An apparatus for manufacturing a display device includes: a stage unit; and a suction unit located above the stage unit, wherein the suction unit includes: a main body including an outer box with top and bottom openings and an inner cup disposed in the outer box; a first air blower disposed above the main body and including a first main pipe extending in a first direction and a second air blower including a second main pipe extending in a second direction intersecting the first direction; a lower plate coupled to a lower end of the outer box and including a through hole; and a suction inlet defined by an inner end of the lower plate defining the through hole and a lower end of the inner cup, wherein the suction inlet is opened downward.

Systems and method for aligning components of photonic systems are provided. An optical component for integration into and optical coupling within a photonic system is created by separating the component from a substrate to form a precisely defined surface on the optical component, the surface being precisely spaced from an optical feature of the component to be optically coupled within the photonic system. The precisely defined surface of the optical component is then pressed against a reference surface to position the optical feature in a predefined position and/or orientation for optical coupling of the optical feature within the photonic system. Passive precise alignment and optical coupling is thus provided without the need for iterative readjustment, multi-axis feedback, or active feedback.

A spacer wafer for producing spacers of electro-optical converter housings is provided. The spacer wafer is a transparent glass plate having a multiplicity of openings separated from one another and distributed in a grid so that singulated spacers are obtainable by severing sections of the glass plate along separating lines between the openings. The openings have side walls with microstructuring that has a roughness with an average roughness value R.sub.a of less than 0.5 μm with a measurement distance of 500 μm.

A cleaving assembly and a method for cleaving a glass body having a face at a desired angle greater than 0 degrees are disclosed. The assembly comprises a laser device for emitting a laser beam, a rotating device, and a positioning fixture. The rotating device has a head that rotates about a central axis that is orthogonal to the laser beam. The positioning fixture is operatively mounted to the head and centered axially along the central axis and is also rotatably driven by the rotating device. The positioning fixture has a tapered surface that is transverse to the central axis and that supports the glass body at a predetermined angle relative to the central axis. Rotation of the positioning fixture about the central axis when the glass body is exposed to the laser beam, cleaves the face of the glass body at the desired angle due to the glass body being supported transverse to the central axis.

A method including emitting a laser beam toward a transparent workpiece such that portions of the laser beam pass through openings of a beam shaping structure and form corresponding laser beam focal lines across the transparent workpiece. The laser beam focal lines forming a plurality of defects in the transparent workpiece disposed along a contour line. The method further including separating the transparent workpiece along the contour line to provide a first workpiece section and a second workpiece section and a cut edge surface on each of the first and second workpiece sections, each cut edge including a defect region and an unaffected region. The defect region having a higher surface roughness than the unaffected region and a minimum distance of the unaffected region to the first major surface being about 20% or less of a thickness between the first major surface and the second major surface.

A glass sheet processing apparatus includes a first gantry assembly that extends across a glass sheet in a cross-machine direction. The first gantry assembly includes a processing head that moves along a length of the first gantry assembly and includes a laser comprising an optical arrangement positioned in a beam path of the laser providing a laser beam focal line that is formed on a beam output side of the optical arrangement. A second gantry assembly extends across the glass sheet in the cross-machine direction. The second gantry assembly includes a processing head that moves along a length of the second gantry assembly.

A method of manufacturing a cell unit substrate, includes: a modified zone-formation step in which modified zones are formed along a predetermined cutting line on the mother substrate to be spaced apart from each other by a first distance by irradiating the mother substrate with laser beams having an energy intensity within an ablation threshold of the mother substrate along the cutting line, a modified zone-etching step in which through-holes are formed along the cutting line on the mother substrate to be spaced apart from each other by the first distance by etching the modified zones, a surface strengthening step in which the mother substrate having the through-holes therein is subjected to surface strengthening, with the mother substrate dipped in a strengthening solution, and a substrate separation step in which the cell unit substrates are separated from the surface-strengthened mother substrate.

A method is disclosed for dividing a composite material in which a brittle material layer and a resin layer are laminated, including: a resin removing step of irradiating the resin layer with a laser beam oscillated from a first laser source along a scheduled dividing line of the composite material to form a processing groove along the scheduled dividing line; a brittle material removing step of irradiating the brittle material layer with a laser beam oscillated from an ultrashort pulsed laser source along the scheduled dividing line to form a processing mark along the scheduled dividing line; and a brittle material layer dividing step of generating thermal stress in the brittle material layer by irradiating the brittle material layer with a laser beam oscillated from a second laser source from the opposite side to the resin layer to thereby divide the brittle material layer.

A method for separating a substrate of a brittle-hard material is provided. The method includes the steps of introducing defects into the substrate at a spacing from one another along a separation line using at least one pulsed laser beam; selecting an average spacing between neighboring defects and a number of laser pulses for generating a respective defect such that a breaking stress (σ.sub.B) for separating the substrate along the separation line is smaller than a first reference stress (σ.sub.R1) of the substrate and such that an edge strength σ.sub.K of the separation edge obtained after separation is greater than a second reference stress (σ.sub.R2) of the substrate; and separating the substrate after introducing the defects by applying a stress along the separation line.

A method for producing an intermediate glass plate includes a defect formation step, a separation step, and a polishing step. In the defect formation step, a defect is formed on main surfaces of glass blanks by irradiating a laminate of the glass blanks with a laser beam from one side in a lamination direction in which the glass blanks are laminated, along the lamination direction, and moving the laser beam relative to the laminate such that a circle is drawn in a view from the main surfaces of the glass blanks. In the separation step, a cylindrical laminate is formed by separating a removal target portion along the defect while maintaining the laminate. In the polishing step, a side wall surface of the laminate is polished while maintaining the cylindrical laminate so as to obtain a disk-shaped intermediate glass plate that has been subjected to edge surface polishing.