C03B33/0222

LASER-BASED CUTTING OF TRANSPARENT COMPONENTS FOR AN ELECTRONIC DEVICE
20220193825 · 2022-06-23 ·

Laser-based techniques for cutting and drilling of transparent components are disclosed. These laser-based techniques rely on laser modification of transparent substrates followed by chemical etching and are suitable for use with a variety of transparent substrates. Transparent components and enclosures and electronic devices including the transparent components are also disclosed herein.

METHOD OF STRUCTURING A GLASS ELEMENT AND STRUCTURED GLASS ELEMENT PRODUCED THEREBY

A method of structuring a glass element having a first side face and a second side face is provided. The method includes the steps of: producing a filament-shaped flaw in the glass element with a pulsed laser beam along a focus line; etching to remove glass in the filament-shaped flaw to form a wall extending from the first side face towards the second side face, the wall having a boundary line that is tapered at a vertex between the wall and the first side face with a taper angle with respect to a perpendicular of the first side face; and adjusting the taper angle by controlling a feature of the focus line. The feature is selected from a group consisting of a position of the focus line, a length of the focus line, an intensity distribution of the focus line, and any combinations thereof.

Method and device for the laser-based machining of sheet-like substrates

A method for the laser-based machining of a sheet-like substrate, in order to separate the substrate into multiple portions, in which the laser beam of a laser for machining the substrate is directed onto the latter, is characterized in that, with an optical arrangement positioned in the path of rays of the laser, an extended laser beam focal line, seen along the direction of the beam, is formed on the beam output side of the optical arrangement from the laser beam directed onto the latter, the substrate being positioned in relation to the laser beam focal line such that an induced absorption is produced in the material of the substrate in the interior of the substrate along an extended portion, seen in the direction of the beam, of the laser beam focal line, such that a material modification takes place in the material of the substrate along this extended portion.

Laser processing of workpieces
11344972 · 2022-05-31 · ·

A method for processing a transparent workpiece includes generating a beam of radiation and forming a defect in or on an object. The beam is a quasi-non-diffracting beam and has a focal volume. Forming the defect includes directing the beam onto the object and positioning the focal volume partially or fully within the object. Generating the beam includes partially blocking the beam upstream of the focal volume to adjust an axial symmetry of the freeform energy distribution with respect to an optical axis of the beam using an adjustable blocking element and/or spatially modulating a phase of the beam upstream of the focal volume to adjust a geometry of the freeform energy distribution using a phase mask. The freeform energy distribution has energy sufficient to induce multi-photon absorption in a region of the object that is co-located with the focal volume. The induced multi-photon absorption produces the defect.

METHOD FOR SEPARATING ULTRATHIN GLASS

A method for separating an ultrathin glass using ultrashort laser pulses of an ultrashort pulse laser includes focusing the ultrashort laser pulses into the ultrathin glass such that a resulting focal zone is elongated in a beam direction and extends over an entire thickness of the ultrathin glass. The ultrashort laser pulses have a non-radially symmetric beam cross section perpendicular to a beam propagation direction. The method further includes introducing material modifications into the ultrathin glass along a separating line using the ultrashort laser pulses focused into the ultrathin glass, and separating the ultrathin glass along the separating line.

Manufacturing method of glass article and glass article
11345632 · 2022-05-31 · ·

A manufacturing method of a glass article having an organic film includes irradiating a first main surface of a glass plate having the first main surface and a second main surface, opposite each other, with a laser light of a first laser, to form an in-plane void region, in which voids are arrayed, on the first main surface, and internal void arrays, including voids arrayed from the in-plane void region to the second main surface, in the glass plate; depositing the organic film on the first main surface or the second main surface of the glass plate; and irradiating and scanning the first main surface or the second main surface, on which the organic film was deposited, with a laser light of a second laser, along the in-plane void region, to separate the glass article from the glass plate along the in-plane void region.

MICRO-PERFORATED PANEL SYSTEMS, APPLICATIONS, AND METHODS OF MAKING MICRO-PERFORATED PANEL SYSTEMS
20220148550 · 2022-05-12 ·

The described embodiments relate generally to a micro-perforated panel systems, methods for noise abatement, methods of meeting safe breaking requirements and methods of making micro-perforated panel systems. In particular, embodiments relate to glass micro-perforated panel systems for noise abatement and meeting safe breaking requirements.

METHOD FOR DIVIDING COMPOSITE MATERIAL AND COMPOSITE MATERIAL

A method is disclosed for dividing a composite material 10 including a brittle material layer 1 and a resin layer 2 that are laminated together, the method includes: a resin removing step of applying laser light L1 oscillated from a CO.sub.2 laser light source 20 to the resin layer along a planned division line DL of the composite material, so that a processed groove 24 is formed along the planned division line; and a brittle material removing step of applying, after the resin removing step, laser light L2 oscillated from an ultrashort pulsed laser light source 30 to the brittle material layer along the planned division line, so that processed marks 11 are formed along the planned division line. The processed marks formed in the brittle material removing step open on the resin layer side and do not penetrate through the brittle material layer.

METHODS AND APPARATUS FOR FREE-FORM CUTTING OF FLEXIBLE THIN GLASS
20220135463 · 2022-05-05 ·

Methods and apparatus provide for: supporting a source glass sheet of 0.3 millimeters (mm) or less in thickness; scoring the glass sheet at an initiation line using a mechanical scoring device; applying a carbon monoxide (CO) laser beam to the glass sheet starting at the initiation line and continuously moving the laser beam relative to the glass sheet along a cutting line to elevate a temperature of the glass sheet to provide stress at the cutting line sufficient to cut the glass; and separating waste glass from the glass sheet to obtain a desired shape.

SYSTEMS AND METHODS FOR FORMING PARTIAL NANO-PERFORATIONS WITH VARIABLE BESSEL BEAM
20220134475 · 2022-05-05 ·

Embodiments of the present disclosure include a optical assembly comprising: an axicon lens with spherical aberration configured to generate the laser beam focal line, an optical element set spaced part from the optical lens, and a focusing optical element spaced apart from the optical element set, wherein the axicon lens and the optical element set are translatable relative to each other along the laser beam propagation direction and wherein the focusing optical element is in a fixed position along the laser beam propagation direction.