A glass substrate comprises: a first position, wherein a tensile stress of the glass substrate is insufficient to cause fragmentation of the glass substrate into small pieces upon fracture of the glass substrate; and a second position, wherein the glass substrate is bent relative to the first position, and wherein the tensile stress of the glass substrate is sufficient to cause fragmentation of the glass substrate into small pieces upon fracture of the glass substrate. The glass substrate can include a first surface and a second surface. In the first position, the first surface and the second surface of the glass substrate can be planar. In the second position, the first surface and the second surface of the glass substrate can be planar. The small pieces can be generally cubic. In the second position, the glass substrate can be bent uniaxially along a bend axis of the glass substrate.

A glass substrate comprises: a first position, wherein a tensile stress of the glass substrate is insufficient to cause fragmentation of the glass substrate into small pieces upon fracture of the glass substrate; and a second position, wherein the glass substrate is bent relative to the first position, and wherein the tensile stress of the glass substrate is sufficient to cause fragmentation of the glass substrate into small pieces upon fracture of the glass substrate. The glass substrate can include a first surface and a second surface. In the first position, the first surface and the second surface of the glass substrate can be planar. In the second position, the first surface and the second surface of the glass substrate can be planar. The small pieces can be generally cubic. In the second position, the glass substrate can be bent uniaxially along a bend axis of the glass substrate.

A strengthened cover glass or glass-ceramic sheet or article as well as processes and systems for making the strengthened glass or glass-ceramic sheet or article is provided for use in consumer electronic devices. The process comprises cooling the cover glass sheet by non-contact thermal conduction for sufficiently long to fix a surface compression and central tension of the sheet. The process results in thermally strengthened cover glass sheets for use in or on consumer electronic products.

A strengthened cover glass or glass-ceramic sheet or article as well as processes and systems for making the strengthened glass or glass-ceramic sheet or article is provided for use in consumer electronic devices. The process comprises cooling the cover glass sheet by non-contact thermal conduction for sufficiently long to fix a surface compression and central tension of the sheet. The process results in thermally strengthened cover glass sheets for use in or on consumer electronic products.

A forming apparatus includes a frame, an air grid system, and a forming system; the air grid system includes a plurality of upper air grids and a plurality of lower air grids; the upper air grids are mounted at an upper part of the frame through a lifting mechanism, and the lower air grids are mounted in the forming system at a lower part of the frame; a gradual transition section is arranged at an inlet side of the forming system to enable a glass pane to be gradually arched in a transverse direction, and the gradually arched glass pane is conveyed into the forming system; and the forming system includes two groups of longitudinal forming and arching mechanisms and a plurality of transverse forming and arching mechanisms arranged in a glass pane conveying direction.

A quench arrangement for quenching glass sheets includes a main quench station having upper and lower main quench heads for performing a primary quench operation on a glass sheet, a first lower secondary quench head located downstream of the main quench station, and a second lower secondary quench head located downstream of the first lower secondary quench head. The arrangement further includes an upper secondary quench system positioned above the first and second lower secondary quench heads, and the upper secondary quench system is cooperable with the lower secondary quench heads to perform further cooling of the glass sheet. The arrangement further includes a conveyor located above the second lower secondary quench head for moving the glass sheet away from the second lower secondary quench head.

The present disclosure relates to a heating and cooling apparatus having a moisture removal function for testing electrical characteristics of a semiconductor element using a probe system, in which the heating and cooling apparatus is configured to be capable of hot and cold measurement of a wafer or a flat panel display product and to be capable of efficiently removing water droplets generated at the time of cooling by adding a vortex tube to a thermo-stream provided in a probe head of the probe system and configuring the vortex tube to be interlocked with a moisture removal device.

The present disclosure relates to a heating and cooling apparatus having a moisture removal function for testing electrical characteristics of a semiconductor element using a probe system, in which the heating and cooling apparatus is configured to be capable of hot and cold measurement of a wafer or a flat panel display product and to be capable of efficiently removing water droplets generated at the time of cooling by adding a vortex tube to a thermo-stream provided in a probe head of the probe system and configuring the vortex tube to be interlocked with a moisture removal device.

A cooling frame for a bent glass sheet, includes a support track for the sheet and a removable bearing piece that is able, in a bearing position and during cooling of the sheet by air blowing, to bear on the top face of the sheet and at the periphery thereof. The bent sheet cooled on the cooling frame maintains contact with the frame during the cooling operation and its shape complies better with that which is desired.

A glass sheet forming and annealing system disclosed provides control of edge stresses by maintaining a press formed glass sheet on an annealing ring (72) below a heated upper forming mold (58) within a forming station (12) for slow cooling toward the glass strain point temperature.