Provided are a practical method for manufacturing TAG single crystal. The method of manufacturing a garnet type crystal brings a raw material solution into contact with a substrate formed of a Y.sub.3Al.sub.5O.sub.12 crystal or a Dy.sub.3Al.sub.5O.sub.12 crystal and performs liquid phase epitaxial growth. The garnet type crystal is represented by (Tb.sub.3-x-yR.sub.xBi.sub.y) Al.sub.5O.sub.12 (R is one or more elements selected from Y or a lanthanoid (La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, or Lu), 0x, and 0y)).

An oriented alumina substrate for epitaxial growth according to an embodiment of the present invention includes crystalline grains constituting a surface thereof, the crystalline grains having a tilt angle of 1 or more and 3 or less and an average sintered grain size of 20 m or more.

An oriented alumina substrate for epitaxial growth according to an embodiment of the present invention includes crystalline grains constituting a surface thereof, the crystalline grains having a tilt angle of 1 or more and 3 or less and an average sintered grain size of 20 m or more.

An oriented alumina substrate for epitaxial growth according to an embodiment of the present invention includes crystalline grains constituting a surface thereof, the crystalline grains having a tilt angle of 0.1 or more and less than 1.0 and an average sintered grain size of 10 m or more.

An oriented alumina substrate for epitaxial growth according to an embodiment of the present invention includes crystalline grains constituting a surface thereof, the crystalline grains having a tilt angle of 0.1 or more and less than 1.0 and an average sintered grain size of 10 m or more.

A semiconductor wafer forms on a mold containing a dopant. The dopant dopes a melt region adjacent the mold. There, dopant concentration is higher than in the melt bulk. A wafer starts solidifying. Dopant diffuses poorly in solid semiconductor. After a wafer starts solidifying, dopant cannot enter the melt. Afterwards, the concentration of dopant in the melt adjacent the wafer surface is less than what was present where the wafer began to form. New wafer regions grow from a melt region whose dopant concentration lessens over time. This establishes a dopant gradient in the wafer, with higher concentration adjacent the mold. The gradient can be tailored. A gradient gives rise to a field that can function as a drift or back surface field. Solar collectors can have open grid conductors and better optical reflectors on the back surface, made possible by the intrinsic back surface field.

A semiconductor wafer forms on a mold containing a dopant. The dopant dopes a melt region adjacent the mold. There, dopant concentration is higher than in the melt bulk. A wafer starts solidifying. Dopant diffuses poorly in solid semiconductor. After a wafer starts solidifying, dopant cannot enter the melt. Afterwards, the concentration of dopant in the melt adjacent the wafer surface is less than what was present where the wafer began to form. New wafer regions grow from a melt region whose dopant concentration lessens over time. This establishes a dopant gradient in the wafer, with higher concentration adjacent the mold. The gradient can be tailored. A gradient gives rise to a field that can function as a drift or back surface field. Solar collectors can have open grid conductors and better optical reflectors on the back surface, made possible by the intrinsic back surface field.

A high-quality SiC single crystal and a method for producing such a SiC single crystal is provided. In the SiC single crystal, the threading dislocation density including screw dislocation, edge dislocation and micropipe defect is reduced. The method for producing the SiC single crystal according to a solution technique involves bringing an SiC seed crystal into contact with an SiC solution having a temperature gradient in which a temperature of the SiC solution is lower towards the surface of the SiC seed crystal. Growing an SiC single crystal includes setting the temperature gradient of the surface region of the SiC solution to 10 C/cm or below, bringing the (1-100) face of the SiC seed crystal into contact with the SiC solution, and growing an SiC single crystal on the (1-100) face of the seed crystal at a ratio (single crystal growth rate/temperature gradient) of less than 2010.sup.4 cm.sup.2/h.Math. C.

A high-quality SiC single crystal and a method for producing such a SiC single crystal is provided. In the SiC single crystal, the threading dislocation density including screw dislocation, edge dislocation and micropipe defect is reduced. The method for producing the SiC single crystal according to a solution technique involves bringing an SiC seed crystal into contact with an SiC solution having a temperature gradient in which a temperature of the SiC solution is lower towards the surface of the SiC seed crystal. Growing an SiC single crystal includes setting the temperature gradient of the surface region of the SiC solution to 10 C/cm or below, bringing the (1-100) face of the SiC seed crystal into contact with the SiC solution, and growing an SiC single crystal on the (1-100) face of the seed crystal at a ratio (single crystal growth rate/temperature gradient) of less than 2010.sup.4 cm.sup.2/h.Math. C.

Embodiments relate to fabricating a wafer including a thin, high-quality single crystal GaN layer serving as a template for formation of additional GaN material. A bulk ingot of GaN material is subjected to implantation to form a subsurface cleave region. The implanted bulk material is bonded to a substrate having lattice and/or Coefficient of Thermal Expansion (CTE) properties compatible with GaN. Examples of such substrate materials can include but are not limited to AlN and Mullite. The GaN seed layer is transferred by a controlled cleaving process from the implanted bulk material to the substrate surface. The resulting combination of the substrate and the GaN seed layer, can form a template for subsequent growth of overlying high quality GaN. Growth of high-quality GaN can take place utilizing techniques such as Liquid Phase Epitaxy (LPE) or gas phase epitaxy, e.g., Metallo-Organic Chemical Vapor Deposition (MOCVD) or Hydride Vapor Phase Epitaxy (HVPE).