The present disclosure discloses a method for growing a crystal with a short decay time. According to the method, a new single crystal furnace and a temperature field device are adapted and a process, a ration of reactants, and growth parameters are adjusted and/or optimized, accordingly, a crystal with a short decay time, a high luminous intensity, and a high luminous efficiency can be grown without a co-doping operation.

The present disclosure discloses a method for growing a crystal with a short decay time. According to the method, a new single crystal furnace and a temperature field device are adapted and a process, a ration of reactants, and growth parameters are adjusted and/or optimized, accordingly, a crystal with a short decay time, a high luminous intensity, and a high luminous efficiency can be grown without a co-doping operation.

An embodiment provides a method for growing silicon single crystal ingots, comprising the steps of: (a) injecting polysilicon into a crucible inside a chamber; (b) melting the polysilicon in the crucible to form a silicon melt; (c) measuring the degree of melting of the polysilicon; and (d) increasing, after a predetermined part of the polysilicon has been melted, the supply amount of an inert gas supplied to the chamber, and decreasing the pressure inside the chamber.

An embodiment provides a method for growing silicon single crystal ingots, comprising the steps of: (a) injecting polysilicon into a crucible inside a chamber; (b) melting the polysilicon in the crucible to form a silicon melt; (c) measuring the degree of melting of the polysilicon; and (d) increasing, after a predetermined part of the polysilicon has been melted, the supply amount of an inert gas supplied to the chamber, and decreasing the pressure inside the chamber.

An ingot growing apparatus is disclosed. An ingot growing apparatus according to an aspect of the present invention comprises a growth furnace for growing an ingot, and a main crucible which is accommodated in the growth furnace and accommodates molten silicon, wherein the main crucible comprises: a main crucible bottom portion; a main crucible side portion that extends upwardly from the main crucible bottom portion; and a main crucible inclined portion that has an inclined surface extending upward and outward from the main crucible side portion. In addition, when the molten silicon is supplied from the upper side of the main crucible side portion into the main crucible, the molten silicon is guided into the main crucible along the inclined surface, thereby preventing the molten silicon from splashing around the main crucible.

An ingot growing apparatus is disclosed. An ingot growing apparatus according to an aspect of the present invention comprises a growth furnace for growing an ingot, and a main crucible which is accommodated in the growth furnace and accommodates molten silicon, wherein the main crucible comprises: a main crucible bottom portion; a main crucible side portion that extends upwardly from the main crucible bottom portion; and a main crucible inclined portion that has an inclined surface extending upward and outward from the main crucible side portion. In addition, when the molten silicon is supplied from the upper side of the main crucible side portion into the main crucible, the molten silicon is guided into the main crucible along the inclined surface, thereby preventing the molten silicon from splashing around the main crucible.

In the present invention, once a polycrystalline silicon rod is grown by the Siemens process, the polycrystalline silicon rod is heat-treated within a temperature range from 750 C. to 900 C. to relieve residual stress in the crystal. According to the experiment of the present inventors, residual stress can be relieved satisfactorily by heat treatment at the above-described low temperature, and in addition, metal contamination cannot be induced and the physical properties of the polycrystalline silicon rod cannot be changed. The above heat treatment can be conducted inside a furnace used to grow the polycrystalline silicon rod, and can also be conducted outside a furnace used to grow the polycrystalline silicon rod. According to the present invention, a polycrystalline silicon rod with residual stress () of not more than +20 MPa evaluated by a 2-sin.sup.2 diagram can be obtained.

In the present invention, once a polycrystalline silicon rod is grown by the Siemens process, the polycrystalline silicon rod is heat-treated within a temperature range from 750 C. to 900 C. to relieve residual stress in the crystal. According to the experiment of the present inventors, residual stress can be relieved satisfactorily by heat treatment at the above-described low temperature, and in addition, metal contamination cannot be induced and the physical properties of the polycrystalline silicon rod cannot be changed. The above heat treatment can be conducted inside a furnace used to grow the polycrystalline silicon rod, and can also be conducted outside a furnace used to grow the polycrystalline silicon rod. According to the present invention, a polycrystalline silicon rod with residual stress () of not more than +20 MPa evaluated by a 2-sin.sup.2 diagram can be obtained.

One example describes a method of manufacturing Czochralski (CZ) silicon wafers. The method includes slicing an n-type CZ silicon ingot to form a plurality of CZ silicon wafers, determining a boron concentration of each CZ silicon wafer, dividing the CZ silicon wafers into sub-groups based on the boron concentration, wherein an average value of the boron concentration differs among the sub-groups, and labeling each sub-group of CZ silicon wafers with a different label which is indicative of the boron concentration.

One example describes a method of manufacturing Czochralski (CZ) silicon wafers. The method includes slicing an n-type CZ silicon ingot to form a plurality of CZ silicon wafers, determining a boron concentration of each CZ silicon wafer, dividing the CZ silicon wafers into sub-groups based on the boron concentration, wherein an average value of the boron concentration differs among the sub-groups, and labeling each sub-group of CZ silicon wafers with a different label which is indicative of the boron concentration.