A method produces a housing with at least one hermetically sealed receiving space for an electronic component, the receiving space including at least a part of the interior of the housing. In the method, a hollow body made of glass and having at least one opening is produced/provided, at least one electronic device is introduced through the at least one opening, and the receiving space is hermetically sealed by melting the housing, or the at least one opening is sealed by laser radiation. A device has an at least partially hermetically sealed housing made of silicon, particularly a housing produced according to the above-mentioned method.

One aspect is a heat reflective member, a laminated structure in which quartz glass layers are formed on an upper surface and a lower surface of a siliceous sintered powder layer. The heat reflective member has an impermeable layer formed at a portion of the siliceous sintered powder layer at a cut-out end portion of the heat reflective member. The impermeable layer has a thickness at least larger than half of a thickness of the siliceous sintered powder layer and through which a gas or a liquid is prevented from penetrating. A buffer layer is formed between the impermeable layer and the siliceous sintered powder layer next to the impermeable layer and spaced apart from the cut-out end portion. The buffer layer changes in density from the impermeable layer toward the siliceous sintered powder layer.

Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser that is followed by mechanical polishing with a compliant polishing wheel.

Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser to create perforations within the glass; followed by an ion exchange.

A method includes: providing a plate-like glass element having side faces and an ultrashort pulse laser having a laser beam; directing the laser beam onto one of the side faces; concentrating the laser beam by focusing optics to form an elongated focus in the glass element; producing a filament-shaped flaw in a volume of the glass element by a radiated-in energy of the laser beam, a longitudinal direction of which runs transverse to one of the side faces, and the ultrashort pulse laser radiates in a pulse or a pulse packet having at least two successive laser pulses to produce the filament-shaped flaw; widening the filament-shaped flaw to form a channel by exposing the glass element to an etching including an etching medium which removes glass at a rate of less than 8 m per hour; and introducing rounded, hemispherical depressions in a wall of the channel by the etching.

A laser apparatus and a method for manufacturing a display device are provided. A laser apparatus includes: a stage; a laser providing unit above the stage and configured to provide a laser beam; a scanner configured to adjust an optical path of the laser beam such that the laser beam is irradiated to an irradiation line formed above the stage; and a control unit to control an operation of the scanner, and the scanner includes a shutter located on an optical path of the laser beam emitted from the laser providing unit and configured to perform an opening/closing operation.

A cleaving assembly and a method for cleaving a glass body having a face at a desired angle greater than 0 degrees are disclosed. The assembly comprises a laser device for emitting a laser beam, a rotating device, and a positioning fixture. The rotating device has a head that rotates about a central axis that is orthogonal to the laser beam. The positioning fixture is operatively mounted to the head and centered axially along the central axis and is also rotatably driven by the rotating device. The positioning fixture has a tapered surface that is transverse to the central axis and that supports the glass body at a predetermined angle relative to the central axis. Rotation of the positioning fixture about the central axis when the glass body is exposed to the laser beam, cleaves the face of the glass body at the desired angle due to the glass body being supported transverse to the central axis.

A method of bleaching a glass-ceramic article is disclosed. The method includes irradiating a first portion of a bulk of the glass-ceramic article by directing a beam from a laser into a thickness of the bulk to heat the first portion and form a first aperture therein. The bulk is configured to have an amorphous silicate glass phase. a crystalline phase. and a bulk transmittance. The first aperture is configured to have a first transmittance that is greater than the bulk transmittance at first wavelengths from about 350 nm to about 2500 nm. The beam from the laser is configured to include a bleaching wavelength selected from a laser wavelength band within which residual absorption persists in the aperture after the irradiating at the bleaching wavelength.

A method for ablating a coating film, cutting glass, and performing post-treatment by using a laser according to the present invention includes coating one side or both sides of thin mother glass with a coating solution for preventing chemical contact in order to proceed with selective chemical treatment, drying the coating solution to form a coating film on one side or both sides of the thin mother glass, obtaining thin-film glasses in cell units applied to electrical and electronic products from the thin mother glass, healing a laser-cut surface of the cut thin-film glasses in cell units through selective chemical treatment of the cut thin-film glasses in cell units, cleaning the thin-film glasses in cell units, and then ablating all of a coating film formed on a surface of the thin-film glasses in cell units, and cleaning the thin-film glasses in cell units from which all of the coating film has been ablated and then chemically healing the surface of the thin-film glasses in cell units in order to eliminate defects or flaws on the surface of the thin-film glasses in cell units from which all of the coating film has been ablated.

In a method for manufacturing a glass plate that includes chamfering processing for chamfering an edge surface of a glass plate, the chamfering processing includes a step of forming a chamfered surface by irradiating the edge surface of the glass plate with a laser beam, and a step of heating the glass plate before the chamfered surface is formed. When a temperature of the glass blank at which the glass blank is heated is Tp [ C.], a glass transition point of the glass blank is Tg [ C.], and an average coefficient of linear thermal expansion of the glass blank is [1/ C.], (TgTp)5.6710.sup.7.Math.+840 is satisfied.