C03B33/091

Processing 3D shaped transparent brittle substrate

Methods are provided for laser processing arbitrary shapes of molded 3D thin transparent brittle parts from substrates with particular interest in substrates formed from strengthened or non-strengthened Corning Gorilla® glass (all codes). The developed laser methods can be tailored for manual separation of the parts from the panel or full laser separation by thermal stressing the desired profile. Methods can be used to form 3D surfaces with small radii of curvature. The method involves the utilization of an ultra-short pulse laser that may be optionally followed by a CO.sub.2 laser for fully automated separation.

Methods and apparatuses for laser processing materials

Methods of laser processing a transparent material are disclosed. The method may include positioning the transparent material on a carrier and transmitting a laser beam through the transparent material, where the laser beam may be incident on a side of the transparent material opposite the carrier. The transparent material may be substantially transparent to the laser beam and the carrier may include a support base and a laser disruption element. The laser disruption element may disrupt the laser beam transmitted through the transparent material such that the laser beam may not have sufficient intensity below the laser disruption element to damage the support base.

Method and device for separating a substrate

A method and device for separating a substrate with a laser beam. The duration of the laser beam's effect is extremely short, so the substrate is only modified concentrically about the laser beam axis (Z) without it degrading the substrate material. While the laser beam acts upon the substrate, the substrate moves relative to a laser machining head, producing plural filament-type modifications along a separating surface to be incorporated. The laser beam is initially diverted by a transmission medium having a higher intensity dependent refractive index than air, then reaches the substrate. The non-constant pulsed laser intensity increases to a maximum over the temporal course of the single pulse, then reduces, and the refractive index changes. The laser beam focus point moves between the substrate's outer surfaces along the beam axis (Z), reaching the desired modification along the beam axis (Z) without correcting the laser machining head in the z-axis.

METHODS FOR LASER PROCESSING COATED SUBSTRATES USING A TOP-HAT ENERGY DISTRIBUTION
20210387288 · 2021-12-16 ·

A method of separating a coated substrate includes directing an infrared laser beam onto a first surface of the coated substrate. The coated substrate includes a coating layer disposed on a transparent workpiece, a plurality of defects is disposed within the coated substrate along a contour line that divides a primary region from a dummy region of the coated substrate from a dummy region of the coated substrate. The method also includes translating at least one of the coated substrate and the infrared laser beam relative to each other such that an infrared beam spot traces an oscillating pathway that follows an offset line in a translation direction and oscillates between an inner and outer track line, the oscillating pathway is disposed on the dummy region of the coated substrate, and the infrared laser beam applies thermal energy to the plurality of defects to induce separation of the coated substrate.

LASER PROCESSING SYSTEM AND METHOD FOR GLASS WORKPIECE

A laser processing system for a glass workpiece comprises a frame with a first laser module thereon, a modifying device, and a blanking device. The blanking device comprises a second laser module, a hollow support element, a clamping module disposed on the frame, a heater disposed on the hollow support element, and a cooler connected to the clamping module. A method adapted to the system comprises a modifying process, a determining process, and a blanking process. In the modifying process, a first laser beam is irradiated to the glass workpiece along a processing contour line to intermittently modify the glass workpiece. According to the determining process, the blanking process is processed to have a crack being generated in a modified portion of the glass workpiece, wherein the crack divides the glass workpiece into an outer area and an inner area, and changes a temperature of the glass workpiece to have the glass workpiece being deformed, so that the outer area and the inner area are separated.

METHODS FOR LASER PROCESSING TRANSPARENT WORKPIECES USING MODIFIED PULSE BURST PROFILES

A method of laser processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece. The pulsed laser beam includes pulse bursts having 2 sub-pulses per pulse burst or more, each pulse burst of the pulsed laser beam has a burst duration T.sub.bd of 380 ns or greater; and the pulsed laser beam forms a pulsed laser beam focal line in the transparent workpiece, the pulsed laser beam focal line inducing absorption in the transparent workpiece, the induced absorption producing a defect in the transparent workpiece. The pulsed laser beam focal line includes a wavelength λ, a spot size w.sub.o, and a Rayleigh range Z.sub.R that is greater than

[00001] F D π w o 2 λ ,

where F.sub.D is a dimensionless divergence factor comprising a value of 10 or greater.

Glass roll production method

A manufacturing method for a glass roll includes cutting a glass ribbon along a longitudinal direction thereof in a cutting region on a conveyance path while conveying the glass ribbon, and taking up the cut glass ribbon around a roll core at a downstream end of the conveyance path. A conveyance-mode changeable region is provided between the cutting region and the downstream end of the conveyance path. The conveyance-mode changeable region enables a change in conveyance mode between a first mode of conveying the glass ribbon in a tensioned state and a second mode of conveying the glass ribbon in a loosened state. After the leading end portion of the glass ribbon is wound around the roll core in the first conveyance mode, the conveyance mode is shifted from the first conveyance mode to the second conveyance mode.

METHOD FOR TREATMENT OF A GLASS SUBSTRATE WITH IMPROVED EDGE STRENGTH
20210371327 · 2021-12-02 ·

A filamentation process uses ultrafast laser pulses to form a line of filaments or perforations in a glass material in sheet form. The glass material is then cleaved using mechanical or thermal stress to form a glass substrate with a planar doughnut shape having an inner circular edge and an outer circular edge. The inner and outer edges may exhibit filamentary damage from the filamentation process, including microcracks and pillar shaped funnels along an entire length of the edge. The inner and/or outer edges may then be treated by polishing only, by etching only, or by etching and polishing to remove a portion of the filamentary damage to improve the strength of the edges. The resulting glass substrate may be used in a magnetic medium for a magnetic recording device, wherein it provides an edge strength sufficient to withstand high force shocks to the device.

Method and device for the laser-based machining of sheet-like substrates

A method for the laser-based machining of a sheet-like substrate, in order to separate the substrate into multiple portions, in which the laser beam of a laser for machining the substrate is directed onto the latter, is characterized in that, with an optical arrangement positioned in the path of rays of the laser, an extended laser beam focal line, seen along the direction of the beam, is formed on the beam output side of the optical arrangement from the laser beam directed onto the latter, the substrate being positioned in relation to the laser beam focal line such that an induced absorption is produced in the material of the substrate in the interior of the substrate along an extended portion, seen in the direction of the beam, of the laser beam focal line, such that a material modification takes place in the material of the substrate along this extended portion.

APPARATUS FOR PROCESSING GLASS LAMINATE SUBSTRATE AND PROCESSING AND CUTTING METHODS USING THE SAME

A method of processing a glass laminate substrate includes carrying a glass laminate substrate including a glass substrate on a metal substrate to a processing location; radiating a laser onto the metal substrate through the glass substrate; and cooling a portion of the glass substrate, through which the laser is radiated, such that the glass substrate is cut at the portion through which the laser is radiated. When methods of processing and cutting a glass laminate substrate and an apparatus for processing a glass laminate substrate, according to embodiments, are used, a glass laminate substrate having high edge strength after cutting may be produced.