Embodiments of the present invention are a filtering element, a filtering equipment and a water circulation cleaning system. In an embodiment, a filtering element includes a filtering screen and filter particles adhered to one side of the filtering screen, sizes of the filter particles being gradually increased in a direction from the one side to the other side of the filtering screen. Meanwhile, there also provides a filtering equipment including the abovementioned filtering element and a water circulation cleaning system including the abovementioned filtering equipment.

A method for producing ultrapure water includes supplying raw water (industrial water, tap water, well water, or used ultrapure water discharged from semiconductor plants) to a pretreatment system for treating the raw water to produce water, supplying the water to a primary water purification system having a reverse osmosis membrane separation unit to produce a primarily purified water, and supplying the primarily purified water to a secondary purification system to produce ultrapure water.

A method and system of providing ultrapure water for semiconductor fabrication operations is provided. The water is treated by utilizing a free radical scavenging system and a free radical removal system. The free radical scavenging system can utilize actinic radiation with a free radical precursor compound, such as ammonium persulfate. The free radical removal system can comprise use of a reducing agent. The ultrapure water may be further treated by utilizing ion exchange media and degasification apparatus. A control system can be utilized to regulate addition of the precursor compound, the intensity of the actinic radiation, and addition of the reducing agent to the water.

A method including directing an aqueous solution having dissolved carbon dioxide and dissolved ozone into a vessel, removing an amount of the dissolved carbon dioxide and irradiating the effluent with ultraviolet light to decompose an amount of the dissolved ozone is disclosed. The method may include removing the dissolved carbon dioxide by controlling pH. The method may include removing the dissolved carbon dioxide by contact with a membrane degasifier. A system including a channel fluidly connectable to a source of an aqueous solution having dissolved carbon dioxide and dissolved ozone, a dissolved carbon dioxide removal subsystem, and a source of ultraviolet irradiation is also disclosed. The dissolved carbon dioxide removal subsystem may include a source of a pH adjuster. The dissolved carbon dioxide removal subsystem may include a membrane degasifier.

A method, system and composition is described for treating waste generated from manufacturing operations including at least one of Printed Circuit Boards Fabrication (PCB FAB), General Metal Finishing (GMF), semiconductors manufacturing, chemical milling, and Physical Vapour Deposition (PVD). The method, system and composition are used to create zero liquid discharge recycling.

In a system for decomposing organic compounds in water for use in semiconductor manufacturing, a chemical reactor vessel having a fluid inlet and a fluid outlet, a persulfate anion addition system upstream of the reactor vessel, and a light emitting device contained within the reactor vessel. The light emitting device provides light capable of decomposing persulfate anions.

An apparatus for producing conditioned water configured to add a pH adjuster and/or a redox potential regulator to ultrapure water to produce conditioned water, the generator including: a chemical tank configured to store a chemical solution containing the pH adjuster and/or the redox potential regulator; a chemical injection pipe configured to inject the chemical solution in the chemical tank into the ultrapure water; and a degassing device configured to degas the chemical solution injected into the ultrapure water. When producing conditioned water useful as wash water for semiconductor wafers by adding a pH adjuster and/or a redox potential regulator into ultrapure water, the present invention can solve problems such as incorporation of DO from the chemical solution, injection failure and measurement failure of the flow meter due to foaming of the chemical solution, thereby enabling stable production of conditioned water with a low DO concentration and high water quality.

A method and system of providing ultrapure water for semiconductor fabrication operations is provided. The water is treated by utilizing a free radical scavenging system. The free radical scavenging system can utilize actinic radiation with a free radical precursor compound, such as ammonium persulfate. The ultrapure water may be further treated by utilizing ion exchange media and degasification apparatus. A control system can be utilized to regulate a continuously variable intensity of the actinic radiation.

A washing water supply arrangement (50) comprises an ultra-pure water production unit (54), a supply pipe (52), an operation control (53) and an ultra-pure water impellent arrangement (55). A first end of the supply pipe (52) is connected to an output from the ultra-pure water production unit (54). A second end of the supply pipe is adapted for being connected to a semiconductor washing apparatus. The operation control (53) is configured for controlling the ultra-pure water production unit (54) to produce a pre-determined amount of ultra-pure water upon demand. The ultra-pure water impellent arrangement (55) has access to a source of an inert gas and is configured for rinsing the supply pipe (52) from water with the inert gas after delivery of the pre-determined amount of ultra-pure water. A semiconductor washing system, a semiconductor production system and a method for supplying washing water are also disclosed.

Systems for prequalifying components for a processing chamber are described. The systems may be used to clean particulates from chamber parts and concurrently quantify the cleanliness. The systems may be used to qualify replacement parts before sending to a customer site for installation. The systems have three adjacent compartments separated by impermeable barriers. All three compartments are filled with liquid while cleaning a chamber component. The center compartment contains a submerged component for cleaning and qualifying. Two compartments on either side of the center compartment are configured with submerged ultrasonic transducers to deliver ultrasonic energy to either side of the component being cleaned and prequalified. A liquid pump is connected to the cleaning tub to recirculate water from the cleaning bath and another liquid pump is configured to remove a small amount of the cleaning bath to sample particulates.