A wafer-level homogeneous bonding optical structure includes two optical lens sets disposed on an optically transparent wafer and a spacer disposed on the optically transparent wafer and between the two optical lens sets. The spacer is homogeneously bonded to and integrated with the optically transparent wafer in the absence of a heterogeneous adhesive.

A wafer-level homogeneous bonding optical structure includes two optical lens sets disposed on an optically transparent wafer and a spacer disposed on the optically transparent wafer and between the two optical lens sets. The spacer is homogeneously bonded to and integrated with the optically transparent wafer in the absence of a heterogeneous adhesive.

Methods, apparatuses, devices, and optical components are described. One or more materials used in an optical system may be bonded together using a pulsed laser beam. The bonding process may include transmitting a pulsed laser to irradiate an interface between two components, which may include two optical components or an optical component and a mounting component. The pulsed laser may generate one or more bonding locations where the components are in relatively close contact with each other, which may secure the components together via at least partial melting of material at one or more surfaces of the components. In some examples, the pulsed laser may be scanned over the bonding locations some quantity of times and/or using a pattern to achieve the bond. In some aspects, one or more absorbing layers may be added to the components.

Methods, apparatuses, devices, and optical components are described. One or more materials used in an optical system may be bonded together using a pulsed laser beam. The bonding process may include transmitting a pulsed laser to irradiate an interface between two components, which may include two optical components or an optical component and a mounting component. The pulsed laser may generate one or more bonding locations where the components are in relatively close contact with each other, which may secure the components together via at least partial melting of material at one or more surfaces of the components. In some examples, the pulsed laser may be scanned over the bonding locations some quantity of times and/or using a pattern to achieve the bond. In some aspects, one or more absorbing layers may be added to the components.

Methods of making a transparent glass-based article including at least two transparent glass-based substrates and a laser-induced bond therebetween. Methods include arranging the two transparent glass-based substrates relative to each other to form a contact area. Methods also include providing a laser beam contiguous the contact area to bond the two transparent glass-based substrates.

A compound lens assembly and method for making a compound lens assembly useful for deep ultraviolet lithography are described. The compound lens assembly includes a first lens component having an optical surface bonded to an optical surface of a second lens component. The bonding at the interface can be achieved using a hydroxide catalysis bonding technique. The compound lens assembly and process for making same solve problems relating to constringence and/or inherent birefringence known for conventional optical elements used in deep ultraviolet lithography or inspection of wafers or reticles in the DUV.

A compound lens assembly and method for making a compound lens assembly useful for deep ultraviolet lithography are described. The compound lens assembly includes a first lens component having an optical surface bonded to an optical surface of a second lens component. The bonding at the interface can be achieved using a hydroxide catalysis bonding technique. The compound lens assembly and process for making same solve problems relating to constringence and/or inherent birefringence known for conventional optical elements used in deep ultraviolet lithography or inspection of wafers or reticles in the DUV.

A glass optical component with embedded mask may be formed from multiple, discrete glass member components using a non-adhesive bonding process. A black mask may be created at a surface of a first member component using a deposition or a printing-and-sintering process. A backfill coating may then be applied to and then polished at the surface of the first member component. Next, the first member component may be bonded with a second member component, with the non-adhesive bonding process, at the surface of the first member component to form the optical component with the black mask embedded between the first and second member components. In addition, the glass optical component forming process may be implemented on a glass wafer level to make multiple glass optical components at a same time.

A glass optical component with embedded mask may be formed from multiple, discrete glass member components using a non-adhesive bonding process. A black mask may be created at a surface of a first member component using a deposition or a printing-and-sintering process. A backfill coating may then be applied to and then polished at the surface of the first member component. Next, the first member component may be bonded with a second member component, with the non-adhesive bonding process, at the surface of the first member component to form the optical component with the black mask embedded between the first and second member components. In addition, the glass optical component forming process may be implemented on a glass wafer level to make multiple glass optical components at a same time.