In an exemplary embodiment, a quartz glass crucible 1 includes: a cylindrical crucible body 10 which has a bottom and is made of quartz glass; and crystallization-accelerator-containing coating films 13A and 13B which are formed on surfaces of the crucible body 10 so as to cause crystallization-accelerator-enriched layers to be formed in the vicinity of the surfaces of the crucible body 10 by heating during a step of pulling up a silicon single crystal by a Czochralski method. The quartz glass crucible is capable of withstanding a single crystal pull-up step undertaken for a very long period of time, such as multi-pulling, and a manufacturing method thereof.

In an exemplary embodiment, a quartz glass crucible 1 includes: a cylindrical crucible body 10 which has a bottom and is made of quartz glass; and crystallization-accelerator-containing coating films 13A and 13B which are formed on surfaces of the crucible body 10 so as to cause crystallization-accelerator-enriched layers to be formed in the vicinity of the surfaces of the crucible body 10 by heating during a step of pulling up a silicon single crystal by a Czochralski method. The quartz glass crucible is capable of withstanding a single crystal pull-up step undertaken for a very long period of time, such as multi-pulling, and a manufacturing method thereof.

A crucible-supporting pedestal includes a fitting recess portion into which a divided graphite member is fittable. An opening edge of the fitting recess portion is formed such that a contact area between the opening edge and the divided graphite member is provided at a position higher than a surface of a solidified product of a silicon melt which remains in a quartz crucible after a silicon single crystal is grown, and a force, which is applied to the divided graphite member by an expansion of the silicon melt when the silicon melt is solidified, is applied to a position lower than the contact area.

A crucible-supporting pedestal includes a fitting recess portion into which a divided graphite member is fittable. An opening edge of the fitting recess portion is formed such that a contact area between the opening edge and the divided graphite member is provided at a position higher than a surface of a solidified product of a silicon melt which remains in a quartz crucible after a silicon single crystal is grown, and a force, which is applied to the divided graphite member by an expansion of the silicon melt when the silicon melt is solidified, is applied to a position lower than the contact area.

A production method of monocrystalline silicon includes: measuring an emissivity of an inner wall surface of a top chamber; and determining a target resistivity of monocrystalline silicon based on the emissivity measured in the measuring, thereby producing the monocrystalline silicon. In determining the target emissivity on a crystal center axis at a position for starting formation of a straight body of the monocrystalline silicon in the producing, when the emissivity is 0.4 or less, the target resistivity is determined to be less than a resistivity value of 3.0 mΩ.Math.cm when the dopant is arsenic.

A production method of monocrystalline silicon includes: measuring an emissivity of an inner wall surface of a top chamber; and determining a target resistivity of monocrystalline silicon based on the emissivity measured in the measuring, thereby producing the monocrystalline silicon. In determining the target emissivity on a crystal center axis at a position for starting formation of a straight body of the monocrystalline silicon in the producing, when the emissivity is 0.4 or less, the target resistivity is determined to be less than a resistivity value of 3.0 mΩ.Math.cm when the dopant is arsenic.

A quartz glass crucible including bottom, curved, and straight body portions, where the quartz glass crucible includes an outer layer including opaque quartz glass containing bubbles, and an inner layer including transparent quartz glass, the outer layer fabricated from different types of raw material powder, the outer layer having regions sectioned by bubble content densities, and bubble content densities of two outer layer adjacent regions, when d.sub.a (pcs/mm.sup.3) is defined as content density of a region “a” having a greater content density, and d.sub.b (pcs/mm.sup.3) is defined as content density of a region “b” having a smaller content density, a difference D=(d.sub.a−d.sub.b)/d.sub.b between content densities of the two regions is 10% or more.

A quartz glass crucible including bottom, curved, and straight body portions, where the quartz glass crucible includes an outer layer including opaque quartz glass containing bubbles, and an inner layer including transparent quartz glass, the outer layer fabricated from different types of raw material powder, the outer layer having regions sectioned by bubble content densities, and bubble content densities of two outer layer adjacent regions, when d.sub.a (pcs/mm.sup.3) is defined as content density of a region “a” having a greater content density, and d.sub.b (pcs/mm.sup.3) is defined as content density of a region “b” having a smaller content density, a difference D=(d.sub.a−d.sub.b)/d.sub.b between content densities of the two regions is 10% or more.

Methods for producing a single crystal silicon ingot are disclosed. The ingot is doped with boron using solid-phase boric acid as the source of boron. Boric acid may be used to counter-dope the ingot during ingot growth. Ingot puller apparatus that use a solid-phase dopant are also disclosed. The solid-phase dopant may be disposed in a receptacle that is moved closer to the surface of the melt or a vaporization unit may be used to produce a dopant gas from the solid-phase dopant.

Methods for producing a single crystal silicon ingot are disclosed. The ingot is doped with boron using solid-phase boric acid as the source of boron. Boric acid may be used to counter-dope the ingot during ingot growth. Ingot puller apparatus that use a solid-phase dopant are also disclosed. The solid-phase dopant may be disposed in a receptacle that is moved closer to the surface of the melt or a vaporization unit may be used to produce a dopant gas from the solid-phase dopant.