A laser activated luminescence system is provided. Another aspect pertains to a system employing a plasma assisted vapor deposition reactor which creates diamond layers on a substrate, in combination with a laser system to at least photoactivate and anneal the diamond layers. Yet another aspect of the present system uses a laser to assist with placement of color centers, such as nitrogen vacancy centers, in diamond. The present method uses lasers to manufacture more than two activated nitrogen vacancy center nodes in a diamond substrate, with nanometer spatial resolution and at a predetermined depth.

A laser activated luminescence system is provided. Another aspect pertains to a system employing a plasma assisted vapor deposition reactor which creates diamond layers on a substrate, in combination with a laser system to at least photoactivate and anneal the diamond layers. Yet another aspect of the present system uses a laser to assist with placement of color centers, such as nitrogen vacancy centers, in diamond. The present method uses lasers to manufacture more than two activated nitrogen vacancy center nodes in a diamond substrate, with nanometer spatial resolution and at a predetermined depth.

A film stack is formed a workpiece. The film stack is fabricated by sequentially depositing a carbon-doped silicon germanium stack and a silicon film to form a carbon-doped silicon-germanium and silicon mini-stack disposed on a substrate during a deposition cycle. The deposition cycle comprises exposing a workpiece including the substrate to a first gas including a first precursor to deposit a first silicon-germanium layer and exposing the workpiece to a second gas including the first precursor to deposit a carbon-silicon-germanium layer on the first silicon-germanium layer. Further, the deposition cycle includes exposing the workpiece to a third gas including the first precursor to deposit a second silicon-germanium layer on the carbon-silicon-germanium layer. The deposition cycle further includes exposing the workpiece to a fourth gas including a second precursor to deposit the silicon film on the second silicon-germanium layer. The second precursor differs from the first precursor.

A film stack is formed a workpiece. The film stack is fabricated by sequentially depositing a carbon-doped silicon germanium stack and a silicon film to form a carbon-doped silicon-germanium and silicon mini-stack disposed on a substrate during a deposition cycle. The deposition cycle comprises exposing a workpiece including the substrate to a first gas including a first precursor to deposit a first silicon-germanium layer and exposing the workpiece to a second gas including the first precursor to deposit a carbon-silicon-germanium layer on the first silicon-germanium layer. Further, the deposition cycle includes exposing the workpiece to a third gas including the first precursor to deposit a second silicon-germanium layer on the carbon-silicon-germanium layer. The deposition cycle further includes exposing the workpiece to a fourth gas including a second precursor to deposit the silicon film on the second silicon-germanium layer. The second precursor differs from the first precursor.

A method for manufacturing a silicon substrate for a quantum computer, the method includes the steps of forming a Si epitaxial layer by epitaxial growth using a Si source gas as a silicon-based raw material gas, in which a total content of 28Si and 30Si in a whole silicon contained in the silicon-based raw material gas is 99.9% or more, on a silicon substrate, forming an oxygen (O) -doped layer by oxidizing a surface of the Si epitaxial layer, and forming a Si epitaxial layer by epitaxial growth using a Si source gas, in which a total content of 28Si and 30Si in a whole silicon contained in the silicon-based raw material gas is 99.9% or more, on the -doped layer.

A method for manufacturing a silicon substrate for a quantum computer, the method includes the steps of forming a Si epitaxial layer by epitaxial growth using a Si source gas as a silicon-based raw material gas, in which a total content of 28Si and 30Si in a whole silicon contained in the silicon-based raw material gas is 99.9% or more, on a silicon substrate, forming an oxygen (O) -doped layer by oxidizing a surface of the Si epitaxial layer, and forming a Si epitaxial layer by epitaxial growth using a Si source gas, in which a total content of 28Si and 30Si in a whole silicon contained in the silicon-based raw material gas is 99.9% or more, on the -doped layer.

A silicon single crystal substrate for vapor phase growth, having the silicon single crystal substrate being made of an FZ crystal having a resistivity of 1000 cm or more, wherein the surface of the silicon single crystal substrate is provided with a high nitrogen concentration layer having a nitrogen concentration higher than that of other regions and a nitrogen concentration of 510.sup.15 atoms/cm.sup.3 or more and a thickness of 10 to 100 m.

There is provided a novel boron-doped single-crystal diamond film that has an increased concentration of boron contained in the boron-doped single-crystal diamond film, and also has a controlled plane orientation and a controlled thickness, has an increased area and a reduced resistivity, and is easy to produce. A boron-doped single-crystal diamond film having a boron concentration of 210.sup.20 atms/cm.sup.3 or more, a metal element concentration of less than 110.sup.16 atms/cm.sup.3, a nitrogen concentration of 0.2 ppm or less, a thickness in a range of 10 to 500 m, and an off-angle in a {001} plane orientation in a range of 0.1 to 4.0.

There is provided a novel boron-doped single-crystal diamond film that has an increased concentration of boron contained in the boron-doped single-crystal diamond film, and also has a controlled plane orientation and a controlled thickness, has an increased area and a reduced resistivity, and is easy to produce. A boron-doped single-crystal diamond film having a boron concentration of 210.sup.20 atms/cm.sup.3 or more, a metal element concentration of less than 110.sup.16 atms/cm.sup.3, a nitrogen concentration of 0.2 ppm or less, a thickness in a range of 10 to 500 m, and an off-angle in a {001} plane orientation in a range of 0.1 to 4.0.