A production method of monocrystalline silicon includes: measuring an emissivity of an inner wall surface of a top chamber; and determining a target resistivity of monocrystalline silicon based on the emissivity measured in the measuring, thereby producing the monocrystalline silicon. In determining the target emissivity on a crystal center axis at a position for starting formation of a straight body of the monocrystalline silicon in the producing, when the emissivity is 0.4 or less, the target resistivity is determined to be less than a resistivity value of 3.0 mΩ.Math.cm when the dopant is arsenic.

A production method of monocrystalline silicon includes: measuring an emissivity of an inner wall surface of a top chamber; and determining a target resistivity of monocrystalline silicon based on the emissivity measured in the measuring, thereby producing the monocrystalline silicon. In determining the target emissivity on a crystal center axis at a position for starting formation of a straight body of the monocrystalline silicon in the producing, when the emissivity is 0.4 or less, the target resistivity is determined to be less than a resistivity value of 3.0 mΩ.Math.cm when the dopant is arsenic.

Ingot puller apparatus that include a silicon feed tube for adding solid silicon to a crucible assembly are disclosed. The silicon feed tubes include a conduit portion having an inner diameter and a kick plate disposed below the conduit portion. The kick plate extends across at least 60% of the inner diameter of the conduit portion.

Ingot puller apparatus that include a silicon feed tube for adding solid silicon to a crucible assembly are disclosed. The silicon feed tubes include a conduit portion having an inner diameter and a kick plate disposed below the conduit portion. The kick plate extends across at least 60% of the inner diameter of the conduit portion.

Methods for forming single crystal silicon ingots with improved resistivity control are disclosed. The methods involve growth of a sample rod. The sample rod may have a diameter less than the diameter of the product ingot. The sample rod is cropped to form a center slab. The resistivity of the center slab may be measured directly such as by a four-point probe. The sample rod or optionally the center slab may be annealed in a thermal donor kill cycle prior to measuring the resistivity, and the annealed rod or slab is irradiated with light in order to enhance the relaxation rate and enable more rapid resistivity measurement.

Methods for forming single crystal silicon ingots with improved resistivity control are disclosed. The methods involve growth of a sample rod. The sample rod may have a diameter less than the diameter of the product ingot. The sample rod is cropped to form a center slab. The resistivity of the center slab may be measured directly such as by a four-point probe. The sample rod or optionally the center slab may be annealed in a thermal donor kill cycle prior to measuring the resistivity, and the annealed rod or slab is irradiated with light in order to enhance the relaxation rate and enable more rapid resistivity measurement.

A CZ crucible for growing a single crystal silicon ingot by a CZ method, where the CZ crucible includes a closed-end cylindrical graphite crucible and a closed-end cylindrical quartz glass crucible disposed inside the graphite crucible, and the CZ crucible includes a gap between an inner surface of a bottom portion of the graphite crucible and an outer surface of a bottom portion of the quartz glass crucible on a central axis of the CZ crucible, the gap keeping the inner surface of the bottom portion of the graphite crucible and the outer surface of the bottom portion of the quartz glass crucible contactless with each other. This provides a CZ crucible that ensures that a closed-end cylindrical quartz glass crucible for growing a single crystal silicon ingot by a CZ method can be stable and self-supporting when disposed inside a closed-end cylindrical graphite crucible.

A quartz glass crucible for growing a single crystal silicon ingot by a CZ method, where the crucible has a closed-end cylindrical shape including a cylindrical straight body portion, a first curved portion continuous with a lower end of the straight body portion and having a first curvature R1, a second curved portion continuous with the first and having a second curvature R2, and a bottom portion continuous with the second curved portion, R1 and R2 have a relationship of R1<R2, and an outer surface of the bottom portion forms a flat surface perpendicular to a central axis of the crucible or a concave surface concave with respect to the flat surface. This provides a closed-end cylindrical quartz glass crucible for growing a single crystal silicon ingot by a CZ method that can be stable and self-supporting when it is disposed inside a closed-end cylindrical graphite crucible.

An embodiment provides a silicon single crystal growth method comprising the steps of: (a) allowing the shoulder of a single crystal to grow vertically; (b) allowing the shoulder to grow horizontally after the vertical growth; and (c) allowing the shoulder to grow in a downward convex shape after the horizontal growth of the shoulder, wherein the shoulder grows at a preset rate on the basis of the final diameter of the shoulder and the shoulder growth height according to steps (b) and (c).

An embodiment provides a silicon single crystal growth method comprising the steps of: (a) allowing the shoulder of a single crystal to grow vertically; (b) allowing the shoulder to grow horizontally after the vertical growth; and (c) allowing the shoulder to grow in a downward convex shape after the horizontal growth of the shoulder, wherein the shoulder grows at a preset rate on the basis of the final diameter of the shoulder and the shoulder growth height according to steps (b) and (c).