C03B33/04

Crack and scratch resistant glass and enclosures made therefrom

A glass and an enclosure, including windows, cover plates, and substrates for mobile electronic devices comprising the glass. The glass has a crack initiation threshold that is sufficient to withstand direct impact, has a retained strength following abrasion that is greater than soda lime and alkali aluminosilicate glasses, and is resistant to damage when scratched. The enclosure includes cover plates, windows, screens, and casings for mobile electronic devices and information terminal devices.

METHOD AND DEVICE FOR LASER-ASSISTED SEPARATION OF A PORTION FROM A SHEET GLASS ELEMENT

A method for separating a portion from a sheet glass element having a thickness of at least 2 millimeters along an intended separation line that divides the sheet glass element into the portion and a remaining main part is provided. The method includes producing filamentary damages comprising sub-micrometer hollow channels in a volume of the glass sheet element adjacently aligned along the separation line; and heating and/or cooling the glass sheet element to cause expansion and/or contraction so that the portion detaches from the main part along the separation line. The portion and the remaining main part each remain intact as a whole. The step of producing the filamentary damages includes generating a plasma within the volume with laser pulses of an ultrashort pulse laser; and displacing points of incidence of the laser pulses over a surface of the glass sheet element along the separation line.

METHOD AND DEVICE FOR LASER-ASSISTED SEPARATION OF A PORTION FROM A SHEET GLASS ELEMENT

A method for separating a portion from a sheet glass element having a thickness of at least 2 millimeters along an intended separation line that divides the sheet glass element into the portion and a remaining main part is provided. The method includes producing filamentary damages comprising sub-micrometer hollow channels in a volume of the glass sheet element adjacently aligned along the separation line; and heating and/or cooling the glass sheet element to cause expansion and/or contraction so that the portion detaches from the main part along the separation line. The portion and the remaining main part each remain intact as a whole. The step of producing the filamentary damages includes generating a plasma within the volume with laser pulses of an ultrashort pulse laser; and displacing points of incidence of the laser pulses over a surface of the glass sheet element along the separation line.

PROCESS FOR BREAKING OUT AN INNER SHAPE IN A GLASS SHEET
20170355634 · 2017-12-14 ·

A break-out process includes scoring a cutting line in the surface of the glass using a cutting tool, which cutting line delimits the outer contour of the inner shape and the inner contour of a peripheral shape; bringing the peripheral shape of the glass sheet into contact with a bearing system along the outer contour of the inner shape; the use of a deformation system for deforming one of the inner shape and of the peripheral shape by convex bending toward the side opposite the cutting line. The differential deformation between the inner shape and the peripheral shape is sufficient to break out the inner shape along the cutting line and create the distance needed for the contactless extraction of the inner shape relative to the peripheral shape. The extraction is carried out while maintaining the convex bending.

PROCESS FOR BREAKING OUT AN INNER SHAPE IN A GLASS SHEET
20170355634 · 2017-12-14 ·

A break-out process includes scoring a cutting line in the surface of the glass using a cutting tool, which cutting line delimits the outer contour of the inner shape and the inner contour of a peripheral shape; bringing the peripheral shape of the glass sheet into contact with a bearing system along the outer contour of the inner shape; the use of a deformation system for deforming one of the inner shape and of the peripheral shape by convex bending toward the side opposite the cutting line. The differential deformation between the inner shape and the peripheral shape is sufficient to break out the inner shape along the cutting line and create the distance needed for the contactless extraction of the inner shape relative to the peripheral shape. The extraction is carried out while maintaining the convex bending.

Glass ribbon breaking devices and methods of producing glass sheets

Methods of producing a glass sheet each comprise the step of creating a vacuum to force the entire lateral portion of the glass ribbon to engage an anvil portion of a breaking device in the elastic zone. The vacuum is provided by a plurality of pressure zones that are operated independent from one another, wherein each pressure zone is provided with a set of suction cups. In further examples, glass ribbon breaking devices each include a plurality of pressure zones that are configured to be operated independent from one another with each pressure zone being provided with set of suction cups.

Glass ribbon breaking devices and methods of producing glass sheets

Methods of producing a glass sheet each comprise the step of creating a vacuum to force the entire lateral portion of the glass ribbon to engage an anvil portion of a breaking device in the elastic zone. The vacuum is provided by a plurality of pressure zones that are operated independent from one another, wherein each pressure zone is provided with a set of suction cups. In further examples, glass ribbon breaking devices each include a plurality of pressure zones that are configured to be operated independent from one another with each pressure zone being provided with set of suction cups.

GLASS WAFER AND GLASS ELEMENT FOR PRESSURE SENSORS

A glass wafer is provided that includes a sheetlike glass substrate with an opening. The sheetlike glass substrate is configured for use in a sensor selected from a group consisting of a pressure sensor, a piezoresistive sensor, a capacitive pressure sensor, and a piezoresistive pressure sensor. The opening is defined in the glass substrate from a first surface to a second, opposite surface. The opening has a cross-sectional area that is delimited by a straight portion having a minimum length of at least 10 μm and a side face with a surface characterized by a skewness (Ssk) of at most 5.0.

SYSTEMS AND METHODS FOR FABRICATING AN ARTICLE WITH AN ANGLED EDGE USING A LASER BEAM FOCAL LINE

A method of separating a substrate includes directing a laser beam into the substrate such that a focal line is formed with at least a portion of the laser beam focal line within a bulk of the substrate at an oblique angle with respect to a laser-incident surface of the substrate. The laser beam focal line is formed by a pulsed laser beam that is disposed along a beam propagation direction. The method further includes pulsing the pulsed laser beam from a first edge of the substrate to a second edge of the substrate in a single pass. The laser beam focal line generates an induced multi-photon absorption within the substrate that produces a damage track within the bulk of the substrate along the laser beam focal line, and the damage track is at an oblique angle relative to the laser-incident surface of the substrate.

SYSTEMS AND METHODS FOR FABRICATING AN ARTICLE WITH AN ANGLED EDGE USING A LASER BEAM FOCAL LINE

A method of separating a substrate includes directing a laser beam into the substrate such that a focal line is formed with at least a portion of the laser beam focal line within a bulk of the substrate at an oblique angle with respect to a laser-incident surface of the substrate. The laser beam focal line is formed by a pulsed laser beam that is disposed along a beam propagation direction. The method further includes pulsing the pulsed laser beam from a first edge of the substrate to a second edge of the substrate in a single pass. The laser beam focal line generates an induced multi-photon absorption within the substrate that produces a damage track within the bulk of the substrate along the laser beam focal line, and the damage track is at an oblique angle relative to the laser-incident surface of the substrate.