Patent classifications
C30B11/14
METHOD OF AUTOMATICALLY MEASURING SEED MELT BACK OF CRYSTALLINE MATERIAL
A method and apparatus for measuring a melt back of a seed in a boule are provided. The method includes lifting a boule once it has been produced using an actuating device onto a support table to automatically manipulate the boule from a furnace to the support table. The melt back of the seed is then automatically measured using a vision system that is installed on an imaging device disposed below the boule.
METHOD OF MAKING A SINGLE-CRYSTAL TURBINE BLADE
A single-crystal turbine blade and a method of making such single-crystal turbine blade are disclosed. During manufacturing, a secondary crystallographic orientation of the material of the single-crystal turbine blade is controlled based on a parameter of a root fillet between an airfoil of the single-crystal turbine blade and a platform of the single-crystal turbine blade. The parameter can be a location of peak stress in the root fillet expected during use of the turbine blade.
SILICON INGOT, SILICON BLOCK, SILICON SUBSTRATE, METHOD FOR MANUFACTURING SILICON INGOT, AND SOLAR CELL
An ingot includes a first surface, a second surface opposite to the first surface, and a third surface positioned along a first direction and connecting the first surface and the second surface. The ingot includes: a first pseudo single crystal region; an intermediate region containing one or more pseudo single crystal regions; and a second pseudo single crystal region. The first pseudo single crystal region, the intermediate region, and the second pseudo single crystal region are positioned adjacent sequentially in a second direction perpendicular to the first direction. In the second direction, a width of each of the first and second pseudo single crystal regions is larger than a width of the first intermediate region. Each of a boundary between the first pseudo single crystal region and the intermediate region and a boundary between the second pseudo single crystal region and the intermediate region includes a coincidence boundary.
PREPARATION METHOD OF CONDUCTIVE GALLIUM OXIDE BASED ON DEEP LEARNING AND HEAT EXCHANGE METHOD
A preparation method of conductive gallium oxide based on deep learning and heat exchange method. The prediction method includes: obtaining a preparation data of the conductive gallium oxide single crystal, the preparation data includes a seed crystal data, an environmental data, a control data, and a raw material data, the control data comprises a seed crystal coolant flow rate, and the raw material data includes a doping type data and a conductive doping concentration; preprocessing the preparation data to obtain a preprocessed preparation data; inputting the preprocessed preparation data into a trained neural network model, and obtaining a predicted property data corresponding to the conductive gallium oxide single crystal through the trained neural network model, the predicted property data includes a predicted carrier concentration. Therefore, the conductive gallium oxide with a preset carrier concentration is obtained.
PREPARATION METHOD OF CONDUCTIVE GALLIUM OXIDE BASED ON DEEP LEARNING AND HEAT EXCHANGE METHOD
A preparation method of conductive gallium oxide based on deep learning and heat exchange method. The prediction method includes: obtaining a preparation data of the conductive gallium oxide single crystal, the preparation data includes a seed crystal data, an environmental data, a control data, and a raw material data, the control data comprises a seed crystal coolant flow rate, and the raw material data includes a doping type data and a conductive doping concentration; preprocessing the preparation data to obtain a preprocessed preparation data; inputting the preprocessed preparation data into a trained neural network model, and obtaining a predicted property data corresponding to the conductive gallium oxide single crystal through the trained neural network model, the predicted property data includes a predicted carrier concentration. Therefore, the conductive gallium oxide with a preset carrier concentration is obtained.
METHOD FOR PREPARING SINGLE CRYSTAL SUPERALLOY TEST BARS BY USING NI-W HETEROGENEOUS SEED CRYSTAL
In the method for preparing single crystal superalloy test bars by using a Ni—W heterogeneous seed crystal, on the premise of ensuring that the single crystal superalloy has the required orientation, by reusing the seed crystal, it is achieved that the trouble caused by the need of preparing a new seed crystal when a single crystal superalloy is produced by the seed crystal method every time is avoided, and the production cost is significantly reduced. In the present disclosure, the formation of the stray grains in mushy zone could be avoided by using a Ni—W heterogeneous seed crystal without mushy zone and a built-in corundum tube.
LOW ETCH PIT DENSITY, LOW SLIP LINE DENSITY, AND LOW STRAIN INDIUM PHOSPHIDE
Methods and wafers for low etch pit density, low slip line density, and low strain indium phosphide are disclosed and may include an indium phosphide single crystal wafer having a diameter of 4 inches or greater, having a measured etch pit density of less than 500 cm.sup.−2, and having fewer than 5 dislocations or slip lines as measured by x-ray diffraction imaging. The wafer may have a measured etch pit density of 200 cm.sup.−2 or less, or 100 cm.sup.−2 or less, or 10 cm.sup.−2 or less. The wafer may have a diameter of 6 inches or greater. An area of the wafer with a measured etch pit density of zero may at least 80% of the total area of the surface. An area of the wafer with a measured etch pit density of zero may be at least 90% of the total area of the surface.
LOW ETCH PIT DENSITY, LOW SLIP LINE DENSITY, AND LOW STRAIN INDIUM PHOSPHIDE
Methods and wafers for low etch pit density, low slip line density, and low strain indium phosphide are disclosed and may include an indium phosphide single crystal wafer having a diameter of 4 inches or greater, having a measured etch pit density of less than 500 cm.sup.−2, and having fewer than 5 dislocations or slip lines as measured by x-ray diffraction imaging. The wafer may have a measured etch pit density of 200 cm.sup.−2 or less, or 100 cm.sup.−2 or less, or 10 cm.sup.−2 or less. The wafer may have a diameter of 6 inches or greater. An area of the wafer with a measured etch pit density of zero may at least 80% of the total area of the surface. An area of the wafer with a measured etch pit density of zero may be at least 90% of the total area of the surface.
Method for seeding a mold
A method for producing a cast component is provided. The method includes attaching a ceramic mold to a seed crystal body, the ceramic mold including a cavity defining the shape of the cast component and a seed crystal body interface having a complementary shape to the seed crystal body such that the seed crystal body may be capable of supporting the ceramic mold in a casting oven. The method also includes pouring a liquid metal into the mold such that the crystal seed portion contributes to controlled crystallization of the cast component.
Method for seeding a mold
A method for producing a cast component is provided. The method includes attaching a ceramic mold to a seed crystal body, the ceramic mold including a cavity defining the shape of the cast component and a seed crystal body interface having a complementary shape to the seed crystal body such that the seed crystal body may be capable of supporting the ceramic mold in a casting oven. The method also includes pouring a liquid metal into the mold such that the crystal seed portion contributes to controlled crystallization of the cast component.