A method of scribing a graphic on a material is provided, in which laser output is applied to the material. The laser output is moved relative to the material at a high speed greater than 10 m per second, and at a high power greater than 500 W, to scribe a graphic on a surface of the material. Also provided is a system for scribing a graphic on a material. The method and system of the invention are especially useful in the scribing of building materials.

A method includes forming a plurality of voids within a substrate along a dicing path by exposing the substrate to a first burst of laser pulses at a first location along the dicing path of a respective waveguide combiner. The substrate has a plurality of waveguides. Each laser pulse within the first burst forms a respective void within a first column at the first location to form the plurality of voids. The method further includes exposing the substrate to a second burst of laser pulses at a second location along the dicing path of the respective waveguide combiner. Each laser pulse within the second burst forms the respective void within a second column at the second location to form the plurality of voids. The first column and the second column are spaced by a pitch between a center of the first column and the second column along the dicing path.

A disk-shaped glass plate includes a pair of main surfaces, and an outer circumferential edge surface. A thickness of the glass plate is not larger than 0.6 mm. The outer circumferential edge surface has a circular shape. The outer circumferential edge surface includes a plurality of portions each of which has a blemish, melting, degradation, or alteration. The plurality of portions are formed such that a predetermined space is formed between adjacent portions of the plurality of portions along a circumferential direction. The outer circumferential edge surface has a roundness not larger than 15 m.

A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.

Systems and methods utilizing two Airy beams to process a non-rounded edge of a glass substrate or to cleave a glass substrate are disclosed. The method includes generating first and second Airy beams and causing them to cross at a crossing to define a curved intensity profile in the vicinity of the crossing point where the first and second Airy beams have respective local radii of curvature RA and RB. The method also includes scanning the curved intensity profile either along the non-rounded outer edge or through the glass along a scan path to form on the glass substrate a rounded outer edge having a radius of curvature RE that is smaller than the first and second local radii of curvature RA and RB. The radius of curvature RE can be adjusted by changing a beam angle between the first and second Airy beams.

Thin glass in cell unit (4) manufactured by glass cutting and post-processing methods according to the present invention is the thin glass in cell unit (4) installed on the front surface of an electronic device or a display unit of an electronic device, wherein a bevel-shaped cut portion (41) is formed at an end of one side of the thin glass in cell unit (4) in contact with the front surface of the display unit. In addition, the bevel-shaped cut portion (41) has a height (H) of 5% or more and 50% or less of a thickness of the thin glass in cell unit (4). In addition, the bevel-shaped cut portion (41) has a width (W) of 10% or more and 300% or less of the thickness of the thin glass in cell unit (4), and the thin glass in cell unit (4) is bent toward the front of the display unit.

A method and apparatus is provided for producing a hollow glass body product including a hollow glass body having an outer surface with a first end portion and a second end portion, the first end portion being sealed by a first bottom and the second end portion being sealed by a second bottom. A plurality of spaced apart filamentary defects are provided in the outer surface and at least part of the filamentary defects form open passages connecting an interior of the hollow glass body to the outer surface thereof. Each individual passage has a diameter in the micrometer range between more than 0 micrometers and less than 50 micrometers. A plurality of the micrometer range-sized open passages provides a total cross-sectional area sufficiently large for venting and/or pressure equalization.

A method for producing a hollow glass body product includes: providing a hollow glass body having an outer surface; forming the hollow glass body product so as to have a first end portion and a second end portion, the first end portion being sealed by a first bottom and the second end portion being sealed by a second bottom; and laser-based irradiating of the hollow glass body with focused laser radiation to produce a plurality of spaced apart filamentary defects in a predetermined arrangement pattern in the outer surface of at least the first end portion, thereby generating a plurality of open passages connecting an interior of the hollow glass body to the outer surface thereof by at least part of the filamentary defects. A diameter of the passages is sized to be less than 50 micrometers and a plurality of the open passages provide gaseous communication to the interior.

A process includes directing a laser beam at a glass strip so it traverses a line in a drawing direction of the horizontally moving glass strip. A point of incidence of the laser beam is chosen so the line forms an envisaged dividing line between a useful region and a thickened edge region and the point of incidence on the glass is at a position where a temperature of the glass is within a range between an upper viscosity of 10.sup.10 dPas and a lower viscosity of 10.sup.15 dPas. The laser beam photothermally processes the glass strip so a gap is formed along the line between the useful region and the thickened edge region to obtain a glass strip with a homogeneous glass thickness and a new edge parallel to the drawing direction and a separated thickened edge region. The glass strip with homogeneous thickness is cooled after separation.

The invention relates to a device for focusing a photon beam into a material. The device comprises: means for splitting the photon beam into a plurality of component beams; means for focusing the component beams at a predetermined focal depth within the material; and means for adapting the wavefronts of the component beams based at least in part on the focal depth.