A method is disclosed for dividing a composite material in which a brittle material layer and a resin layer are laminated, including: irradiating the resin layer with a laser beam L1 oscillated from a CO.sub.2 laser source along scheduled dividing lines DL of the composite material to form a processing groove along the scheduled dividing lines; and irradiating the brittle material layer with a laser beam L2 oscillated from an ultrashort pulsed laser source along the scheduled dividing lines to form a processing mark along the scheduled dividing lines. In the resin removing step, in a region IS where the scheduled dividing lines intersect, the laser beam oscillated from the CO.sub.2 laser source is not irradiated multiple times, or an irradiation amount of the laser beam is decreased relative to an irradiation amount in a region other than a region where the scheduled dividing lines intersect.

A manufacturing method of a glass article having an organic film includes irradiating a first main surface of a glass plate having the first main surface and a second main surface, opposite each other, with a laser light of a first laser, to form an in-plane void region, in which voids are arrayed, on the first main surface, and internal void arrays, including voids arrayed from the in-plane void region to the second main surface, in the glass plate;

depositing the organic film on the first main surface or the second main surface of the glass plate; and irradiating and scanning the first main surface or the second main surface, on which the organic film was deposited, with a laser light of a second laser, along the in-plane void region, to separate the glass article from the glass plate along the in-plane void region.

Provided is a method of producing a thin glass resin laminate piece, which includes cutting a thin glass resin laminate through laser processing, and by which a thin glass resin laminate piece capable of preventing the occurrence of air bubbles when bonded to an adherend can be obtained. The method of producing a thin glass resin laminate piece of the present invention includes a step of subjecting a thin glass resin laminate including a thin glass, a resin layer, and a pressure-sensitive adhesive layer in the stated order to laser processing to cut the laminate, wherein a thickness (μm) of the pressure-sensitive adhesive layer and a creep characteristic (μm/Hr) of the pressure-sensitive adhesive layer have a relationship of (thickness (μm)).sup.2×creep characteristic (μm/Hr)≥50×10.sup.3 (μm.sup.2.Math.μm/Hr).

Methods for singulating an optical waveguide material at a contour include directing a first laser beam onto a first side of the optical waveguide material to generate a first group of perforations in the optical waveguide material. A second laser beam is directed onto a second side of the optical waveguide material to generate a second group of perforations in the optical waveguide material. The second side is opposite the first side. The first group of perforations and the second group of perforations define a perforation zone at the contour. A third laser beam is directed at the perforation zone to singulate the optical waveguide material at the perforation zone.

A method of laser processing a coated substrate having a coating later disposed on a transparent workpiece that includes determining an optical characteristic of the coating layer and selecting a beam path for a pulsed laser beam based on the optical characteristic. The beam path is selected a polarization-adjusting beam path and a frequency-adjusting beam path. The method also includes directing the pulsed laser beam down the selected beam path to form a modified pulsed laser beam and directing the modified pulsed laser beam into the transparent workpiece, where the modified pulsed laser beam forms a laser beam focal line that induces absorption in the transparent workpiece to produce a defect in the transparent workpiece. The laser beam focal line includes a wavelength λ, a spot size w.sub.o, and a Rayleigh range Z.sub.R that is greater than

[00001]$F_D\frac{\pi w_o^2}{\lambda },$

where F.sub.D is a dimensionless divergence factor.

A system for separating the front and back outer glass layer from the casing/body of electronic mobile devices and for cutting mobile device screen protector sheets by way of laser burning and cutting comprises a housing, such housing containing a laser; a mirror galvanometer; a safety chamber enclosure; a metal plate with internal glass sheet; a chamber with opening and closing lid, lid button and lid sensor; a control printed circuit board with processor; a power inlet; a power supply; and an on/off switch.

Glass articles with protective films used for processing hard disk drive substrates and methods of forming glass articles with protective films used for processing hard disk drive substrates are provided herein. In one embodiment, a glass blank includes: a first surface, a second surface opposing the first surface, and an edge surface connecting the first surface and the second surface; wherein the first surface comprises a first coated portion and a first uncoated portion surrounding the first coated portion, wherein the first uncoated portion extends a first distance radially inward from the edge toward a center of the first surface, wherein the second surface comprises a second coated portion and a second uncoated portion surrounding the second coated portion, wherein the second uncoated portion extends a second distance radially inward from the edge toward a center of the second surface.

A glass article includes a first surface; a second surface opposed to the first surface; a side surface connecting the first surface to the second surface; a first surface compressive region extending from the first surface to a first depth; a second surface compressive region extending from the second surface to a second depth; and a side compressive region extending from the side surface to a third depth, where the first surface and the side surface are non-tin surfaces, the second surface is a tin surface, and a maximum compressive stress of the second surface compressive region is greater than a maximum compressive stress of the first surface compressive region.

A method includes: providing a plate-like glass element having side faces and an ultrashort pulse laser having a laser beam; directing the laser beam onto one of the side faces; concentrating the laser beam by focusing optics to form an elongated focus in the glass element; producing a filament-shaped flaw in a volume of the glass element by a radiated-in energy of the laser beam, a longitudinal direction of which runs transverse to one of the side faces, and the ultrashort pulse laser radiates in a pulse or a pulse packet having at least two successive laser pulses to produce the filament-shaped flaw; widening the filament-shaped flaw to form a channel by exposing the glass element to an etching including an etching medium which removes glass at a rate of less than 8 μm per hour; and introducing rounded, hemispherical depressions in a wall of the channel by the etching.

A plate-like glass element including a pair of opposite side faces and at least one channel introduced into the glass of the glass element. The at least one channel joins the side faces and opens into the side faces. The at least one channel has a rounded wall and a transverse dimension of less than 100 μm. The at least one channel extends in a longitudinal direction that runs transverse to the side faces. The rounded wall of the at least one channel has a plurality of rounded, substantially hemispherical depressions.