The present invention is to provide: a method for producing a novel hexagonal boron nitride thin film suitable for industrial use such as application to electronics, in which a hexagonal boron nitride thin film having a large area, a uniform thickness of 1 nm or more, with few grain boundaries can be produced inexpensively; and a hexagonal boron nitride thin film. The hexagonal boron nitride thin film according to the present invention is characterized by having a thickness of 1 nm or more, and an average value of the full width at half maximum of the E.sub.2g peak obtained from Raman spectrum of 9 to 20 cm.sup.−1.

This disclosure provides systems, methods, and apparatus related to boron nitride nanomaterials. In one aspect, a method includes generating a directed flow of plasma. A boron-containing species is introduced to the directed flow of the plasma. Boron nitride nanostructures are formed in a chamber. In another aspect, a method includes generating a directed flow of plasma using nitrogen gas. A boron-containing species is introduced to the directed flow of the plasma. The boron-containing species can consist of boron powder, boron nitride powder, and/or boron oxide powder. Boron nitride nanostructures are formed in a chamber, with a pressure in the chamber being about 3 atmospheres or greater.

This disclosure provides systems, methods, and apparatus related to boron nitride nanomaterials. In one aspect, a method includes generating a directed flow of plasma. A boron-containing species is introduced to the directed flow of the plasma. Boron nitride nanostructures are formed in a chamber. In another aspect, a method includes generating a directed flow of plasma using nitrogen gas. A boron-containing species is introduced to the directed flow of the plasma. The boron-containing species can consist of boron powder, boron nitride powder, and/or boron oxide powder. Boron nitride nanostructures are formed in a chamber, with a pressure in the chamber being about 3 atmospheres or greater.

Several variations of synthetic carbon materials are disclosed. The materials can assume a variety of properties, including high electrical conductivity. The materials also can have favorable structural and mechanical properties. They can form gas impenetrable barriers, form insulating structures, and can have unique optical properties.

The present disclosure relates to a standalone precursor for synthesizing nanomaterials, which is capable of effectively mass-producing nanomaterials, and an apparatus for synthesizing nanomaterials using the same.

A surface-treated aggregated boron nitride powder is prepared by using the boron nitride powder as the raw material, adding an oxidizer to the boron nitride aggregated grains, wet-pulverizing or wet-crushing the grains for surface modification treatment of the particles and allowing reaction of the particles with a metal coupling agent. The surface-treated boron nitride aggregated grains are formed by aggregation of hexagonal h-BN primary particles; (B) have any one or more of Si, Ti, Zr, Ce, Al, Mg, Ge, Ga, and V in an amount of 0.1 atm % or more and 3.0 atm % or less in its composition on the surface of 10 nm; (C) have a crushing strength of 5 MPa or more; and (D) have an average particle diameter of 20 μm or more and 100 μm or less.

A surface-treated aggregated boron nitride powder is prepared by using the boron nitride powder as the raw material, adding an oxidizer to the boron nitride aggregated grains, wet-pulverizing or wet-crushing the grains for surface modification treatment of the particles and allowing reaction of the particles with a metal coupling agent. The surface-treated boron nitride aggregated grains are formed by aggregation of hexagonal h-BN primary particles; (B) have any one or more of Si, Ti, Zr, Ce, Al, Mg, Ge, Ga, and V in an amount of 0.1 atm % or more and 3.0 atm % or less in its composition on the surface of 10 nm; (C) have a crushing strength of 5 MPa or more; and (D) have an average particle diameter of 20 μm or more and 100 μm or less.

The present invention relates to aggregated boron nitride particles including hexagonal boron nitride primary particles aggregated, having a specific surface area measured by the BET method of 2 to 6 m.sup.2/g and a crushing strength of 5 MPa or more. The thermally conductive resin composition of the present invention includes the aggregated boron nitride particles of the present invention. The heat dissipation member of the present invention includes the thermally conductive resin composition of the present invention. According to the present invention, aggregated boron nitride particles that can suppress the formation of voids in a heat dissipation member and can improve the insulation breakdown characteristics and the thermal conductivity of a heat dissipation member, a thermally conductive resin composition including the aggregated boron nitride particles, and a heat dissipation member using the thermally conductive resin composition can be provided.

The present invention relates to aggregated boron nitride particles including hexagonal boron nitride primary particles aggregated, having a specific surface area measured by the BET method of 2 to 6 m.sup.2/g and a crushing strength of 5 MPa or more. The thermally conductive resin composition of the present invention includes the aggregated boron nitride particles of the present invention. The heat dissipation member of the present invention includes the thermally conductive resin composition of the present invention. According to the present invention, aggregated boron nitride particles that can suppress the formation of voids in a heat dissipation member and can improve the insulation breakdown characteristics and the thermal conductivity of a heat dissipation member, a thermally conductive resin composition including the aggregated boron nitride particles, and a heat dissipation member using the thermally conductive resin composition can be provided.

The present invention relates to aggregated boron nitride particles including hexagonal boron nitride primary particles aggregated, including a spacer type coupling agent. The thermally conductive resin composition of the present invention includes the aggregated boron nitride particles of the present invention. The heat dissipation member of the present invention includes the thermally conductive resin composition of the present invention. According to the present invention, aggregated boron nitride particles that can suppress the formation of voids in a heat dissipation member produced by mixing with a resin, a thermally conductive resin composition including the aggregated boron nitride particles, and a heat dissipation member using the thermally conductive resin composition can be provided.