A method for laser processing a laminate workpiece stack includes forming a contour line in a first transparent workpiece of the laminate workpiece stack having a resin layer disposed between the first transparent workpiece and a second transparent workpiece. Forming the contour line includes focusing a pulsed laser beam into a pulsed laser beam focal line directed into the first transparent workpiece to generate an induced absorption within the first transparent workpiece and translating the pulsed laser beam focal line along a first workpiece separation line, thereby laser forming the contour line having a plurality of defects. The method also includes separating the resin layer along a resin separation line by focusing the pulsed laser beam into the pulsed laser beam focal line directed into the resin layer and translating the pulsed laser beam focal line along the resin separation line, thereby laser ablating the resin layer.

An electronic device is provided with a display such as a liquid crystal display. The display has a layer of liquid crystal material sandwiched between an upper display layer such as a color filter layer and a lower display layer such as a thin-film-transistor layer. An upper polarizer is formed on the upper surface of the color filter layer. A lower polarizer is formed on the lower surface of the thin-film-transistor layer. To protect display layers such as the color filter layer and the thin-film-transistor layer, a coating is deposited on a peripheral edge of the display layer. A laser is used to cut through portions of the polarizer that overhang the display layer while also cutting through the coating on the peripheral edge of the display layer. Following laser trimming operations, the coating is flush with an edge surface of the polarizer.

The present disclosure provides a method for manufacturing a liquid crystal panel motherboard, comprising providing materials that can form projections on a margin area of at least one of two substrates of the liquid crystal panel motherboard, and then fitting said two substrates to each other, so that the margin area of said at least one of the two substrates cannot be fit to a corresponding margin area of the other substrate seamlessly. The present disclosure also provides a method for cutting a liquid crystal panel motherboard, and a liquid crystal panel obtained from the liquid crystal motherboard.

A method of arresting propagation of an incident crack through a transparent material includes focusing pulsed laser beams into a laser beam focal line directed into the transparent material a series of locations corresponding to a predetermined pattern that is designed to arrest an incident crack that propagates through the transparent material, and generating, with the laser beam focal line (1460), an induced absorption within the transparent material in order to produce a defect (1440) in the transparent material.

A method of shaping a laminated glass structure includes providing the laminated glass structure comprising a flexible glass sheet having a thickness of no greater than about 0.3 mm laminated to a non-glass substrate by an adhesive layer. The flexible glass structure and adhesive layer are ground using a first tool to remove glass material. The non-glass substrate is cut with a second tool different from the first tool through a kerf formed through the flexible glass structure thereby forming a shaped laminated glass structure. A glass edge strength of a cut edge of the shaped laminated glass structure is at least about 20 MPa.

A method includes introducing light into a glass article such that at least a portion of the introduced light is emitted from an edge of the glass article. The light emitted from an edge of the glass article is detected. An intensity profile of the emitted light is an intensity of the emitted light as a function of axial position. A first intensity boundary of the intensity profile and a second intensity boundary of the intensity profile are determined. A thickness of a layer of the glass article is determined based on an axial distance between the first intensity boundary and the second intensity boundary.

A method of manufacturing a window may include cutting a window having a uniform thickness of about 20 m to about 100 m and polishing a cut surface of the window with a polishing pad having an elastic modulus less than an elastic modulus of the window while applying slurry to the cut surface of the window.

An apparatus for cutting laminated glass and film-covered glass includes a powered hand-held tool with a blade set including two static cutting blades and one dynamic, reciprocating cutting blade. The reciprocating cutting blade moves between the two static cutting blades which are rigidly mounted to the tool head. The left and right static cutting blades were spaced apart by about 0.250 inches, and the cutting blade had a thickness of about 0.200-0.250 inches. The clearance between the reciprocating and each static blade is between about 0.005-0.025 inches.

Methods for producing glass articles from laminated glass tubing include introducing the glass tubing to a converter. The glass tubing includes a core layer under tensile stress, an outer clad layer under, and an inner clad layer. The methods include forming a feature the glass article at a working end of the laminated glass tubing and separating a glass article from the working end of the laminated glass tubing, which may expose the core layer under tensile stress at the working end of the glass tubing. The method further comprises remediating the exposed portion of the core layer by completely enclosing the core layer in a clad layer. Systems for re-cladding the exposed portion of the core layer as well as glass articles made using the systems and methods are also disclosed.

Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.