A composition for a glass material comprising, on an oxide basis: one or more network formers chosen from the group of silicon dioxide (SiO.sub.2) and phosphorous pentoxide (P.sub.2O.sub.5); one or more alkali metal oxides chose from the group consisting of lithium oxide (Li2O) and sodium oxide (Na.sub.2O); 8 to 15 percent by weight zirconium oxide (ZrO.sub.2); and one transition metal oxide consisting of 9 to 45 percent by weight niobium pentoxide (Nb.sub.2O.sub.5). In an embodiment, the composition consists of: 35 to 60 percent by weight silicon dioxide (SiO.sub.2); 9.25 to 15.0 percent by weight lithium oxide (Li.sub.2O); 0.5 to 2 percent by weight sodium oxide (Na.sub.2O); 8 to 15 percent by weight zirconium oxide (ZrO.sub.2); 0 to 3.5 percent by weight phosphorous pentoxide (P.sub.2O.sub.5); and 9 to 45 percent by weight niobium pentoxide (Nb.sub.2O.sub.5). In an embodiment, the glass material is a light guide for an augmented reality device.

A dielectric tape suitable for use in an electronic device is provided. A dielectric slip composition comprises an organic vehicle and a dielectric glass composition comprising at least about 20 wt % and no more than about 50 wt % silicon dioxide, based upon 100% total weight of the glass composition, at least about 10 wt % and no more than about 50 wt % alkali metal oxides, based upon 100% total weight of the glass composition, and at least about 1 wt % and no more than about 10 wt % of at least one transition metal oxide. A method of forming an electronic device is also provided. The method includes the steps of applying at least one dielectric tape to at least one non-planar surface of a substrate, and subjecting the at least one dielectric tape to one or more thermal treatment steps to form a dielectric layer.

A dielectric tape suitable for use in an electronic device is provided. A dielectric slip composition comprises an organic vehicle and a dielectric glass composition comprising at least about 20 wt % and no more than about 50 wt % silicon dioxide, based upon 100% total weight of the glass composition, at least about 10 wt % and no more than about 50 wt % alkali metal oxides, based upon 100% total weight of the glass composition, and at least about 1 wt % and no more than about 10 wt % of at least one transition metal oxide. A method of forming an electronic device is also provided. The method includes the steps of applying at least one dielectric tape to at least one non-planar surface of a substrate, and subjecting the at least one dielectric tape to one or more thermal treatment steps to form a dielectric layer.

Disclosed is a sealing glass composition substantially not containing B.sub.2O.sub.3 or Al.sub.2O.sub.3, which is a high-strength, high-expansive crystallizing glass composition that can be used at high temperatures of not less than 950° C. The composition substantially not containing boron oxide, alkali metal oxides or aluminum oxide, but containing, in mol %, SiO.sub.2: 40-55, BaO: 18-35, TiO.sub.2+ZrO.sub.2: 0.1-10, ZnO: 0-15, CaO: 0-20, MgO: 0-9, SrO: 0-5, and La.sub.2O.sub.3: 0-2, wherein the total content of RO (R: Mg, Ca, Sr, Ba and Zn) is at least 44 mol %, and wherein the glass composition, when fired in the form of glass powder at a temperature of 850-1050° C, turns into a crystallized glass that exhibits a thermal expansion coefficient of 90-150×10.sup.−7/° C. in the range of 50-850° C.

Disclosed is a sealing glass composition substantially not containing B.sub.2O.sub.3 or Al.sub.2O.sub.3, which is a high-strength, high-expansive crystallizing glass composition that can be used at high temperatures of not less than 950° C. The composition substantially not containing boron oxide, alkali metal oxides or aluminum oxide, but containing, in mol %, SiO.sub.2: 40-55, BaO: 18-35, TiO.sub.2+ZrO.sub.2: 0.1-10, ZnO: 0-15, CaO: 0-20, MgO: 0-9, SrO: 0-5, and La.sub.2O.sub.3: 0-2, wherein the total content of RO (R: Mg, Ca, Sr, Ba and Zn) is at least 44 mol %, and wherein the glass composition, when fired in the form of glass powder at a temperature of 850-1050° C, turns into a crystallized glass that exhibits a thermal expansion coefficient of 90-150×10.sup.−7/° C. in the range of 50-850° C.

According to at least one embodiment a glass comprises: a refractive index N of greater than 1.65 at a wavelength λ, where λ=587.6 nm; a glass density of not more than 4.2 g/cm.sup.3; Abbe number V.sub.d greater than 30; the glass comprising greater than 0.03 wt % of rare earth oxide with an atomic number of 58 or higher.

According to at least one embodiment a glass comprises: a refractive index N of greater than 1.65 at a wavelength λ, where λ=587.6 nm; a glass density of not more than 4.2 g/cm.sup.3; Abbe number V.sub.d greater than 30; the glass comprising greater than 0.03 wt % of rare earth oxide with an atomic number of 58 or higher.

A glass material is provided, which has a composition of M.sub.2O—ZnO-M′.sub.20.sub.3—Bi.sub.2O.sub.3—SiO.sub.2, wherein M is Li, Na, K, or a combination thereof, and M′ is B, Al, or a combination thereof. A fluorescent composite material can be composed of the glass material and a phosphor material. The fluorescent composite material may collocate with an excitation light source to provide a light-emitting device.

A glass material is provided, which has a composition of M.sub.2O—ZnO-M′.sub.20.sub.3—Bi.sub.2O.sub.3—SiO.sub.2, wherein M is Li, Na, K, or a combination thereof, and M′ is B, Al, or a combination thereof. A fluorescent composite material can be composed of the glass material and a phosphor material. The fluorescent composite material may collocate with an excitation light source to provide a light-emitting device.

A method is described for assembling at least two parts made of silicon carbide based materials by non-reactive brazing in an oxidizing atmosphere, each of the parts comprising a surface to be assembled, wherein the parts are placed in contact with a non-reactive brazing composition, the assembly formed by the parts and the brazing composition is heated to a brazing temperature sufficient for completely or at least partially melting the brazing composition, or rendering the brazing composition viscous, and the parts and the brazing composition are cooled so as to form, after cooling the latter to ambient temperature, a moderately refractory joint. The non-reactive brazing composition is a composition A consisting of silica (SiO.sub.2), alumina (Al.sub.2O.sub.3), and calcium oxide (CaO), or a composition B consisting of alumina (Al.sub.2O.sub.3), calcium oxide (CaO), and magnesium oxide (MgO), and, before heating the assembly formed by the parts and the brazing composition to the brazing temperature, a supply of silicon in a non-oxidized form is carried out on the surfaces to be assembled of the parts to be assembled, and/or on the surface layers comprising the surfaces to be assembled of the parts to be assembled, and/or in the brazing composition.