C01G3/05

COPPER CHLORIDE, CVD RAW MATERIAL, COPPER WIRING FILM, AND METHOD FOR PRODUCING COPPER CHLORIDE
20170101718 · 2017-04-13 ·

Provided are: copper chloride which can provide an organometallic complex that contains impurities at a small content and therefore has high purity; a CVD raw material; a copper wiring film; and a method for producing copper chloride. Copper chloride which has purity of 6 N or more and has an Ag content of 0.5 wtppm or less.

COPPER CHLORIDE, CVD RAW MATERIAL, COPPER WIRING FILM, AND METHOD FOR PRODUCING COPPER CHLORIDE
20170101718 · 2017-04-13 ·

Provided are: copper chloride which can provide an organometallic complex that contains impurities at a small content and therefore has high purity; a CVD raw material; a copper wiring film; and a method for producing copper chloride. Copper chloride which has purity of 6 N or more and has an Ag content of 0.5 wtppm or less.

Copper halide layers

Articles are described including a substrate and a copper halide layer on the substrate, where the interfacial free energy between the substrate and the copper halide layer allows the copper halide layer to form continuously, wherein the copper halide layer conforms to the shape of the substrate. The articles may further include an adhesion layer disposed in-between the substrate and the copper halide layer, where the surface free energy between the adhesion layer and the copper halide layer allows the copper halide layer to form continuously, wherein the copper halide layer or the adhesion layer conform to the shape of the substrate. Also described are methods of forming an article using chemical vapor deposition.

Copper halide layers

Articles are described including a substrate and a copper halide layer on the substrate, where the interfacial free energy between the substrate and the copper halide layer allows the copper halide layer to form continuously, wherein the copper halide layer conforms to the shape of the substrate. The articles may further include an adhesion layer disposed in-between the substrate and the copper halide layer, where the surface free energy between the adhesion layer and the copper halide layer allows the copper halide layer to form continuously, wherein the copper halide layer or the adhesion layer conform to the shape of the substrate. Also described are methods of forming an article using chemical vapor deposition.

MATERIAL SUBSTITUTION OF CUPROUS CHLORIDE MOLTEN SALT AND OXYGEN GAS IN THE THERMOLYSIS REACTOR OF HYDROGEN PRODUCTION Cu-Cl CYCLE
20170015551 · 2017-01-19 ·

In the thermochemical water splitting process by the CuCl cycle, oxygen gas is produced by a thermolysis process in a three-phase reactor. A precise knowledge of the hydrodynamic and heat transfer analyses is required for the scale-up of the thermolysis reactor. However, in the experimental studies of the scale up analysis, there are some challenges in using the actual materials of the thermolysis reactor products (i.e. molten salt CuCl and oxygen gas). In accordance with the teachings herein, alternative materials are defined, by using dimensional analyses, to simulate the hydrodynamic and heat transfer behaviors of the actual materials. It has been found that these alternative materials are liquid water at 222 C. and helium gas at 902 C. The alternative materials provide safe environment for the experimental runs as well as lower operating temperature. Furthermore, these alternative materials are more readily available and are low cost.

DIRECT CONTACT HEAT TRANSFER IN THE THERMOLYSIS REACTOR OF HYDROGEN PRODUCTION Cu-Cl CYCLE
20170015552 · 2017-01-19 ·

In the thermochemical water splitting process by CuCl cycle, oxygen gas is produced by a thermolysis process in a three-phase reactor. IN accordance with the teachings herein, a technique is provided to achieve the high challenging thermal requirements of the thermolysis reactor, whereby an optimized heat transfer configuration is used. The technique involves using some of the pre-heated stoichiometric oxygen gas produced from the thermolysis reaction, to transfer heat directly to the slurry of molten CuCl and solid Cu.sub.2OCl.sub.2 inside the thermolysis reactor. Experiments were performed to examine the volumetric heat transfer coefficient for the direct contact heat transfer between the gas and the slurry. It was found that the thermal scale up analysis of the thermolysis reactor with direct contact heat transfer, is based on the amount of heat carried by the oxygen gas rather than the amount of heat transferred by direct contact heat transfer.

DIRECT CONTACT HEAT TRANSFER IN THE THERMOLYSIS REACTOR OF HYDROGEN PRODUCTION Cu-Cl CYCLE
20170015552 · 2017-01-19 ·

In the thermochemical water splitting process by CuCl cycle, oxygen gas is produced by a thermolysis process in a three-phase reactor. IN accordance with the teachings herein, a technique is provided to achieve the high challenging thermal requirements of the thermolysis reactor, whereby an optimized heat transfer configuration is used. The technique involves using some of the pre-heated stoichiometric oxygen gas produced from the thermolysis reaction, to transfer heat directly to the slurry of molten CuCl and solid Cu.sub.2OCl.sub.2 inside the thermolysis reactor. Experiments were performed to examine the volumetric heat transfer coefficient for the direct contact heat transfer between the gas and the slurry. It was found that the thermal scale up analysis of the thermolysis reactor with direct contact heat transfer, is based on the amount of heat carried by the oxygen gas rather than the amount of heat transferred by direct contact heat transfer.

COPPER-64 COMPOSITIONS AND PURIFICATION PROCESSES FOR THE PREPARATION OF NOVEL COPPER-64 COMPOSITIONS

Compositions comprising high levels of high specific activity copper-64, and process for preparing said compositions. The compositions comprise from about 2 Ci to about 110 Ci, about 15 Ci to about 110 Ci, or about 20 Ci to about 110 Ci of isolated copper-64 and have specific activities of about 50 mCi to about 3800 mCi copper-64 per microgram of copper. The processes for preparing said compositions may comprise bombarding a nickel-64 target with a low-medium energy, high current proton beam, and purifying the copper-64 from other metals by a process comprising ion exchange chromatography and/or a process comprising a combination of extraction chromatography and ion exchange chromatography.

COPPER-64 COMPOSITIONS AND PURIFICATION PROCESSES FOR THE PREPARATION OF NOVEL COPPER-64 COMPOSITIONS

Compositions comprising high levels of high specific activity copper-64, and process for preparing said compositions. The compositions comprise from about 2 Ci to about 110 Ci, about 15 Ci to about 110 Ci, or about 20 Ci to about 110 Ci of isolated copper-64 and have specific activities of about 50 mCi to about 3800 mCi copper-64 per microgram of copper. The processes for preparing said compositions may comprise bombarding a nickel-64 target with a low-medium energy, high current proton beam, and purifying the copper-64 from other metals by a process comprising ion exchange chromatography and/or a process comprising a combination of extraction chromatography and ion exchange chromatography.

Preparation method for electronic-grade copper chloride dihydrate

The present disclosure relates to the technical field of preparation of copper chloride, and in particular to a method of preparing an electronic-grade copper chloride dihydrate, which mainly includes the following steps: dissolving a copper salt in a first hydrochloric acid solution to obtain a copper salt solution; performing two solid-liquid separations for the copper salt solution to obtain a filtrate; wherein, the two solid-liquid separations do not have sequence and include an adhesive separation and a co-precipitation separation; the adhesive separation is a solid-liquid separation performed by adding a waste PCB board powder and continuously stirring; the co-precipitation separation is a solid-liquid separation performed by adding tin chloride compound and continuously stirring; adding a second hydrochloric acid into the filtrate and adjusting pH and then performing evaporation concentration to a supersaturated solution, adding copper chloride seed crystal and then performing cooling crystallization and centrifugal separation.