Provided is a wavelength conversion member that can be readily adjusted in chromaticity and can be increased in productivity and a production method for the wavelength conversion member. A wavelength conversion member 1 having a first principal surface 1a and a second principal surface 1b opposed to each other includes a glass matrix 2 and phosphor particles 3 disposed in the glass matrix 2, wherein concentrations of the phosphor particles 3 in the first principal surface 1a and in the second principal surface 1b are higher than concentrations of the phosphor particles 3 in surface layer bottom planes 1c and 1d located 20 μm inward from the first principal surface 1a and 20 μm inward from the second principal surface 1b, respectively.

Provided is a wavelength conversion member that can be readily adjusted in chromaticity and can be increased in productivity and a production method for the wavelength conversion member. A wavelength conversion member 1 having a first principal surface 1a and a second principal surface 1b opposed to each other includes a glass matrix 2 and phosphor particles 3 disposed in the glass matrix 2, wherein concentrations of the phosphor particles 3 in the first principal surface 1a and in the second principal surface 1b are higher than concentrations of the phosphor particles 3 in surface layer bottom planes 1c and 1d located 20 μm inward from the first principal surface 1a and 20 μm inward from the second principal surface 1b, respectively.

The present invention generally relates to multi-layer, flat glass structures and a method of manufacturing multi-layer, flat glass structures.

The present invention generally relates to multi-layer, flat glass structures and a method of manufacturing multi-layer, flat glass structures.

Glass-based articles having defined stress profiles and methods for manufacturing such glass-based articles are provided. A non-limiting glass-based article comprises an outer region extending from the surface to a depth of compression, wherein the outer region is under a neutral stress or a first compressive stress, a core region under a second compressive stress, the second compressive stress defining a compression peak having a maximum compression value and a maximum width at zero stress in a range of from about 1 micrometer to about 200 micrometers, and an intermediate region disposed between the surface and the core region, wherein the intermediate region is under a tensile stress.

Glass-based articles having defined stress profiles and methods for manufacturing such glass-based articles are provided. A non-limiting glass-based article comprises an outer region extending from the surface to a depth of compression, wherein the outer region is under a neutral stress or a first compressive stress, a core region under a second compressive stress, the second compressive stress defining a compression peak having a maximum compression value and a maximum width at zero stress in a range of from about 1 micrometer to about 200 micrometers, and an intermediate region disposed between the surface and the core region, wherein the intermediate region is under a tensile stress.

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

A method of forming a bond between substrates and manipulating the bond comprises: emitting a first laser energy onto a strip of an absorption material disposed between a first substrate and a second substrate until the strip diffuses into the first substrate and the second substrate resulting in workpiece with a bond between the first substrate and the second substrate; emitting a second laser energy through the workpiece at the bond to create a fault line through the bond, the first substrate, and the second substrate, the second laser energy provided by an approximated Bessel beam, the approximated Bessel beam incident upon the bond having a diameter that is greater than a width of the bond; and repeating emitting the second laser energy step along a length of the bond to create a series of fault lines through the bond, the series of fault lines forming a contour.

A method of forming a bond between substrates and manipulating the bond comprises: emitting a first laser energy onto a strip of an absorption material disposed between a first substrate and a second substrate until the strip diffuses into the first substrate and the second substrate resulting in workpiece with a bond between the first substrate and the second substrate; emitting a second laser energy through the workpiece at the bond to create a fault line through the bond, the first substrate, and the second substrate, the second laser energy provided by an approximated Bessel beam, the approximated Bessel beam incident upon the bond having a diameter that is greater than a width of the bond; and repeating emitting the second laser energy step along a length of the bond to create a series of fault lines through the bond, the series of fault lines forming a contour.