In a method of producing a SiC single crystal ingot of the present invention, in a lower part of a crucible, a high thermal conductivity raw material layer containing a high thermal conductivity raw material and a low thermal conductivity raw material layer containing a low thermal conductivity raw material in at least one of a position above or below the high thermal conductivity raw material layer are disposed to form a raw material part, and heating is performed so that the raw material part reaches the maximum temperature in the high thermal conductivity raw material layer and a SiC single crystal ingot is grown.

The present invention discloses a method for carrying out phosphide in-situ injection synthesis by carrier gas, relating to a synthetic method of semiconductor crystal: step A, shielding inert gas is introduced into a furnace body through a carrier gas intake conduit; step B, a crucible is heated in the furnace body to melt a pre-synthesized raw material in the crucible; step C, the heated shielding inert gas is introduced into the furnace body through the carrier gas intake conduit; step D, a phosphorus source furnace loaded with red phosphorus is moved downwards until an injection conduit of the phosphorus source furnace is submerged in the melt; step E, the red phosphorus is heated by the phosphorus source furnace to produce phosphorus gas, and the phosphorus gas is mixed with the shielding inert gas and then injected into the melt through the injection conduit, and the phosphorus gas reacts with the melt to produce phosphide; and step F, each device is turned off after the synthesis is finished. In the present invention in the synthesis process, the shielding inert gas is introduced through the carrier gas intake conduit to enable the phosphorus gas to be stably injected into the melt, so that the melt is prevented from being sucked back into the phosphorus source furnace after the volatile element gas is completely absorbed.

Ingot puller apparatus for preparing a single crystal silicon ingot by the Czochralski method are disclosed. The ingot puller apparatus includes a heat shield. The heat shield has a leg segment that includes a void (i.e., an open space without insulation) disposed in the leg segment. The heat shield may also include insulation partially within the heat shield.

A SiC single crystal manufacturing apparatus of the present invention is a SiC single crystal manufacturing apparatus that manufactures a SiC single crystal by performing crystal growth on a growth surface of a seed crystal disposed inside a crucible, and the crucible 1 is able to accommodate a raw material M for a SiC single crystal therein, and includes a crucible lower portion 1A and a crucible upper portion 1B, the crucible lower portion including a bottom portion 1Aa and a side portion 1Ab, and the crucible upper portion including a top portion 1Ba provided with a seed crystal installation portion 1Bc for installing a seed crystal SD and a side portion 1Bb. A male thread 1AAa is provided at an outer circumference 1AA of the side portion 1Ab of the crucible lower portion 1A, a female thread 1BBa engaging with the male thread is provided at an inner circumference 1BB of the side portion 1Bb of the crucible upper portion 1B, and the crucible includes a rotation mechanism 10 that is configured to relatively move the crucible upper portion 1B and the crucible lower portion 1A in a vertical direction by rotating at least one of the crucible upper portion 1B and the crucible lower portion 1A.

The present invention discloses a method for carrying out phosphide in-situ injection synthesis by carrier gas, relating to a synthetic method of semiconductor crystal: step A, shielding inert gas is introduced into a furnace body through a carrier gas intake conduit; step B, a crucible is heated in the furnace body to melt a pre-synthesized raw material in the crucible; step C, the heated shielding inert gas is introduced into the furnace body through the carrier gas intake conduit; step D, a phosphorus source furnace loaded with red phosphorus is moved downwards until an injection conduit of the phosphorus source furnace is submerged in the melt; step E, the red phosphorus is heated by the phosphorus source furnace to produce phosphorus gas, and the phosphorus gas is mixed with the shielding inert gas and then injected into the melt through the injection conduit, and the phosphorus gas reacts with the melt to produce phosphide; and step F, each device is turned off after the synthesis is finished. In the present invention in the synthesis process, the shielding inert gas is introduced through the carrier gas intake conduit to enable the phosphorus gas to be stably injected into the melt, so that the melt is prevented from being sucked back into the phosphorus source furnace after the volatile element gas is completely absorbed.

In a producing method of an n-type monocrystalline silicon by pulling up a monocrystalline silicon from a silicon melt containing a main dopant in a form of red phosphorus to grow the monocrystalline silicon, the monocrystalline silicon exhibiting an electrical resistivity ranging from 0.5 mcm to 1.0 mcm is pulled up using a quartz crucible whose inner diameter ranges from 1.7-fold to 2.3-fold relative to a straight-body diameter of the monocrystalline silicon.

A main crucible of molten semiconductor is replenished from a supply crucible maintained such that there are always two phases of solid and liquid semiconductor within the supply crucible. Heat added to melt the solid material results in the solid material changing phase to liquid, but will not result in any significant elevation in temperature of the liquid within the supply crucible. The temperature excursions are advantageously small, being less than that which would cause problems with the formed product. The solid product material acts as a sort of temperature buffer, to maintain the supply liquid temperature automatically and passively at or very near to the phase transition temperature. For silicon, excursions are kept to less than 90 C., and even as small as 50 C. The methods also are useful with germanium. Prior art silicon methods that entirely melt the semiconductor experience excursions exceeding 100 C.

In an exemplary embodiment, a quartz glass crucible 1 includes: a straight body portion 1a having a cylindrical shape; a bottom portion 1b; and a corner portion 1c, in which a bubble content of an inner surface layer portion ranging from an inner surface to a depth 0.5 mm in an upper portion 1a.sub.1 of the straight body portion 1a is 0.2% to 2%, the bubble content of the inner surface layer portion in a lower portion 1a.sub.2 of the straight body portion 1a is more than 0.1% and not more than 1.3 times a lower limit of the bubble content of the upper portion 1a.sub.1, the bubble content of the inner surface layer portion in the corner portion 1c is more than 0.1% and 0.5% or less, and the bubble content of the inner surface layer portion in the bottom portion 1b is 0.1% or less.

The invention provides a SiC single crystal production apparatus with high uniformity of temperature distribution in a crystal growth vessel. The SiC single crystal production apparatus includes a crystal growth vessel containing SiC raw material; an insulation part covering the periphery of the crystal growth vessel; a heater used to heat the crystal growth vessel; and a holding member used to hold the crystal growth vessel, wherein the crystal growth vessel is held in a suspended state by the holding member.

A production apparatus and a production method for a gallium oxide crystal, including growing a gallium oxide single crystal by VB method, HB method, or VGF method, under an air atmosphere, by using a crucible containing a PtIr-based alloy having an Ir content of 20 to 30 wt %, and the production apparatus (10) includes a vertical Bridgman furnace including: a base body (12); a furnace body (14) in a cylindrical shape having heat resistance, disposed on the base body (12); a lid member (18) occluding the furnace body (14); a heater (20) disposed inside the furnace body (14); a crucible bearing (30) disposed vertically movably penetrating through the base body (12); and a crucible (34) disposed on the crucible bearing (30), heated with the heater (20), the crucible (34) being a crucible (34) containing a PtIr-based alloy having an Ir content of 20 to 30 wt %.