An induction furnace assembly comprising a chamber having a mold; a primary inductive coil coupled to the chamber; a layered susceptor comprising at least two layers of magnetic field attenuating material surrounding the chamber between the primary inductive coil and the mold to nullify the electromagnetic field in the hot zone of the furnace chamber.

A compound strontium fluoroborate, nonlinear optical crystal of strontium fluoroborate, preparation method thereof; the chemical formula of the compound is SrB5O7F3, its molecular weight is 310.67, and it is prepared by solid-state reaction; the chemical formula of the crystal is SrB5O7F3, its molecular weight is 310.67, the crystal is of the orthorhombic series, the space group is Ccm21, and the crystal cell parameters are=10.016(6) , b=8.654(6)(4) , c=8.103(5) , Z=4, and V=702.4(8) 3. A SrB5O7F3 nonlinear optical crystal has uses in the preparation of a harmonic light output when doubling, tripling, quadrupling, quintupling, or sextupling the frequency of a 1064-nm fundamental-frequency light outputted by a Nd:YAG laser, or the generation of a deep-ultraviolet frequency doubling light output lower than 200 nm, or in the preparation of a frequency multiplier, upper or lower frequency converter, or an optical parametric oscillator.

A semiconductor wafer forms on a mold containing a dopant. The dopant dopes a melt region adjacent the mold. There, dopant concentration is higher than in the melt bulk. A wafer starts solidifying. Dopant diffuses poorly in solid semiconductor. After a wafer starts solidifying, dopant can not enter the melt. Afterwards, the concentration of dopant in the melt adjacent the wafer surface is less than what was present where the wafer began to form. New wafer regions grow from a melt region whose dopant concentration lessens over time. This establishes a dopant gradient in the wafer, with higher concentration adjacent the mold. The gradient can be tailored. A gradient gives rise to a field that can function as a drift or back surface field. Solar collectors can have open grid conductors and better optical reflectors on the back surface, made possible by the intrinsic back surface field.

A process for directional solidification of a cast part comprises energizing a primary inductive coil coupled to a chamber having a mold containing a material; energizing a primary inductive coil within the chamber to heat the mold via radiation from a susceptor, wherein the resultant electromagnetic field partially leaks through the susceptor coupled to the chamber between the primary inductive coil and the mold; determining a magnetic flux profile of the electromagnetic field; sensing a magnetic flux leakage past the susceptor within the chamber; generating a control field from a secondary compensation coil coupled to the chamber, wherein the control field controls the magnetic flux experienced by the cast part; and casting the material within the mold under the controlled degree of flux leakage.

A method of producing a crystalline material is provided that may include providing a crystal growth apparatus comprising a chamber, a hot zone, and a muffle. The hot zone may be disposed within the chamber and include at least one heating system, at least one heat removal system, and a crucible containing feedstock. Additionally, the method may include providing a muffle that surrounds at least two sides of the crucible to ensure uniform temperature distribution through the feedstock during crystal growth to allow the crystalline material to be grown with a square or rectangular shaped cross section.

A furnace for electromagnetic casting a tubular-shaped silicon ingot is provided. The furnace includes a mold, outer and inner induction coils and a support member. The mold includes an outer crucible and an inner crucible. The outer crucible is annular-shaped. The inner crucible is disposed in the outer crucible and spaced away from the outer crucible to provide a gap between the inner crucible and the outer crucible. The mold is configured to receive granular silicon in the gap. The outer induction coil disposed around the outer crucible. The inner induction coil disposed in the inner crucible. The outer induction coil and the inner induction coil are configured to heat and melt the granular silicon in the mold to form a tubular-shaped silicon ingot. The support member is configured to hold and move a seed relative to the mold during formation of the tubular-shaped silicon ingot on the seed.

A furnace includes a pedestal, a crucible, first and second heaters, and a controller. The crucible is arranged on a pedestal that is movable downwardly and is rotatable. The first and second heaters are spaced vertically along an outer wall of the crucible and are arranged around the crucible to heat pieces of solid material deposited in the crucible. A third heater is arranged above the crucible if the crucible includes a solid cylindrical mold or in a hollow cylindrical space of the crucible if the crucible includes a hollow cylindrical mold. The controller is configured to control the first and second heaters to heat the pieces of the solid material to form a melted liquid. The controller is configured to control the rotational and downward movements of the pedestal relative to the first and second heaters during solidification of the melted liquid to form an ingot.

An induction furnace assembly comprising a chamber having a mold; a primary inductive coil coupled to the chamber; a layered susceptor comprising at least two layers of magnetic field attenuating material surrounding the chamber between the primary inductive coil and the mold to nullify the electromagnetic field in the hot zone of the furnace chamber.

Methods and systems for low etch pit density 6 inch semi-insulating gallium arsenide wafers may include a semi-insulating gallium arsenide single crystal wafer having a diameter of 6 inches or greater without intentional dopants for reducing dislocation density, an etch pit density of less than 1000 cm.sup.2, and a resistivity of 110.sup.7 -cm or more. The wafer may have an optical absorption of less than 5 cm.sup.1 less than 4 cm.sup.1 or less than 3 cm.sup.1 at 940 nm wavelength. The wafer may have a carrier mobility of 3000 cm.sup.2/V-sec or higher. The wafer may have a thickness of 500 m or greater. Electronic devices may be formed on a first surface of the wafer. The wafer may have a carrier concentration of 1.110.sup.7 cm.sup.3 or less.

Methods and systems for low etch pit density gallium arsenide crystals with boron dopant may include a gallium arsenide single crystal wafer having boron as a dopant, an etch pit density of less than 500 cm.sup.2, and optical absorption of 6 cm.sup.1 or less at 940 nm. The wafer may have an etch pit density of less than 200 cm.sup.2. The wafer may have a diameter of 6 inches or greater. The wafer may have a boron concentration between 110.sup.19 cm.sup.3 and 210.sup.19 cm.sup.3. The wafer may have a thickness of 300 m or greater. Optoelectronic devices may be formed on a first surface of the wafer, which may be diced into a plurality of die and optical signals from an optoelectronic device on one side of one of the die may be communicated out a second side of the die opposite to the one side.