A manufacturing method of a glass article having an organic film includes irradiating a first main surface of a glass plate having the first main surface and a second main surface, opposite each other, with a laser light of a first laser, to form an in-plane void region, in which voids are arrayed, on the first main surface, and internal void arrays, including voids arrayed from the in-plane void region to the second main surface, in the glass plate; depositing the organic film on the first main surface or the second main surface of the glass plate; and irradiating and scanning the first main surface or the second main surface, on which the organic film was deposited, with a laser light of a second laser, along the in-plane void region, to separate the glass article from the glass plate along the in-plane void region.

Methods and apparatus provide for: supporting a source glass sheet of 0.3 millimeters (mm) or less in thickness; scoring the glass sheet at an initiation line using a mechanical scoring device; applying a carbon monoxide (CO) laser beam to the glass sheet starting at the initiation line and continuously moving the laser beam relative to the glass sheet along a cutting line to elevate a temperature of the glass sheet to provide stress at the cutting line sufficient to cut the glass; and separating waste glass from the glass sheet to obtain a desired shape.

Methods and apparatus provide for: supporting a source glass sheet of 0.3 millimeters (mm) or less in thickness; scoring the glass sheet at an initiation line using a mechanical scoring device; applying a carbon monoxide (CO) laser beam to the glass sheet starting at the initiation line and continuously moving the laser beam relative to the glass sheet along a cutting line to elevate a temperature of the glass sheet to provide stress at the cutting line sufficient to cut the glass; and separating waste glass from the glass sheet to obtain a desired shape.

A method for cutting, separating and removing interior contoured shapes in thin substrates, particularly glass substrates. The method involves the utilization of an ultra-short pulse laser to form defect lines in the substrate that may be followed by use of a second laser beam to promote isolation of the part defined by the interior contour.

A method for cutting, separating and removing interior contoured shapes in thin substrates, particularly glass substrates. The method involves the utilization of an ultra-short pulse laser to form defect lines in the substrate that may be followed by use of a second laser beam to promote isolation of the part defined by the interior contour.

A plate-like glass element includes a pair of opposite side faces and an opening having a transverse dimension of at least 200 μm. The opening is delimited by an edge. The edge has a plurality of rounded, substantially hemispherical depressions that adjoin one another. The plurality of rounded, substantially hemispherical depressions having abutting concave roundings which form ridges.

A plate-like glass element includes a pair of opposite side faces and an opening having a transverse dimension of at least 200 μm. The opening is delimited by an edge. The edge has a plurality of rounded, substantially hemispherical depressions that adjoin one another. The plurality of rounded, substantially hemispherical depressions having abutting concave roundings which form ridges.

The invention is related to fabrication of transparent materials by means of ultra-short laser pulses. Method to fabricate materials transparent in most part to laser wavelength comprises forming non-centrosymmetric, non-diffracting beam by optical element that contains at least two zones of birefringent structures changing Pancharatnam-Berry Phase according to the rule specific for that particular zone. The distribution of energy, phase and polarization depends on parameters of light approaching said element. Pulse energy is selected to employ main maximum of distribution to form voids elongated in desired direction while side maxima form changes of chemical character between damages from adjacent pulses. Void damages and zones of chemical changes form desired cut line. The workpiece prepared in said manner is placed in chemically aggressive solution, in which zones affected by laser light are dissolved much faster than non-affected ones. This enables achieving cuts with aspect ration up to 1/50.

A method of forming a bond between substrates and manipulating the bond comprises: emitting a first laser energy onto a strip of an absorption material disposed between a first substrate and a second substrate until the strip diffuses into the first substrate and the second substrate resulting in workpiece with a bond between the first substrate and the second substrate; emitting a second laser energy through the workpiece at the bond to create a fault line through the bond, the first substrate, and the second substrate, the second laser energy provided by an approximated Bessel beam, the approximated Bessel beam incident upon the bond having a diameter that is greater than a width of the bond; and repeating emitting the second laser energy step along a length of the bond to create a series of fault lines through the bond, the series of fault lines forming a contour.

A method of forming a bond between substrates and manipulating the bond comprises: emitting a first laser energy onto a strip of an absorption material disposed between a first substrate and a second substrate until the strip diffuses into the first substrate and the second substrate resulting in workpiece with a bond between the first substrate and the second substrate; emitting a second laser energy through the workpiece at the bond to create a fault line through the bond, the first substrate, and the second substrate, the second laser energy provided by an approximated Bessel beam, the approximated Bessel beam incident upon the bond having a diameter that is greater than a width of the bond; and repeating emitting the second laser energy step along a length of the bond to create a series of fault lines through the bond, the series of fault lines forming a contour.