The production method of an SiC single crystal is a production method of an SiC single crystal by a solution growth process. The production method includes a contact step A, a contact step B, and a growth step. In the contact step A, a partial region of the principal surface is brought into contact with a stored SiC solution. In the contact step B, a contact region between the principal surface and the stored SiC solution expands, due to a wetting phenomenon, starting from an initial contact region which is the partial region brought into contact in the contact step A. In the growth step, an SiC single crystal is grown on the principal surface which is in contact with the stored SiC solution.

A p-type SiC single crystal having lower resistivity than the prior art is provided. This is achieved by a method for producing a SiC single crystal in which a SiC seed crystal substrate is contacted with a SiC solution having a temperature gradient such that the temperature decreases from the interior toward the surface, to grow a SiC single crystal, the method comprising: using as the SiC solution a SiC solution containing Si, Cr and Al, wherein the Al content is 3 at % or greater based on the total of Si, Cr and Al; and contacting a (0001) face of the SiC seed crystal substrate with the SiC solution to grow a SiC single crystal from the (0001) face.

At least two types of dielectric materials such as oxide nanosheets having a layered perovskite structure that differ from each other are laminated, and the nanosheets are bonded to each other via an ionic material, thereby producing a superlattice structure-having ferroelectric thin film. Having the layered structure, the film can exhibit ferroelectricity as a whole, though not using a ferroelectric material therein. Accordingly, there is provided a ferroelectric film based on a novel principle, which is favorable for ferroelectric memories and others and which is free from a size effect even though extremely thinned.

A method of growing a group III nitride single crystal, including steps of forming a plurality of initial nuclei on a seed substrate having seed crystals made of a group III nitride single crystal formed thereon by immersing the substrate into a mixed melt in a crucible; forming a planarized crystal surface by immersing into a mixed melt in a crucible and pulling up therefrom to heat the substrate; and forming a thickened group III nitride single crystal on the seed substrate. When forming the plurality of initial nuclei, a concentration of alkali metals or alkaline earth metals other than Na in the mixed melt is set to 0.001 mol % or less, and when forming the thickened group III nitride single crystal, a concentration of alkali metals or alkaline earth metals other than Na in the mixed melt is set higher than that when forming the plurality of initial nuclei.

A method for manufacturing a group III nitride semiconductor includes a growing step of growing the group III nitride semiconductor on a seed substrate by supplying a gas containing nitrogen to a mixed melt containing a group III metal and a flux. The seed substrate has a substrate and a plurality of seed crystals provided on the substrate and composed of the group III nitride semiconductor. In the method, the growing step includes a generation step of generating an initial nucleus composed of the group III nitride semiconductor on each seed crystal; and a growth step of growing the initial nucleus after the generation step. In the generation step, the mixed melt contains calcium.