divided into an anode chamber and a cathode chamber; the cathode electrolyte of the electrolytic cell B includes a cathode electrolyte undergoing an electrolytic treatment from the electrolytic cell A or a mixed solution of the cathode electrolyte undergoing the electrolytic treatment with the acidic etching waste solution. With the present disclosure, PCB manufacturers can avoid the introduction of new impurities and reduce the electrolysis energy consumption during an electrolytic copper recovery process.

Disclosed is a method and device for recycling an acidic etching waste solution through progressive electrolysis. The method includes: introducing at least one electrolytic cell A, where the electrolytic cell A is divided into an anode chamber and a cathode chamber; during an electrolysis operation, a cathode electrolyte of the electrolytic cell A includes the acidic etching waste solution; and introducing at least one electrolytic cell B, where the electrolytic cell B is divided into an anode chamber and a cathode chamber; the cathode electrolyte of the electrolytic cell B includes a cathode electrolyte undergoing an electrolytic treatment from the electrolytic cell A or a mixed solution of the cathode electrolyte undergoing the electrolytic treatment with the acidic etching waste solution. With the present disclosure, PCB manufacturers can avoid the introduction of new impurities and reduce the electrolysis energy consumption during an electrolytic copper recovery process.

A system has a chamber configured to receive and at least partially enclose at least one gas turbine engine component, at least one component support configured to support the at least one gas turbine engine component, a plurality of tanks configured to store a corresponding plurality of fluids, an electrode disposed at least partially within the chamber, a power source, at least one fluid application device configured to apply a fluid, at least one delivery valve for selectively fluidly coupling the at least one fluid application device to the plurality of tanks, at least one port configured to collect the fluid applied by the at least one fluid application device, and at least one recovery valve for selectively fluidly coupling the at least one port to the plurality of tanks.