A method of manufacturing a component includes additively manufacturing a crucible; directionally solidifying a metal material within the crucible; and removing the crucible to reveal the component. A component for a gas turbine engine includes a directionally solidified metal material component, the directionally solidified metal material component having been additively manufactured of a metal material concurrently with a core, the metal material having been remelted and directionally solidified.

A method of manufacturing a component includes additively manufacturing a crucible; directionally solidifying a metal material within the crucible; and removing the crucible to reveal the component. A component for a gas turbine engine includes a directionally solidified metal material component, the directionally solidified metal material component having been additively manufactured of a metal material concurrently with a core, the metal material having been remelted and directionally solidified.

A group III nitride crystal substrate is provided, wherein, a uniform distortion at a surface layer of the crystal substrate is equal to or lower than 1.710.sup.3, and wherein a plane orientation of the main surface has an inclination angle equal to or greater than 10 and equal to or smaller than 10 in a [0001] direction with respect to a plane including a c axis of the crystal substrate. A group III nitride crystal substrate suitable for manufacturing a light emitting device with a blue shift of an emission suppressed, an epilayer-containing group III nitride crystal substrate, a semiconductor device and a method of manufacturing the same can thereby be provided.

A method of manufacturing a replacement body for a component is provided. The method includes the steps of: a) additively manufacturing a crucible for casting of the replacement body; b) solidifying a metal material within the crucible to form a directionally solidified microstructure within the replacement body; and c) removing the crucible to reveal the directionally solidified replacement body.

Methods and apparatus for deposition processes are provided herein. In some embodiments, an apparatus may include a substrate support comprising a susceptor plate having a pocket disposed in an upper surface of the susceptor plate and having a lip formed in the upper surface and circumscribing the pocket, the lip configured to support a substrate on the lip; and a plurality of vents extending from the pocket to the upper surface of the susceptor plate to exhaust gases trapped between the backside of the substrate and the pocket when a substrate is disposed on the lip. Methods of utilizing the inventive apparatus for depositing a layer on a substrate are also disclosed.

A method of making a joint between parts is provided, wherein the surface of at least one of the parts comprises aluminum oxide such as alpha aluminum oxide in the form of sapphire. A layer of aluminum nitride is provided between the surfaces of the parts where these contact. The method comprises the steps of bringing the parts into contact whereby the aluminum nitride layer is sandwiched between the parts and is in contact with the aluminum oxide surface, and performing localized heating of the aluminum nitride. The aluminum nitride is heated to at least the melting temperature of the aluminum nitride aluminum oxide eutectic, such that the aluminum nitride and adjacent aluminum oxide mix and melt to form an aluminum oxy-nitride bond. On cooling, the aluminum oxynitride forms a solid joint between the parts.

A method of making a joint between parts is provided, wherein the surface of at least one of the parts comprises aluminum oxide such as alpha aluminum oxide in the form of sapphire. A layer of aluminum nitride is provided between the surfaces of the parts where these contact. The method comprises the steps of bringing the parts into contact whereby the aluminum nitride layer is sandwiched between the parts and is in contact with the aluminum oxide surface, and performing localized heating of the aluminum nitride. The aluminum nitride is heated to at least the melting temperature of the aluminum nitride aluminum oxide eutectic, such that the aluminum nitride and adjacent aluminum oxide mix and melt to form an aluminum oxy-nitride bond. On cooling, the aluminum oxynitride forms a solid joint between the parts.

Cover flux devices and methods are shown. Methods and devices are shown such that, as a solidification front moves from a cooling surface of a mold towards a surface of molten silicon substantially opposite the cooling surface, impurities are driven out of the solid silicon and into the liquid to react with a flux layer on the silicon.

Cover flux devices and methods are shown. Methods and devices are shown such that, as a solidification front moves from a cooling surface of a mold towards a surface of molten silicon substantially opposite the cooling surface, impurities are driven out of the solid silicon and into the liquid to react with a flux layer on the silicon.

A cast work piece includes a cast metal component section and a sprue section connected to the cast metal component section. The cast metal component section and a portion of the sprue section have a first grain orientation and another portion of the sprue section has a second grain orientation such that there is a microstructural discontinuity where the first grain orientation meets the second grain orientation in the sprue section.