A method for ablating a coating film, cutting glass, and performing post-treatment by using a laser according to the present invention includes coating one side or both sides of thin mother glass with a coating solution for preventing chemical contact in order to proceed with selective chemical treatment, drying the coating solution to form a coating film on one side or both sides of the thin mother glass, obtaining thin-film glasses in cell units applied to electrical and electronic products from the thin mother glass, healing a laser-cut surface of the cut thin-film glasses in cell units through selective chemical treatment of the cut thin-film glasses in cell units, cleaning the thin-film glasses in cell units, and then ablating all of a coating film formed on a surface of the thin-film glasses in cell units, and cleaning the thin-film glasses in cell units from which all of the coating film has been ablated and then chemically healing the surface of the thin-film glasses in cell units in order to eliminate defects or flaws on the surface of the thin-film glasses in cell units from which all of the coating film has been ablated.

This application relates to a method and system for cutting a brittle body. In one aspect, the method includes preparing a brittle body having a rotary shaft. The method may also include forming a scribing line by irradiating laser on the brittle body along a preset route by using a laser irradiation unit. The method may further include cutting the brittle body by bringing a vibration unit that vibrates at a preset frequency in contact with a first region of the brittle body, which is spaced apart from the scribing line.

A method for producing a glass substrate that has a desired shape and is obtained from a glass plate, the method includes: emitting a first laser beam to the glass plate to form a scribe line over an entire thickness of the glass plate, the scribe line defining a contour line of the glass substrate having the desired shape; and performing a fusion-cutting at a position away from the scribe line on a side opposite to the desired shape and removing an unnecessary region of the glass plate along the scribe line to obtain the glass substrate having the desired shape along the contour line.

A method for cutting glass is disclosed. A glass substrate is provided, the glass substrate includes at least one cutting surface, some micro-fractures are formed on the cutting surface. A conductivity material is provided and coated on the cutting surface to form a conductivity material layer. The conductivity material layer can absorb laser energy. The conductivity material layer is irradiated by laser. The glass substrate adjoined to the cutting surface is fused to repair the micro-fractures.

A plate-like glass element including a pair of opposite side faces and at least one channel introduced into the glass of the glass element. The at least one channel joins the side faces and opens into the side faces. The at least one channel has a rounded wall and a transverse dimension of less than 100 ?m. The at least one channel extends in a longitudinal direction that runs transverse to the side faces. The rounded wall of the at least one channel has a plurality of rounded, substantially hemispherical depressions.

A method produces a structured element by material-removing machining of a workpiece with pulsed laser radiation, the workpiece consisting of a workpiece material transparent to the laser radiation, the laser radiation being radiated into the workpiece from a radiation entry side and, in an area of a rear side of the workpiece located opposite the radiation entry side, being focused within the workpiece in a focus area such that workpiece material is removed in the focus area by multi-photon absorption, and includes bringing the rear side of the workpiece, at least in a machining area currently being machined around the focus area, into contact with a free-flowing liquid transparent to the laser radiation, wherein at least some of the liquid is set to flow in a direction towards the machining area such that the liquid flows into the machining area at an acute angle of 60 or less to the rear side.

Methods of fabricating formed glass articles are described herein. In one embodiment, a method for fabricating a formed glass article may include forming a glass ribbon, forming a parison, and shaping the parison to form a glass article. The glass article may be attached to the glass ribbon at an attachment region defining an edge of the glass article. The process may also include contacting the attachment region with a focal line of a laser beam and separating the glass article from the glass ribbon at the attachment region. The attachment region may be perforated by the laser beam and the focal line may be substantially perpendicular to the plane of the glass ribbon.

A method for cutting a substrate by laser and a laser cutting device are disclosed. The method includes the following steps: engraving a plurality of intercrossed first parallel lines and second parallel lines on a substrate, in which regions for engraving a shape of sub-substrates are encircled between the first parallel lines and the second parallel lines; shaped lines are disposed in the regions; auxiliary split lines are engraved on an outside of the shaped lines; and a minimum distance from end portions of the auxiliary split lines towards the shaped lines to the shaped lines falls within the first default threshold. The method adopts the arrangement of the parallel lines and the auxiliary split lines to help splitting the substrate, and can increase stress rupture points in the process of cutting the substrate, avoid the phenomenon of rupture of the glass substrate in the cutting process, and effectively improve the yield of substrate cutting.

A glass sheet processing apparatus includes a glass sheet processing station including a laser cutting assembly that includes an optical arrangement positioned in a beam path of the laser providing a laser beam focal line that is formed on a beam output side of the optical arrangement. A glass holding conveyor belt carries a glass sheet by the laser cutting assembly so that the laser beam focal line is positioned on the glass sheet with the glass sheet on the glass holding conveyor belt. The glass holding conveyor belt is configured to carry multiple glass sheets to the laser cutting assembly for cutting the multiple glass sheets on the glass holding conveyor belt in a repeated fashion.

A method for laser processing a transparent workpiece includes forming a contour line that includes defects, by directing a pulsed laser beam output by a beam source through an aspheric optical element positioned offset in a radial direction from the beam pathway and into the transparent workpiece such that the portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece that produces a defect within the transparent workpiece. The portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength , an effective spot size w.sub.o,eff, and a non-axisymmetric beam cross section having a minimum Rayleigh range Z.sub.Rx,min in an x-direction and a minimum Rayleigh range Z.sub.Ry,min in a y-direction. Further, the smaller of Z.sub.Rx,min and Z.sub.Ry,min is greater than

[00001]$F_D.Math.\frac{.Math..Math.w_{0,\mathrm{eff}}^2}{},$

where F.sub.D is a dimensionless divergence factor comprising a value of 10 or greater.