Methods and apparatus provide for: sourcing an ultra-thin glass sheet having first and second opposing major surfaces and perimeter edges therebetween, the glass sheet having a thickness between the first and second surfaces of less than about 400 microns; adhering at least one polymer layer directly or indirectly to at least one of the first and second surfaces of the glass sheet to form a laminated structure; and cutting the laminated structure using at least one of the following techniques: shear cutting, burst cutting, slit cutting, and crush cutting.

A method is disclosed for dividing a composite material in which a brittle material layer and a resin layer are laminated, including radiating a laser light oscillated from a CO.sub.2 laser source to the resin layer along the scheduled dividing line of the composite material and thereby forming a processed groove along the scheduled dividing line; radiating a laser light oscillated from an ultrashort pulse laser source to the brittle material layer along the scheduled dividing line and thereby forming a processing mark along the scheduled dividing line; and dividing the composite material by applying an external force along the scheduled dividing line. The method is characterized in that the processing mark to be formed is perforated through holes along the scheduled dividing line, and the pitch of the through holes is 10 m or less.

In a method of manufacturing a glass interposer, first, stacked bodies formed on a front surface and a back surface of a glass substrate are processed along division lines (streets) to form first grooves having a first width and such a depth as not to reach the glass substrate, while leaving a residual resin portion at bottoms of the first grooves. Thereafter, the residual resin portion is subjected to ablation processing to expose the front surface and the back surface of the glass substrate, thereby forming second grooves having a second width narrower than the first width. A laser beam is applied along the division lines through the second grooves to form modified layers in the inside of the glass substrate, and an external force is exerted on the glass substrate to divide the glass substrate, with the modified layers as division starting points.

Methods for producing a glass sheet are provided. The methods can include forming a glass ribbon from molten glass, applying a polymer precursor to at least a portion of a first or second major surface of the glass ribbon, curing the polymer precursor to form a polymer coating, and separating the glass ribbon to produce at least one glass sheet. Glass ribbons and glass sheets produced by these methods are also disclosed.

A lead assembly and a display panel are disclosed. The lead assembly includes a plurality of leads disposed in a row or in a column, each lead includes a first connection portion, a second connection portion, and a third connection portion that are sequentially connected, a cross sectional area of the second connection portion is smaller than cross sectional areas of the first connection portion and the third connection portion, so that when a cutting line cuts the second connection portion, burrs generated at ends of the first connection portion and the third connection portion can be reduced, and further, defect of a scanning line generated when the first connection portion is connected to a resource driver is alleviated.

Methods for protecting an electrochromic stack, individual layers of the electrochromic stack, a first transparent conductor layer, a second transparent conductor layer, one or more bus bars, or a low E layer on a glass substrate. Methods for protecting the outside surfaces of an insulate glass unit including the substrate and one or more mating lites are also described herein. Methods include laminating a sacrificial coating over the substrate and/or the one or more mating lites, and peeling off the sacrificial coating from the substrate and/or the one or more mating lites.

A system for cutting a substrate that is transparent within a predetermined range of wavelengths in the electromagnetic spectrum is provided that includes: a laser capable of emitting light along a light path and of a predetermined wavelength that is within the range of wavelengths in which the substrate is transparent; an optical element positioned in the light path of the laser such that the laser in conjunction with the optical element is capable of generating induced nonlinear absorption within at least a portion of the substrate; and an interface block composed of a material that is transparent over at least a portion of the predetermined range of wavelengths in the electromagnetic spectrum in which the substrate is also transparent. The interface block is positioned in the light path and between the substrate and the optical element. Further, the substrate will include an edge when extracted from a sheet.

A system for cutting a substrate that is transparent within a predetermined range of wavelengths in the electromagnetic spectrum is provided that includes: a laser capable of emitting light along a light path and of a predetermined wavelength that is within the range of wavelengths in which the substrate is transparent; an optical element positioned in the light path of the laser such that the laser in conjunction with the optical element is capable of generating induced nonlinear absorption within at least a portion of the substrate; and an interface block composed of a material that is transparent over at least a portion of the predetermined range of wavelengths in the electromagnetic spectrum in which the substrate is also transparent. The interface block is positioned in the light path and between the substrate and the optical element. Further, the substrate will include an edge when extracted from a sheet.

Provided is a glass substrate heat chamfering method. An edge of a glass substrate (100) is chamfered by applying thermal shock to the edge of the glass substrate (100), thereby peeling a strip (100a) off from the edge of the glass substrate (100). The strip is cut at a predetermined point thereon before being broken due to the weight thereof. The strip (100a) is cut by applying at least one of heat and a laser beam to the predetermined point or by applying a flame (300a) of a torch (300) to the predetermined point. The application of the thermal shock includes brining a heating element (210) into contact with the edge of the glass substrate (100). In the chamfering, the heating element (210) is relatively moved along the edge of the glass substrate (100) while being brought into contact with the edge of the glass substrate (100).

A glass article includes a first surface; a second surface opposed to the first surface; a side surface connecting the first surface to the second surface; a first surface compressive region extending from the first surface to a first depth; a second surface compressive region extending from the second surface to a second depth; and a side compressive region extending from the side surface to a third depth, where the first surface and the side surface are non-tin surfaces, the second surface is a tin surface, and a maximum compressive stress of the second surface compressive region is greater than a maximum compressive stress of the first surface compressive region.