Provided is a method of manufacturing a heterogeneous material joined body, the method comprising irradiating a surface of a glass layer with a first laser to form two or more etched lines on the surface of the glass layer; providing a resin layer on the surface of the glass layer having the two or more etched lines; and irradiating the surface of the glass layer with the resin layer with a second laser to fill the etched lines and the surface of the glass layer with the resin layer and join the resin layer and the glass layer, wherein the glass layer having the two or more etched lines is irradiated with the second laser in a direction from the glass layer to the resin layer with focus on the surface of the glass layer which is in contact with the resin layer.

A method for separating a portion from a sheet glass element having a thickness of at least 2 millimeters along an intended separation line that divides the sheet glass element into the portion and a remaining main part is provided. The method includes producing filamentary damages comprising sub-micrometer hollow channels in a volume of the glass sheet element adjacently aligned along the separation line; and heating and/or cooling the glass sheet element to cause expansion and/or contraction so that the portion detaches from the main part along the separation line. The portion and the remaining main part each remain intact as a whole. The step of producing the filamentary damages includes generating a plasma within the volume with laser pulses of an ultrashort pulse laser; and displacing points of incidence of the laser pulses over a surface of the glass sheet element along the separation line.

A glass plate, containing: a first main surface and a second main surface opposite to each other, wherein an in-plane void region having a plurality of voids is arranged on the first main surface, a plurality of internal void rows each having one void or two or more voids are arranged from the in-plane void region toward the second main surface, and a cut surface obtained by cutting the glass plate to pass through the in-plane void region and the plurality of internal void rows has a compressive stress layer formed by applying a chemical strengthening treatment in the center of the cut surface.

The present disclosure provides a laser drilling method and a laser drilling system. The laser drilling method includes a hole-boundary formation step of outputting a pulse laser beam and scanning a substrate to be drilled, to form a boundary cutting groove of a preformed hole; a material-in-hole heating step of outputting a CO.sub.2 laser beam, aligning the CO.sub.2 laser beam with the preformed hole, and heating a substrate material of the preformed hole for a predetermined period of time; and a hole formation step of cooling the substrate material of the preformed hole, to deform the substrate material and enable the substrate material to fall off from the substrate to be drilled.

A method for laser processing a transparent workpiece includes forming a contour line in the transparent workpiece and directing an infrared laser beam output by an infrared beam source through an a focal beam adjustment assembly and onto the transparent workpiece along the contour line to separate the transparent workpiece along the contour line. The infrared laser beam forms an annular infrared beam spot on a surface of the transparent workpiece. The infrared laser beam includes an entrance beam diameter upstream the afocal beam adjustment assembly and an exit beam diameter downstream the afocal beam adjustment assembly. The annular infrared beam spot includes an inner diameter, an outer diameter, and an annular thickness. Further, the focal beam adjustment assembly includes one or more adjustable optical elements. Moreover, adjusting the one or more adjustable optical elements alters the exit beam diameter, thereby altering the annular thickness of the annular infrared beam spot.

Provided is a cutting device including a machining table configured to float a workpiece having a plate shape, a laser radiation unit configured to radiate a laser beam onto the workpiece, a coolant injection unit configured to inject a coolant onto the workpiece, and a moving device configured to relatively move the workpiece with respect to the laser radiation unit and the coolant injection unit in a preset direction. In the cutting device, a scattering member configured to receive injection of the coolant from the coolant injection unit and scatter the coolant is installed at the machining table in front of the workpiece in a moving direction in which the workpiece relatively moves.

Methods and apparatus provide for sourcing a glass web, the glass web having a length and a width transverse to the length; moving the glass web from the source to a destination in a transport direction along the length of the glass web; cutting the glass web, at a cutting zone, along the length of the glass web into at least first and second glass ribbons as the glass web is moved in the transport direction from the source to the destination, such that respective first and second edge surfaces are produced on the first and second glass ribbons; and optically inspecting at least one of the first and second edge surfaces in real-time as the first and second glass ribbons of the glass web are moved in the transport direction to the destination.

A method for laser processing a transparent workpiece includes focusing a pulsed laser beam output by a pulsed laser beam source into a pulsed laser beam focal line directed into the transparent workpiece, thereby forming a pulsed laser beam spot on the transparent workpiece and producing a defect within the transparent workpiece, directing an infrared laser beam output onto the transparent workpiece to form an annular infrared beam spot that circumscribes the pulsed laser beam spot at the imaging surface and heats the transparent workpiece. Further, the method includes translating the transparent workpiece and the pulsed laser beam focal line relative to each other along a separation path and translating the transparent workpiece and the annular infrared beam spot relative to each other along the separation path synchronous with the translation of the transparent workpiece and the pulsed laser beam focal line relative to each other.

Provided is a glass film ribbon manufacturing device (1), including: a transverse conveyance unit (4), which is configured to convey a glass film ribbon (G) in a transverse direction; and a cleaving unit (5), which is arranged on a conveyance path of the transverse conveyance unit (4), and is configured to cleave the glass film ribbon (G) along a preset cleaving line extending in a longitudinal direction, the transverse conveyance unit (4) including a wrinkle-smoothing unit (14) configured to smooth a wrinkle generated in the glass film ribbon (G) before the glass film ribbon (G) is cleaved by the cleaving unit (5).

A laser beam(s) is used to cut heat strengthened (e.g., thermally tempered) glass. The heat strengthened glass may be coated in certain example embodiments, such as with a multi-layer low-emissivity (low-E) coating and/or an antireflective (AR) coating. It has been found that focusing the laser beam(s) in a tensile stress zone, in a central area of the heat strengthened glass (as opposed to in a compression stress zone), during a cutting process provides for improved cutting characteristics to avoid and/or reduce fragmenting of the glass and to provide for a clean cut edge. The wavelength emitted from the laser may be tailored based on spectral characteristics of the coating.